Laird Technologies - BT851

TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

TELECOM CIRCUIT;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 261; Package Code: BGA; Package Shape: SQUARE;

Semtech's SX1502I087TRT is a telecom IC with 20 terminals in a square chip carrier package. Operating from -40 to 85°C, it has a nominal voltage of 3.3V and matte tin terminal finish. Ideal for telecom circuits, this IC is surface mountable and features an industrial temperature grade.

XCC2642R1FRGZR by Texas Instruments is a telecom IC with 48 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a nominal voltage of 3V. Ideal for telecom circuit applications, it features nickel palladium gold terminal finish and very thin profile design.

TELECOM CIRCUIT; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40;

TELECOM CIRCUIT;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: TSSOP; Package Shape: RECTANGULAR;

Quectel Wireless Solutions' EC25EFA-512-STD is a telecom IC with 150 Mbps data rate, operating at -40 to 85°C. With 144 terminals in a rectangular package, it's ideal for industrial applications requiring high-speed connectivity in compact spaces.

TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;

RN4678APL-V/RM120 by Microchip Technology is a telecom IC with 33 terminals, operating b/w -20 to 70°C. It has a supply voltage of 1.9V and terminal pitch of 1.1mm. This surface-mount rectangular package is ideal for telecom circuit applications due to its compact size and commercial temperature grade suitability.

WL1801MODGBMOCT by Texas Instruments is a telecom IC with 100 terminals in a grid array package. It operates at -20 to 70°C, with a supply voltage of 3.7V and data rate of 100 Mbps. Ideal for telecom circuits, it has a compact rectangular shape and surface-mount capability.

SA639DH/01,118 by NXP Semiconductors is a telecom interface IC with 24 terminals in a small outline package. Operating b/w -40 to 85 °C, it has a nominal voltage of 3V and terminal pitch of 0.65mm. Ideal for industrial applications requiring telecom circuit functionality.

TELECOM CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Package Equivalence Code: SOP28,.5;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 11; Package Shape: RECTANGULAR; Surface Mount: YES;

Other Telecom ICs;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 17; Package Code: VFBGA; Package Shape: RECTANGULAR;

TELECOM CIRCUIT; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE;

XB3-24Z8PT-J by Digi Int. is a telecom IC with 20 terminals in MICROELECTRONIC ASSEMBLY package. Operating temp range -40 to 85°C, INDUSTRIAL grade. Ideal for TELECOM CIRCUIT applications due to THROUGH-HOLE terminal form and DUAL position.