Silicon Labs - EFR32MG12P433F1024GM68-C

SoC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Qualification: Not Qualified;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;

SoC; Terminal Form: NO LEAD; No. of Terminals: 41; Package Code: XMA; Package Shape: RECTANGULAR; Package Style (Meter): MICROELECTRONIC ASSEMBLY;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LFBGA; Package Shape: SQUARE;

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

NRF52810-QFAA-R7 by Nordic Semiconductor Asa is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 85 °C and supports supply voltage range of 1.7V to 3.6V. Ideal for industrial applications requiring low-profile, square-shaped chips with 48 terminals in a QUAD position.

NXP Semiconductors' MIMXRT1021CAF4A SoC offers peak reflow temp of 260°C, industrial grade temp, and 40s at peak reflow. Ideal for Other Function uPs & uCs applications due to its high performance and reliability in industrial settings.

XC7Z030-2FBG484E by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 484 terminals in a square grid array shape, suitable for various applications requiring high-performance processing capabilities.

AM4376BZDND100 by Texas Instruments is a System on Chip with 491 terminals in a low profile, fine pitch grid array package. It operates b/w -40 to 90°C, with supply voltage ranging from 1.272V to 1.378V. Ideal for industrial applications requiring high performance and compact design.

XC7Z035-3FFG900E by Xilinx is a 900-terminal programmable SoC with CMOS technology. Operating at 0-100°C, it has a supply voltage range of 0.95-1.05 V and terminal pitch of 1 mm. Ideal for applications requiring high-performance computing in compact spaces.

SoC; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE; Length: 14 mm;

PSoC; Temperature Grade: INDUSTRIAL; Qualification: Not Qualified; Terminal Finish: NICKEL PALLADIUM GOLD; Moisture Sensitivity Level (MSL): 3; ROM Bits Size: 524288 Bits;

CY8CMBR3116-LQXIT by Infineon is a 24-terminal IC with max supply voltage of 1.89V and operating temp up to 85°C. Ideal for industrial applications, this CMOS technology-based microprocessor circuit features a square package style and no-lead terminal form.

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; Terminal Position: BOTTOM;

SoC; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE; Length: 14 mm;

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 112; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; JESD-609 Code: e1;

XC7Z020-L1CLG484I by Xilinx is a CMOS technology System on Chip (SoC) with 484 terminals. It operates at a voltage range of 0.95V to 1.05V and has a max seated height of 1.6mm. This versatile IC is commonly used in various applications requiring low profile, fine pitch grid array packages.