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| Manufacturer | Integrated Device Technology |
|---|---|
| Manufacturer's Part Number | 5962-8952305EA |
| Description | OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Functions: 1; |
| Datasheet | 5962-8952305EA Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | CERAMIC, GLASS-SEALED |
| Organization: | 64X4 |
| Output Characteristics: | TOTEM POLE |
| Maximum Seated Height: | 5.08 mm |
| Minimum Supply Voltage (Vsup): | 4.5 V |
| Sub-Category: | FIFOs |
| Surface Mount: | NO |
| Maximum Supply Current: | 90 mA |
| Cycle Time: | 100 ns |
| Terminal Finish: | TIN LEAD |
| No. of Terminals: | 16 |
| Maximum Clock Frequency (fCLK): | 10 MHz |
| No. of Words: | 64 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Screening Level: | 38535Q/M;38534H;883B |
| Technology: | CMOS |
| JESD-30 Code: | R-GDIP-T16 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | DIP |
| Width: | 7.62 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Memory Density: | 256 bit |
| Memory IC Type: | OTHER FIFO |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -55 Cel |
| Memory Width: | 4 |
| Output Enable: | NO |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | DIP16,.3 |
| Length: | 20.066 mm |
| Maximum Access Time: | 55 ns |
| No. of Words Code: | 64 |
| Nominal Supply Voltage / Vsup (V): | 5 |
| Peak Reflow Temperature (C): | 240 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | MILITARY |
| Maximum Supply Voltage (Vsup): | 5.5 V |
| Power Supplies (V): | 5 |
