Celduc Relais - WF210000

HEAT SINK; Body Material: ALUMINUM; Height: 9.5 mm; Length: 19 mm; Width: 13.5 mm;

HEAT SINK; Profile: U; Body Material: ALUMINUM; Construction: SLIDE ON; Fin Orientation: FOLDEDBACK; Thermal Resistance: 21.6 ohm;

HEAT SINK; Construction: EXTRUDED; Width: 120.7 mm; Height: 66.7 mm; Length: 140.2 mm; Weight: 530.71 g;

HEAT SINK; Profile: U; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Construction: CLIP; Length: 14.48 mm;

HEAT SINK;

HEAT SINK; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Construction: EXTRUDED; Fin Orientation: RADIAL; Thermal Resistance: 3.3 ohm;

HEAT SINK; Profile: PIN FIN ARRAY; Construction: FIN; Fin Orientation: LONGITUDINAL; Height: 15 mm; Length: 59 mm;

HEAT SINK;

HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Height: 40 mm; Finish: ANODIZED; Color: BLACK;

HEAT SINK; Profile: SCREW; Device Used On: TRANSISTOR; Construction: U; Fin Orientation: TRANSVERSE; Length: 35.05 mm;

HEAT SINK; Profile: SCREW; Device Used On: TRANSISTOR; Construction: EXTRUDED; Fin Orientation: LONGITUDINAL; Color: BLACK;

HEAT SINK; Body Material: ALUMINUM ALLOY; Device Used On: SEMICONDUCTOR; Construction: EXTRUDED; Fin Orientation: FIN PIN; Width: 12.7 mm;

HEAT SINK;

HEAT SINK; Device Used On: CONVERTER; Construction: FIN PIN; Fin Orientation: OMNIDIRECT; Width: 61 mm; Weight: 158 g;

HEAT SINK; Body Material: COPPER; Height: 10.16 mm; Finish: TIN; Length: 22.86 mm; Thermal Resistance: 15 ohm;

HEAT SINK;

HEAT SINK;

HEAT SINK; Profile: CLIP; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Fin Orientation: TRANSVERSE; Width: 13 mm;

HEAT SINK;

HEAT SINK;