Other Function Telecom Interface ICs
| Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N32 |
2 |
1 mm |
5 mm |
e4 |
30 |
260 |
5 mm |
|||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
Not Qualified |
e4 |
30 |
260 |
7 mm |
||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
.25 Mbps |
S-XQCC-N48 |
3 |
.9 mm |
7 mm |
Not Qualified |
e4 |
30 |
260 |
7 mm |
|||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
1 |
70 Cel |
-25 Cel |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
GULL WING |
28 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3 V |
3 |
SMALL OUTLINE, SHRINK PITCH |
SSOP28,.3 |
Other Telecom ICs |
.65 mm |
85 Cel |
-30 Cel |
DUAL |
.0096 Mbps |
R-PDSO-G28 |
2 mm |
5.3 mm |
Not Qualified |
10.2 mm |
||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.045 mA |
5 V |
5 |
SMALL OUTLINE |
SOP16,.25 |
Other Telecom ICs |
1.27 mm |
40 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
9.9 mm |
||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
19 |
DIE |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
44 mA |
3.3 V |
UNCASED CHIP |
100 Cel |
-40 Cel |
UPPER |
11300 Mbps |
R-XUUC-N19 |
Not Qualified |
Data rate is 11.3 Gbps |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N16 |
1 mm |
3 mm |
3 mm |
||||||||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
HVFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
TTL |
2.5 V |
2.5 |
FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
2500 Mbps |
S-PQFP-G64 |
3 |
1 mm |
10 mm |
Not Qualified |
e4 |
30 |
260 |
10 mm |
||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
12 V |
12 |
SMALL OUTLINE |
SOP16,.25 |
Telephone Circuits |
1.27 mm |
85 Cel |
-40 Cel |
DUAL |
R-PDSO-G16 |
1.75 mm |
3.9 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
9.9 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
INDUSTRIAL |
NO LEAD |
24 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5 V |
5 |
CHIP CARRIER |
LCC24,.16SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
QUAD |
S-PQCC-N24 |
Not Qualified |
|||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
3.75 V |
3.75 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP48,.35SQ |
Other Telecom ICs |
.5 mm |
85 Cel |
-30 Cel |
QUAD |
S-PQFP-G48 |
1.2 mm |
7 mm |
Not Qualified |
NOT SPECIFIED |
NOT SPECIFIED |
7 mm |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP48,.35SQ |
Other Telecom ICs |
.5 mm |
70 Cel |
0 Cel |
TIN LEAD |
QUAD |
S-PQFP-G48 |
1.2 mm |
7 mm |
Not Qualified |
e0 |
7 mm |
||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
48 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
1.1,1.8,3.3 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
TQFP48,.35SQ |
Network Interfaces |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
100 Mbps |
S-PQFP-G48 |
3 |
1.2 mm |
7 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
7 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
DIE OR CHIP |
Other Telecom ICs |
85 Cel |
-40 Cel |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
THROUGH-HOLE |
28 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
NO |
1 |
BICMOS |
5 V |
IN-LINE |
2.54 mm |
70 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDIP-T28 |
5.08 mm |
15.24 mm |
Not Qualified |
e4 |
36.32 mm |
|||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
1 |
85 Cel |
-25 Cel |
NOT SPECIFIED |
NOT SPECIFIED |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
BALL |
28 |
VFBGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
125 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B28 |
1 |
.5 mm |
1.88 mm |
e1 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
INDUSTRIAL |
NO LEAD |
24 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
5 V |
5 |
CHIP CARRIER |
LCC24,.16SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N24 |
2 |
Not Qualified |
e4 |
30 |
260 |
|||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
160 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
5 V |
FLATPACK |
.65 mm |
70 Cel |
0 Cel |
QUAD |
S-PQFP-G160 |
4.1 mm |
28 mm |
28 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
GULL WING |
28 |
TSSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
3.3 V |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
.65 mm |
85 Cel |
-25 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
2 |
1.2 mm |
4.4 mm |
Not Qualified |
e4 |
30 |
260 |
9.7 mm |
||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100 |
1.8 V |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
1.2 mm |
20 mm |
Not Qualified |
e4 |
30 |
260 |
20 mm |
||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
