Microchip Technology - WBZ451PE-I

XC7Z045-1FFG676I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 676 terminals in a grid array package, it's ideal for various applications requiring high-performance processing capabilities.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 14; Package Code: HVSON; Package Shape: RECTANGULAR;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 484; Package Code: LFBGA; Package Shape: SQUARE; Surface Mount: YES;

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 625; Package Code: BGA; Package Shape: RECTANGULAR;

TMS320DM368ZCED48F by Texas Instruments is a 32-bit microprocessor with 338 terminals, operating at -40 to 85°C. It features a max supply voltage of 1.42V and supports I2C, SPI, UART, and USB buses. Ideal for industrial applications requiring a low-profile package with fine pitch grid array style.

PSoC;

ESP32-S3-WROOM-1U-N16R2 by Espressif Systems is a 41-terminal SoC with CMOS technology. It operates b/w -40 to 85°C, with supply voltage range of 3-3.6V. Ideal for IoT applications due to its compact size and surface mount capability.

SE051C2HQ1/Z01XDZ by NXP Semiconductors is a cryptographic authenticator IC with 20 terminals, operating voltage range of 1.62V to 3.6V, and temperature range from -40°C to 105°C. It features a square chip carrier package style suitable for surface mount applications in various electronic devices.

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; JESD-30 Code: S-PQCC-N32;

SoC FPGA; Terminal Form: BALL; No. of Terminals: 288; Package Code: TFBGA; Package Shape: SQUARE; Technology: CMOS;

MICROPROCESSOR CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 176; Package Code: HQFP; Package Shape: UNSPECIFIED; Package Style (Meter): FLATPACK, HEAT SINK/SLUG;

Microchip ATECC608B-MAHDA-S is a cryptographic authenticator IC with I2C bus compatibility. It operates b/w -40 to 85 °C, supports 2-5.5 V supply voltage range, and comes in a small outline package suitable for industrial applications.

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: QCCN; Package Shape: SQUARE;

CP2108-B02-GM by Silicon Labs is a 64-terminal microprocessor circuit with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 3-3.6 V, making it ideal for industrial applications requiring high performance in a compact square package. With surface mount capability and a low seated height of 0.9 mm, this chip carrier suits space-constrained designs.

MICROPROCESSOR CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: HTFQFP; Package Shape: SQUARE; Package Equivalence Code: TQFP128,.63SQ,16;

Other uPs/uCs/Peripheral ICs; Terminal Finish: MATTE TIN; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; JESD-609 Code: e3;

AX8052F143-3-TX30 by Onsemi is a 40-terminal System on Chip with CMOS technology. It operates b/w -40 to 85°C, with supply voltage ranging from 1.8V to 3.6V. Ideal for industrial applications requiring a compact, low-profile chip carrier package style.