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| Manufacturer | Integrated Device Technology |
|---|---|
| Manufacturer's Part Number | 72V82L20PAGI |
| Description | OTHER FIFO; Temperature Grade: INDUSTRIAL; No. of Terminals: 56; Package Code: TSSOP; Package Shape: RECTANGULAR; JESD-609 Code: e3; |
| Datasheet | 72V82L20PAGI Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .005 Amp |
| Organization: | 1KX9 |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.2 mm |
| Minimum Supply Voltage (Vsup): | 3 V |
| Sub-Category: | FIFOs |
| Surface Mount: | YES |
| Maximum Supply Current: | 100 mA |
| Terminal Finish: | Matte Tin (Sn) - annealed |
| No. of Terminals: | 56 |
| Maximum Clock Frequency (fCLK): | 33.3 MHz |
| No. of Words: | 1024 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-G56 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TSSOP |
| Width: | 6.1 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Memory Density: | 9216 bit |
| Memory IC Type: | OTHER FIFO |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 9 |
| Output Enable: | NO |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | TSSOP56,.3,20 |
| Length: | 14 mm |
| Maximum Access Time: | 20 ns |
| No. of Words Code: | 1K |
| Nominal Supply Voltage / Vsup (V): | 3.3 |
| Additional Features: | RETRANSMIT |
| Peak Reflow Temperature (C): | 260 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
| Power Supplies (V): | 3.3 |
