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| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer's Part Number | AM3352BZCZ60 |
| Description | MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE; |
| Datasheet | AM3352BZCZ60 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.056 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.1 V |
| Integrated Cache: | YES |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.4 mm |
| Sub-Category: | Microprocessors |
| Surface Mount: | YES |
| Maximum Supply Current: | 400 mA |
| Terminal Finish: | TIN SILVER COPPER |
| On Chip Data RAM Width: | 8 |
| No. of Terminals: | 324 |
| Terminal Position: | BOTTOM |
| Format: | FIXED POINT |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE, FINE PITCH |
| No. of DMA Channels: | 64 |
| Address Bus Width: | 28 |
| Technology: | CMOS |
| RAM Words: | 131072 |
| JESD-30 Code: | S-PBGA-B324 |
| Maximum Clock Frequency: | 26 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 90 Cel |
| Package Code: | LFBGA |
| Width: | 15 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Speed: | 600 rpm |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| Maximum Supply Voltage: | 1.144 V |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 16 |
| Bit Size: | 32 |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | 0 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA324,18X18,32 |
| Length: | 15 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | OTHER |
| Power Supplies (V): | 0.95/1.1 |
