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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MCIMX535DVV2C |
| Description | Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B529; |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.3 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.35 V |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Supply Voltage: | 1.4 V |
| Maximum Seated Height: | 1.85 mm |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER |
| JESD-609 Code: | e2 |
| No. of Terminals: | 529 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Length: | 19 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B529 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Peak Reflow Temperature (C): | 260 |
| Package Code: | FBGA |
| Width: | 19 mm |
| Terminal Pitch: | .8 mm |
| Moisture Sensitivity Level (MSL): | 3 |
