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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | WL1801MODGBMOCT |
| Description | TELECOM CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: BUTT; No. of Terminals: 100; Package Code: LGA; Package Shape: RECTANGULAR; |
| Datasheet | WL1801MODGBMOCT Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.7 V |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 2 mm |
| Sub-Category: | Other Telecom ICs |
| Surface Mount: | YES |
| Terminal Finish: | NICKEL PALLADIUM GOLD |
| No. of Terminals: | 100 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Data Rate: | 100 Mbps |
| JESD-30 Code: | R-PBGA-B100 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BUTT |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | LGA |
| Width: | 13.3 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Telecom IC Type: | TELECOM CIRCUIT |
| JESD-609 Code: | e4 |
| Minimum Operating Temperature: | -20 Cel |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | LGA100(UNSPEC) |
| Length: | 13.4 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .7 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 2.9/4.8 |
