Image shown is a representation only.
| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | BGA7H1BN6E6327XTSA1 |
| Description | RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: VQCCN; Package Shape: RECTANGULAR; |
| Datasheet | BGA7H1BN6E6327XTSA1 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 2.8 V |
| Telecom IC Type: | RF AND BASEBAND CIRCUIT |
| Maximum Seated Height: | .4 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 6 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | CHIP CARRIER, VERY THIN PROFILE |
| Length: | 1.1 mm |
| JESD-30 Code: | R-PBCC-N6 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | VQCCN |
| Width: | .7 mm |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | INDUSTRIAL |
| Moisture Sensitivity Level (MSL): | 1 |
