Other Function Telecom Interface ICs
| Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | Applications | Surface Mount | No. of Functions | Output Code | No. of Channels | Technology | Screening Level | Nominal Negative Supply Voltage | No. of Transceivers | Maximum Supply Current | Nominal Supply Voltage | Hybrid | Input Code | Power Supplies (V) | ISDN Access Rate | Package Style (Meter) | Package Equivalence Code | Sub-Category | Carrier Type-3 | Terminal Pitch | Maximum Operating Temperature | Resolution (um) | Battery Supply (V) | Minimum Output High Voltage | Maximum Output Low Voltage | Standard | Minimum Operating Temperature | Maximum Gain Tolerance | Terminal Finish | Maximum Output Voltage | Terminal Position | Data Rate | JESD-30 Code | Reference Point | Output (V) | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Linear Coding | Carrier Type-2 | Carrier Type-1 | Width | Qualification | Maximum Output Low Current | Companding Law | Input Type | Additional Features | Battery Feed | Maximum Analog Input | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length | Filter |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Qorvo |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
34 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1 mm |
85 Cel |
-40 Cel |
DUAL |
6.8 Mbps |
R-XDMA-N34 |
3.4 mm |
19.13 mm |
26.12 mm |
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|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
24 |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
AEC-Q100; TS 16949 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N24 |
4 |
2.6 mm |
12.2 mm |
16 mm |
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|
Silicon Labs |
TELECOM CIRCUIT |
NO LEAD |
31 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
1.2 mm |
105 Cel |
-40 Cel |
UNSPECIFIED |
2 Mbps |
R-XXMA-N31 |
2.4 mm |
12.9 mm |
15 mm |
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|
|
Simcom Wireless Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
QMA |
SQUARE |
UNSPECIFIED |
YES |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
.0856 Mbps |
S-XQMA-N68 |
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|
Fanstel |
TELECOM CIRCUIT |
NO LEAD |
61 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
2 Mbps |
R-XXMA-N61 |
14 mm |
20.8 mm |
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|
|
NXP Semiconductors |
OTHER |
NO LEAD |
32 |
QCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1.8/3.3,2.5/3.3 |
CHIP CARRIER |
LCC32,.2SQ,20 |
Other Telecom ICs |
.5 mm |
85 Cel |
-30 Cel |
QUAD |
S-PQCC-N32 |
1 |
Not Qualified |
260 |
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|
|
Semtech |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.65 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-XQCC-N28 |
1 |
1 mm |
6 mm |
e3 |
30 |
260 |
6 mm |
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|
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
47 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
2 Mbps |
R-XXMA-N47 |
1.35 mm |
6.4 mm |
8.65 mm |
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|
|
STMicroelectronics |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
11 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.27 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N11 |
2.2 mm |
11.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
13.5 mm |
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|
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
54 |
LGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
AEC-Q100 |
3 V |
GRID ARRAY |
1.1 mm |
85 Cel |
-40 Cel |
BOTTOM |
R-XBGA-N54 |
2.6 mm |
17 mm |
22 mm |
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|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
100 |
LGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.7 V |
2.9/4.8 |
GRID ARRAY |
LGA100(UNSPEC) |
Other Telecom ICs |
.7 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
100 Mbps |
R-PBGA-B100 |
3 |
2 mm |
13.3 mm |
Not Qualified |
e4 |
30 |
260 |
13.4 mm |
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|
|
Silicon Labs |
TELECOM CIRCUIT |
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|
|
Infineon Technologies |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
16 |
VBCC |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
CHIP CARRIER, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
TIN |
BOTTOM |
S-PBCC-B16 |
1 |
.77 mm |
2.4 mm |
e3 |
2.4 mm |
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|
|
Digi International |
TELECOM CIRCUIT |
INDUSTRIAL |
THROUGH-HOLE |
20 |
UNSPECIFIED |
UNSPECIFIED |
NO |
1 |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
DUAL |
X-XDMA-T20 |
NOT SPECIFIED |
NOT SPECIFIED |
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|
|
Infineon Technologies |
TELECOM CIRCUIT |
GOLD |
1 |
e4 |
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|
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
