NXP Semiconductors - SA639DH/01,118

SA639DH/01,118 by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SA639DH/01,118
Description TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: TSSOP; Package Shape: RECTANGULAR;
Datasheet SA639DH/01,118 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3 V
Telecom IC Type: TELECOM CIRCUIT
Maximum Seated Height: 1.1 mm
Surface Mount: YES
Terminal Finish: NICKEL PALLADIUM GOLD
JESD-609 Code: e4
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 24
Qualification: Not Qualified
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Length: 7.8 mm
JESD-30 Code: R-PDSO-G24
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 85 Cel
Peak Reflow Temperature (C): 260
Package Code: TSSOP
Width: 4.4 mm
Terminal Pitch: .65 mm
Temperature Grade: INDUSTRIAL
Moisture Sensitivity Level (MSL): 1
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