Renesas Electronics - DA14682-00F08A92

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 784; Package Code: BGA; Package Shape: RECTANGULAR;

SoC FPGA; Terminal Form: BALL; No. of Terminals: 288; Package Code: TFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B288;

MSP430F67791AIPZR by Texas Instruments is a 16-bit microprocessor circuit with 6 ADC channels and 3 DMA channels. It has a max clock frequency of 0.032768 MHz and is commonly used in industrial applications requiring low power consumption.

ESP32-WROOM-32E by Espressif Systems is a MICROPROCESSOR CIRCUIT with 38 terminals, operating at 3.3V, and industrial temperature grade. It features CMOS technology, NO LEAD terminal form, and a rectangular package style. Ideal for IoT applications requiring high performance in compact designs.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE;

XC7Z030-1FFG676C by Xilinx is a System on Chip with CMOS technology. It operates b/w 0-85°C, with supply voltage range of 0.95-1.05V. With 676 terminals in a grid array package, it's ideal for various applications requiring high-performance computing in compact spaces.

MCIMX6Y2CVM08AB by NXP Semiconductors is a low-profile, fine-pitch grid array SoC with 289 terminals. It operates b/w -40 to 105°C and has a supply voltage range of 1.325V to 1.5V. Ideal for applications requiring high-performance computing in compact spaces.

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: .997 V;

CY8C4247AZS-M485 by Infineon is a 64-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 105 °C and has a supply voltage range of 1.71V to 1.89V. Ideal for applications requiring low-profile, fine-pitch ICs in automotive electronics meeting AEC-Q100 standards.

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: RECTANGULAR;

SoC; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE; Terminal Pitch: .4 mm;

SoC; JESD-609 Code: e4; Moisture Sensitivity Level (MSL): 1;

MICROPROCESSOR CIRCUIT; Temperature Grade: AUTOMOTIVE; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

Other uPs/uCs/Peripheral ICs;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: SQUARE; Length: 35 mm;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;

The Xilinx XC7Z014S-2CLG400I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. This package has 400 terminals in a low profile grid array shape, suitable for various applications in the field of Other Function uPs,uCs & Peripheral ICs.