Harris Semiconductor - CD74HCT40105M

BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Peak Reflow Temperature (C): NOT SPECIFIED;

OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Terminal Position: QUAD;

FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; No. of Words: 2048 words;

IDT72V2111L10PFG8 by Renesas Electronics is a 512Kx9 FIFO with synchronous operation and 10ns cycle time. It features a low profile flatpack package, operates at temperatures from 0 to 70 °C, and has a memory density of 4718592 bits. Ideal for applications requiring fast data transfer and storage in commercial-grade environments.

OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Power Supplies (V): 5;

OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 120; Package Code: HLFQFP; Package Shape: SQUARE; Maximum Seated Height: 1.6 mm;

FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; No. of Words Code: 16;

OTHER FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 56; Package Code: SSOP; Package Shape: RECTANGULAR; Maximum Access Time: 15 ns;

FIFOs; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Cycle Time: 35 ns;

OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR; Minimum Operating Temperature: -55 Cel;

BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Maximum Operating Temperature: 70 Cel;

FIFOs; Temperature Grade: MILITARY; No. of Terminals: 80; Package Code: LFQFP; Package Shape: SQUARE; Surface Mount: YES;

Renesas Electronics 7201LA25JGI8 FIFO chip features 512x9 organization, 35ns cycle time, and operates at 5V. Ideal for industrial applications requiring fast parallel access memory with a memory density of 4608 bits. The chip is designed in a rectangular chip carrier package style for surface mount assembly.

IDT72V851L10PFG8 by Renesas Electronics is a 8Kx9 FIFO with a cycle time of 10 ns. It operates in synchronous mode and has a nominal voltage of 3.3V. This FIFO is commonly used in applications that require high-speed data buffering and storage.

BI-DIRECTIONAL FIFO; Temperature Grade: COMMERCIAL; No. of Terminals: 132; Package Code: BQFP; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR; No. of Words: 256 words;

OTHER FIFO; Temperature Grade: MILITARY; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR; No. of Functions: 1;

FIFOs; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR; Maximum Seated Height: 3.56 mm;

OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR; Memory Width: 9;