Texas Instruments - OMAPL138EZWT3

OMAPL138EZWT3 by Texas Instruments

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Manufacturer Texas Instruments
Manufacturer's Part Number OMAPL138EZWT3
Description MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 361; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet OMAPL138EZWT3 Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 1.25 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 1.3 V
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.4 mm
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 361
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B361
Maximum Clock Frequency: 50 MHz
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 90 Cel
Package Code: LFBGA
Width: 16 mm
Moisture Sensitivity Level (MSL): 3
Speed: 456 rpm
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 1.35 V
External Data Bus Width: 32
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Length: 16 mm
Additional Features: IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY
Peak Reflow Temperature (C): 260
Bus Compatibility: I2C; SPI; UART; USB
Terminal Pitch: .8 mm
Temperature Grade: OTHER
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