STMicroelectronics - STM32MP157FAC1

AM6411BSCGGAALV by Texas Instruments is a 64-bit microprocessor with integrated cache and 16-bit on-chip data RAM. It operates at a max clock frequency of 25 MHz, suitable for low power mode applications. This CMOS technology processor has 441 terminals in a grid array package style, making it ideal for high-speed computing tasks.

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 538; Package Code: LFBGA; Package Shape: SQUARE;

AM3352BZCZT60 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for automotive applications requiring low power mode and boundary scan capability. With a temperature range from -40 to 125 °C, it offers high performance in compact square package style.

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 324; Package Code: TFBGA; Package Shape: SQUARE; No. of External Interrupts: 1;

MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 68; Package Shape: SQUARE; Integrated Cache: NO;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

NXP Semiconductors' MPC5200VR400B microprocessor features 32-bit address and external data bus width, operates at a max clock frequency of 66 MHz. Ideal for commercial applications, it supports low power mode and integrated cache, with a package style of grid array.

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: BGA; Package Shape: SQUARE;

AM5728BABCXA by Texas Instruments is a microprocessor with 32-bit external data bus width, operating at max 38.4 MHz clock frequency. Ideal for industrial applications, it features a low power mode and operates in an extended temperature range from -40 to 105°C.

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Integrated Cache: YES;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Qualification: Not Qualified;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: RECTANGULAR;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 760; Package Code: FBGA; Package Shape: SQUARE;

MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 515; Package Code: VFBGA; Package Shape: SQUARE;

MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE; Package Equivalence Code: BGA324,18X18,32;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 483; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;

MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1440; Package Shape: RECTANGULAR; JESD-30 Code: R-PBGA-B1440; Package Body Material: PLASTIC/EPOXY;