GULL WING |
16 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.26 mA |
5 V |
5 |
SMALL OUTLINE |
SOP16,.25 |
Other Telecom ICs |
1.27 mm |
40 Cel |
0 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G16 |
1 |
1.75 mm |
3.9 mm |
Not Qualified |
e4 |
30 |
260 |
9.9 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
UNCASED CHIP |
85 Cel |
-40 Cel |
UPPER |
X-XUUC-N |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
25 |
VFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.4 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B25 |
1 |
.625 mm |
2.086 mm |
e1 |
30 |
260 |
2.086 mm |
||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
289 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2.5 V |
2.5 |
GRID ARRAY |
BGA289,17X17,40 |
Other Telecom ICs |
1 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B289 |
3 |
2 mm |
19 mm |
Not Qualified |
e0 |
20 |
220 |
19 mm |
|||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
100 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
30 |
260 |
3 mm |
|||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
5 V |
SMALL OUTLINE |
1.27 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
R-PDSO-G28 |
2 |
2.65 mm |
7.5 mm |
Not Qualified |
e4 |
30 |
260 |
17.9 mm |
||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
RECTANGULAR |
1 |
85 Cel |
-40 Cel |
R-XXSS-X |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
COMMERCIAL |
THROUGH-HOLE |
16 |
DIP |
RECTANGULAR |
CERAMIC |
NO |
MOS |
-5 V |
5 V |
+-5 |
IN-LINE |
DIP16,.3 |
Other Telecom ICs |
2.54 mm |
70 Cel |
0 Cel |
DUAL |
R-XDIP-T16 |
T-1(DS1) |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1 |
3.3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
DUAL |
S-PDSO-N8 |
1 |
.8 mm |
2 mm |
e4 |
30 |
260 |
2 mm |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
OTHER |
1 |
50 Cel |
-25 Cel |
1 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
DIE |
UNSPECIFIED |
UNSPECIFIED |
YES |
1 |
UNCASED CHIP |
85 Cel |
-40 Cel |
UPPER |
X-XUUC-N |
|||||||||||||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
40 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC40,.24SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
5 Mbps |
S-PQCC-N40 |
3 |
1 mm |
6 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
6 mm |
|||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
60 |
VQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
-5 V |
5 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
70 Cel |
0 Cel |
QUAD |
S-XQCC-N60 |
.8 mm |
9 mm |
9 mm |
|||||||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
10 |
HVSON |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
BIPOLAR |
.015 mA |
5 V |
3/5 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SOLCC10,.11,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N10 |
3 |
.8 mm |
3 mm |
Not Qualified |
e3 |
30 |
260 |
3 mm |
||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
UNSPECIFIED |
UNSPECIFIED |
1 |
|||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
16 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
.067 mA |
3.3 V |
3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC16,.12SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
6250 Mbps |
S-PQCC-N16 |
2 |
1 mm |
3 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
3 mm |
||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
16 |
VFBGA |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.6 V |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-XBGA-B16 |
1 |
.625 mm |
2.3 mm |
Not Qualified |
e1 |
NOT SPECIFIED |
260 |
2.3 mm |
|||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
64 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
5000 Mbps |
S-PQCC-N64 |
3 |
1 mm |
9 mm |
2 V |
e4 |
30 |
260 |
9 mm |
||||||||||||||||||||||||||||||||||||
|
|
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
60 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
-5 V |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
70 Cel |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N60 |
2 |
.8 mm |
9 mm |
e3 |
30 |
260 |
9 mm |
|||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
1 |
3 V |
70 Cel |
0 Cel |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
BICMOS |
SMALL OUTLINE |
DUAL |
R-PDSO-G28 |
Not Qualified |
||||||||||||||||||||||||||||||||||||||||||||||||||
|
Texas Instruments |
TELECOM CIRCUIT |
GULL WING |
28 |
SOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
SMALL OUTLINE |
1.27 mm |
DUAL |
R-PDSO-G28 |
2.65 mm |
7.52 mm |
Not Qualified |
17.91 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.