Xilinx - XC7Z030-1FFG676C

XC7Z030-1FFG676C by Xilinx

Image shown is a representation only.

Manufacturer Xilinx
Manufacturer's Part Number XC7Z030-1FFG676C
Description SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B676;
Datasheet XC7Z030-1FFG676C Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: .95 V
Package Body Material: PLASTIC/EPOXY
Peripheral IC Type: SYSTEM ON CHIP
Nominal Supply Voltage: 1 V
Maximum Supply Voltage: 1.05 V
Maximum Seated Height: 3.24 mm
Surface Mount: YES
Minimum Operating Temperature: 0 Cel
No. of Terminals: 676
Package Equivalence Code: BGA676,26X26,40
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Length: 27 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B676
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Width: 27 mm
Terminal Pitch: 1 mm
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products