8 |
HVSON |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-XDSO-N8 |
1 |
1 mm |
2 mm |
Not Qualified |
e3 |
260 |
3 mm |
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|
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
31 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.2 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N31 |
2.1 mm |
12.9 mm |
15 mm |
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|
|
Digi International |
SERIAL DEVICE SERVER |
NO LEAD |
XMA |
RECTANGULAR |
UNSPECIFIED |
NO |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
100 Mbps |
R-XXMA-N |
18.67 mm |
19.05 mm |
36.7 mm |
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|
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
31 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.5 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
R-XXMA-N31 |
2.6 mm |
14 mm |
NOT SPECIFIED |
NOT SPECIFIED |
25.6 mm |
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|
|
U-blox Ag |
4 |
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|
|
Simcom Wireless Solutions |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
QMA |
SQUARE |
UNSPECIFIED |
YES |
1 |
3.8 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
QUAD |
.375 Mbps |
S-XQMA-N68 |
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|
|
Analog Devices |
TELECOM CIRCUIT |
INDUSTRIAL |
BALL |
144 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
1.3 V |
GRID ARRAY, LOW PROFILE, FINE PITCH |
.8 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B144 |
3 |
1.7 mm |
10 mm |
30 |
260 |
10 mm |
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|
Espressif Systems (Shanghai) |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
YES |
1 |
CMOS |
3.3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,20SQ,14 |
.35 mm |
105 Cel |
-40 Cel |
QUAD |
150 Mbps |
S-XQCC-N48 |
.9 mm |
5 mm |
5 mm |
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|
|
Microchip Technology |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
24 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
MODULE,24LEAD(UNSPEC) |
1.2 mm |
85 Cel |
-30 Cel |
UNSPECIFIED |
1 Mbps |
R-XXMA-N24 |
2.38 mm |
11.5 mm |
Bluetooth Module |
NOT SPECIFIED |
NOT SPECIFIED |
19.5 mm |
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|
|
NXP Semiconductors |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
5 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-25 Cel |
QUAD |
S-PQCC-N32 |
1 |
1 mm |
5 mm |
30 |
260 |
5 mm |
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|
|
Semtech |
TELECOM CIRCUIT |
MATTE TIN |
1 |
e3 |
260 |
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|
|
STMicroelectronics |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
6 |
LGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
1.8 V |
GRID ARRAY |
85 Cel |
-30 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
R-XBGA-N6 |
3 |
1.35 mm |
3.76 mm |
e4 |
260 |
4.72 mm |
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|
|
Silicon Labs |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
31 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
CMOS |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.5 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
3 Mbps |
R-XXMA-N31 |
2.6 mm |
14 mm |
25 mm |
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|
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
33 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
TS 16949 |
3 V |
MICROELECTRONIC ASSEMBLY |
MODULE,33LEAD(UNSPEC) |
1.1 mm |
85 Cel |
-40 Cel |
Nickel/Gold (Ni/Au) |
UNSPECIFIED |
.0086 Mbps |
R-XXMA-N33 |
2.46 mm |
12 mm |
e4 |
22 mm |
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|
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
BUTT |
51 |
TFLGA |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100 |
3 V |
GRID ARRAY, THIN PROFILE, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-XBGA-B51 |
3 |
1.165 mm |
4.5 mm |
NOT SPECIFIED |
NOT SPECIFIED |
4.5 mm |
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|
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
52 |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
1.2 mm |
85 Cel |
-40 Cel |
QUAD |
R-XQMA-N52 |
3.2 mm |
14.8 mm |
22.3 mm |
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|
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
51 |
XMA |
SQUARE |
UNSPECIFIED |
YES |
1 |
AEC-Q100 |
3 V |
MICROELECTRONIC ASSEMBLY |
.5 mm |
85 Cel |
-40 Cel |
UNSPECIFIED |
S-XXMA-N51 |
3 |
1.165 mm |
4.5 mm |
4.5 mm |
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|
|
Insight Sip |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
62 |
XMA |
SQUARE |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
2 Mbps |
R-XXMA-N62 |
8 mm |
8 mm |
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|
|
Texas Instruments |
TELECOM CIRCUIT |
COMMERCIAL |
BUTT |
100 |
LGA |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.7 V |
