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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MCIMX535DVP1C2 |
| Description | MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE; |
| Datasheet | MCIMX535DVP1C2 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | 1.2 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.25 V |
| Integrated Cache: | YES |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 1.85 mm |
| Surface Mount: | YES |
| Maximum Supply Current: | 800 mA |
| On Chip Data RAM Width: | 8 |
| No. of Terminals: | 529 |
| No. of Serial I/Os: | 5 |
| Terminal Position: | BOTTOM |
| Format: | FLOATING POINT |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| Address Bus Width: | 26 |
| Technology: | CMOS |
| RAM Words: | 147456 |
| JESD-30 Code: | S-PBGA-B529 |
| Maximum Clock Frequency: | 27 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | FBGA |
| Width: | 19 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Speed: | 1000 rpm |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| Maximum Supply Voltage: | 1.4 V |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 32 |
| Bit Size: | 32 |
| Minimum Operating Temperature: | -20 Cel |
| Package Equivalence Code: | BGA529,23X23,32 |
| Length: | 19 mm |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | OTHER |
