Boyd - 530613B00000G

HEAT SINK; Profile: U; Body Material: ALUMINUM; Device Used On: TRANSISTOR; Construction: FIN; Fin Orientation: TRANSVERSE;

374424B00035G by Boyd is a PIN FIN ARRAY heat sink with dimensions of 27mm x 27mm x 18mm. It features anodized black aluminum construction and omnidirectional fin orientation. This heat sink is ideal for applications requiring efficient thermal management in electronic devices.

Boyd's SW25-2G is a 25mm high, 12.5mm wide, and 34.5mm long heat sink with a thermal resistance of 13 ohm. It is an extruded aluminum body with a black anodized finish, designed for radial fin orientation. Ideal for applications requiring efficient heat dissipation in electronic devices.

FK24413DPAK by Fischer Elektronik & Kg is a 10x13x23 mm copper heat sink weighing 3.3g, designed for ICs. It efficiently dissipates heat in electronic devices, ensuring optimal performance and reliability in various applications.

HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Color: BLACK; Finish: ANODIZED; Length: 61 mm;

HEAT SINK; Profile: CLIP; Body Material: ALUMINUM; Device Used On: IC; Fin Orientation: RADIAL; Approvals (V): UL;

Boyd 529802B02500G Heat Sink has Thermal Resistance of 3.7 ohm, Height 38.1mm, and Length 41.91mm. Ideal for cooling electronic components in compact spaces with radial fin orientation and anodized black finish.

HEAT SINK; Body Material: COPPER; Fin Orientation: STAGGERED; Height: 50.8 mm; Thermal Resistance: 8.3 ohm; Finish: TIN;

HEAT SINK;

HEAT SINK;

HEAT SINK; Construction: EXTRUDED; Weight: 24.95 g; Length: 41.9 mm; Width: 25.4 mm; Height: 25.4 mm;

FK24413D3PAK by Fischer Elektronik & Kg is a 10mm tall, 31mm wide, and 13mm long heat sink made of copper. Weighing 3.9g with a TIN LEAD finish, it is designed for use on ICs to dissipate heat efficiently in electronic devices.

HEAT SINK; Body Material: ALUMINUM; Finish: ANODIZED; Height: 25 mm; Color: BLACK; Thermal Resistance: 7.4 ohm;

HEAT SINK;

The Ohmite RA-T2X-51E heat sink, made of aluminum, measures 42x25x50.8 mm and weighs 51g. With an anodized black finish and omnidirectional fin orientation, it efficiently dissipates heat in various electronic applications.

HEAT SINK; Profile: U; Body Material: COPPER; Construction: CLIP; Fin Orientation: TRANSVERSE; Thermal Resistance: 19.7 ohm;

Ohmite DA-T263-101E is a 10.16mm tall, 12.7mm wide black anodized aluminum heat sink weighing 3.8g. With extruded construction and fin pin orientation, it's ideal for use on transistors to dissipate heat efficiently in electronic devices.

HEAT SINK; Body Material: ALUMINUM; Construction: EXTRUDED; Width: 57.9 mm; Height: 11.4 mm; Length: 61 mm;

HEAT SINK;

HEAT SINK; Body Material: ALUMINUM; Length: 19.1 mm; Color: BLACK; Finish: ANODIZED; Width: 13.2 mm;