Samsung - KA8508

  1. Home
  2. Samsung - KA8508
KA8508 by Samsung

Image shown is a representation only.

Manufacturer Samsung
Manufacturer's Part Number KA8508
Description Cordless Telephone ICs; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet KA8508 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 4 V
Sub-Category: Cordless Telephone ICs
Surface Mount: NO
Maximum Supply Current: 4.3 mA
Terminal Finish: Tin/Lead (Sn/Pb)
JESD-609 Code: e0
Minimum Operating Temperature: -30 Cel
No. of Terminals: 16
Qualification: Not Qualified
Package Equivalence Code: DIP16,.3
Terminal Position: DUAL
Package Style (Meter): IN-LINE
JESD-30 Code: R-PDIP-T16
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 70 Cel
Package Code: DIP
Terminal Pitch: 2.54 mm
Temperature Grade: OTHER
Power Supplies (V): 4
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

PCD5090HZ-T by NXP Semiconductors

PCD5090HZ-T

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; Terminal Position: QUAD;
CT918B by NXP Semiconductors

CT918B

NXP Semiconductors

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Terminal Form: UNSPECIFIED; Package Shape: UNSPECIFIED; JESD-30 Code: X-XXMA-X; Package Body Material: UNSPECIFIED; Surface Mount: NO;
TA31103FN(EL) by Toshiba

TA31103FN(EL)

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: LSSOP; Package Shape: RECTANGULAR;
AD6190ARS by Analog Devices

AD6190ARS

Analog Devices

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SSOP; Package Shape: RECTANGULAR;
LMX3161VBHX by Texas Instruments

LMX3161VBHX

Texas Instruments

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
PCD5042HZ by NXP Semiconductors

PCD5042HZ

NXP Semiconductors

CORDLESS TELEPHONE BURST MODE CONTROLLER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE;
TA31101F-TP1 by Toshiba

TA31101F-TP1

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;
UBA1707T/C2 by NXP Semiconductors

UBA1707T/C2

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;
MC13110AFB by NXP Semiconductors

MC13110AFB

NXP Semiconductors

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 52; Package Code: QFP; Package Shape: SQUARE; Terminal Pitch: .65 mm;
TA31170FN by Toshiba

TA31170FN

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSSOP; Package Shape: RECTANGULAR;
TEA1118M/C2 by NXP Semiconductors

TEA1118M/C2

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSSOP; Package Shape: RECTANGULAR;
PCD4440T-T by NXP Semiconductors

PCD4440T-T

NXP Semiconductors

CORDLESS TELEPHONE SCRAMBLER/DESCRAMBLER; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
TA31101AF-TP1 by Toshiba

TA31101AF-TP1

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;
CT918H by NXP Semiconductors

CT918H

NXP Semiconductors

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Terminal Form: UNSPECIFIED; Package Shape: UNSPECIFIED; No. of Functions: 1; Terminal Position: UNSPECIFIED; JESD-30 Code: X-XXMA-X;
CT918H/HM by NXP Semiconductors

CT918H/HM

NXP Semiconductors

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Terminal Form: UNSPECIFIED; Package Shape: UNSPECIFIED; Package Style (Meter): MICROELECTRONIC ASSEMBLY; Package Body Material: UNSPECIFIED; No. of Functions: 1;
KA8511Q by Samsung

KA8511Q

Samsung

CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: RECTANGULAR;
TEA1118M-T by NXP Semiconductors

TEA1118M-T

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: LSSOP; Package Shape: RECTANGULAR;
TA31101F(EL) by Toshiba

TA31101F(EL)

Toshiba

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SSOP; Package Shape: RECTANGULAR;
953220650518 by NXP Semiconductors

953220650518

NXP Semiconductors

CORDLESS TELEPHONE BASEBAND CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 14; Package Code: SOP; Package Shape: RECTANGULAR;
UAA3540TS by NXP Semiconductors

UAA3540TS

NXP Semiconductors

CORDLESS TELEPHONE SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: LSSOP; Package Shape: RECTANGULAR;