NXP Semiconductors - 935237440112

  1. Home
  2. NXP Semiconductors - 935237440112
935237440112 by NXP Semiconductors

Image shown is a representation only.

Manufacturer NXP Semiconductors
Manufacturer's Part Number 935237440112
Description CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSSOP; Package Shape: RECTANGULAR;
Datasheet 935237440112 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 2.9 V
Telecom IC Type: CORDLESS TELEPHONE BASEBAND CIRCUIT
Maximum Seated Height: 1.5 mm
Surface Mount: YES
Minimum Operating Temperature: -25 Cel
No. of Functions: 1
No. of Terminals: 16
Qualification: Not Qualified
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Length: 5.2 mm
JESD-30 Code: R-PDSO-G16
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 75 Cel
Package Code: LSSOP
Width: 4.4 mm
Terminal Pitch: .65 mm
Temperature Grade: COMMERCIAL EXTENDED
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

SC14434ANF128VV by Renesas Electronics

SC14434ANF128VV

Renesas Electronics

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT;
SA58640DK,112 by NXP Semiconductors

SA58640DK,112

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;
TA31136F-TP1 by Toshiba

TA31136F-TP1

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;
PCD5091H by NXP Semiconductors

PCD5091H

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: QFP; Package Shape: RECTANGULAR; Maximum Seated Height: 3.2 mm;
935277007118 by NXP Semiconductors

935277007118

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;
TA4500F by Toshiba

TA4500F

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: FLAT; Package Code: QFF; Package Shape: SQUARE; Technology: BIPOLAR;
KS8804BD by Samsung

KS8804BD

Samsung

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
TA31136F(ER) by Toshiba

TA31136F(ER)

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;
MC13111AFTA by NXP Semiconductors

MC13111AFTA

NXP Semiconductors

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE; Surface Mount: YES;
TA31103F-TP1 by Toshiba

TA31103F-TP1

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;
935237440112 by NXP Semiconductors

935237440112

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSSOP; Package Shape: RECTANGULAR;
TA31137FN-TP2 by Toshiba

TA31137FN-TP2

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: LSSOP; Package Shape: RECTANGULAR;
KA8508 by Samsung

KA8508

Samsung

Cordless Telephone ICs; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
KS8805BD by Samsung

KS8805BD

Samsung

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
UAA3545HL by NXP Semiconductors

UAA3545HL

NXP Semiconductors

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LFQFP; Package Shape: SQUARE;
UBA1707TS-T by NXP Semiconductors

UBA1707TS-T

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;
953220650512 by NXP Semiconductors

953220650512

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
TB31262F by Toshiba

TB31262F

Toshiba

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 52; Package Code: QFP; Package Shape: SQUARE;
TA31103F(EL) by Toshiba

TA31103F(EL)

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SSOP; Package Shape: RECTANGULAR;
TEA1118M-T by NXP Semiconductors

TEA1118M-T

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSSOP; Package Shape: RECTANGULAR;