2.9/4.8 |
GRID ARRAY |
LGA100(UNSPEC) |
Other Telecom ICs |
.7 mm |
70 Cel |
-20 Cel |
NICKEL PALLADIUM GOLD |
BOTTOM |
100 Mbps |
R-PBGA-B100 |
3 |
2 mm |
13.3 mm |
Not Qualified |
e4 |
30 |
260 |
13.4 mm |
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|
|
U-blox Ag |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
68 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
85 Cel |
-40 Cel |
UNSPECIFIED |
2 Mbps |
R-XXMA-N68 |
1.9 mm |
10.2 mm |
15 mm |
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|
|
Microchip Technology |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
24 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
MODULE,24LEAD(UNSPEC) |
1.2 mm |
85 Cel |
-30 Cel |
GOLD OVER NICKEL |
UNSPECIFIED |
1 Mbps |
R-XXMA-N24 |
2.38 mm |
11.5 mm |
Bluetooth Module |
e4 |
19.5 mm |
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|
|
Microchip Technology |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
33 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
3 V |
MICROELECTRONIC ASSEMBLY |
MODULE,33LEAD(UNSPEC) |
1.1 mm |
85 Cel |
-40 Cel |
Nickel/Gold (Ni/Au) |
UNSPECIFIED |
.0086 Mbps |
R-XXMA-N33 |
2.46 mm |
12 mm |
e4 |
22 mm |
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|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
48 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQCC-N48 |
3 |
1 mm |
7 mm |
e4 |
30 |
260 |
7 mm |
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|
Microchip Technology |
TELECOM CIRCUIT |
COMMERCIAL |
NO LEAD |
16 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
MODULE,16LEAD(UNSPEC) |
1.2 mm |
70 Cel |
-20 Cel |
UNSPECIFIED |
.01 Mbps |
R-XXMA-N16 |
2.16 mm |
9 mm |
11.5 mm |
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|
|
U-blox Ag |
RF AND BASEBAND CIRCUIT |
INDUSTRIAL |
NO LEAD |
28 |
DMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
AEC-Q100 |
3 V |
MICROELECTRONIC ASSEMBLY |
1.1 mm |
85 Cel |
-40 Cel |
DUAL |
R-XDMA-N28 |
4 |
2.7 mm |
17 mm |
22.4 mm |
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|
|
U-blox Ag |
TELECOM CIRCUIT |
4 |
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|
|
U-blox Ag |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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|
|
U-blox Ag |
TELECOM CIRCUIT |
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|
|
Laird Technologies |
TELECOM CIRCUIT |
NOT SPECIFIED |
NOT SPECIFIED |
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|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
2 |
1.8 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.5 mm |
85 Cel |
-40 Cel |
Nickel/Palladium/Gold (Ni/Pd/Au) |
QUAD |
S-PQCC-N32 |
2 |
1 mm |
5 mm |
Not Qualified |
e4 |
NOT SPECIFIED |
260 |
5 mm |
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|
|
Texas Instruments |
TELECOM CIRCUIT |
INDUSTRIAL |
NO LEAD |
32 |
HVQCCN |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3 V |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
.4 mm |
85 Cel |
-40 Cel |
NICKEL PALLADIUM GOLD SILVER |
QUAD |
S-PQCC-N32 |
3 |
1 mm |
4 mm |
e4 |
30 |
260 |
4 mm |
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|
|
U-blox Ag |
4 |
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|
|
Microchip Technology |
TELECOM CIRCUIT |
OTHER |
NO LEAD |
24 |
XMA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
TS 16949 |
3.3 V |
MICROELECTRONIC ASSEMBLY |
MODULE,24LEAD(UNSPEC) |
1.2 mm |
85 Cel |
-30 Cel |
GOLD OVER NICKEL |
UNSPECIFIED |
1 Mbps |
R-XXMA-N24 |
2.38 mm |
11.5 mm |
e4 |
19.5 mm |
Other Function Telecom Interface ICs are electronic components used in telecommunications systems to provide specialized functionality beyond basic data transmission. These ICs are designed to perform a range of functions such as signal processing, protocol conversion, and power management. They are used in a wide range of telecommunications applications, including wired and wireless communication systems, VoIP (Voice over Internet Protocol) systems, and telephone networks.
Some common types of Other Function Telecom Interface ICs include:
1. Codec ICs: These ICs are used to encode and decode audio signals for high-quality voice communication over telecommunication networks. They provide a range of features such as noise reduction, echo cancellation, and voice activation.
2. Power management ICs: These ICs are used to manage the power supply and battery life of telecommunication devices. They regulate voltage and current to ensure efficient operation and prevent damage to the device.
3. Signal conditioning ICs: These ICs are used to enhance the quality of signals transmitted over telecommunication networks. They can filter out noise and interference, amplify signals, and correct distortions in the signal.
4. Switching ICs: These ICs are used to switch between different communication channels and protocols, enabling communication between different devices and networks.