Telecom - Switching ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
KSZ8873MLLV	Microchip Technology	LAN SWITCHING CIRCUIT	COMMERCIAL	GULL WING	64	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949		1.8 V		FLATPACK, FINE PITCH	QFP64,.47SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G64		1.6 mm	10 mm			e3			10 mm
KSZ8863FLL-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G48		1.6 mm	7 mm			e3			7 mm
KSZ8563RNXV	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N64		.9 mm	8 mm						8 mm
KSZ8567RTXVVAO	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16		.4 mm	105 Cel	-40 Cel		QUAD	S-PQFP-G128		1.2 mm	14 mm				30	260	14 mm
GSW145-AQM-T	Maxlinear	ETHERNET SWITCH
KSZ8993M	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified		e3			20 mm
KSZ8567RTXV-TRVAO	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16		.4 mm	105 Cel	-40 Cel		QUAD	S-PQFP-G128		1.2 mm	14 mm				30	260	14 mm
VSC7429XJG-02	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2700 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B672		2.44 mm	27 mm			e1			27 mm
KSZ8895MLUB	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949		1.2 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G128		1.6 mm	14 mm			e3			14 mm
1085255	Phoenix Contact	ETHERNET SWITCH
KSZ8864CNXCA-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N64		.9 mm	8 mm			e3	30	260	8 mm
KSZ8993ML	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified		e3			20 mm
KSZ8995FQ	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		230 mA	1.8 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm			e3			20 mm
KSZ8873MML	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified		e3			10 mm
KSZ8895MLUB-TR	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949		1.2 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G128		1.6 mm	14 mm			e3			14 mm
KSZ8563RNXV-VAO	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N64		.9 mm	8 mm						8 mm
LAN9353I/ML	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	1 mm	9 mm			e3	40	260	9 mm
LAN9354TI/ML	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	1 mm	8 mm		integrated 1.2V regulator	e3	30	260	8 mm
KSZ8995X	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		375 mA	1.8 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128	3	3.4 mm	14 mm	Not Qualified		e3			20 mm
KSZ8864RMNUB-TR	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100; TS 16949		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64		.9 mm	8 mm		SEATED HT-CALCULATED	e3			8 mm
KSZ8873MLLAM-TR	Microchip Technology	LAN SWITCHING CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G64		1.6 mm	12 mm				30	260	12 mm
KSZ8852HLEWA	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	64	HLFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	105 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.6 mm	10 mm			e3			10 mm
KSZ8993MLI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD	R-PQFP-G128	3	3.4 mm	14 mm	Not Qualified		e3			20 mm
KSZ8463FMLI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.6 mm	10 mm			e3			10 mm
KSZ8864RMNUB	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100; TS 16949		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	.9 mm	8 mm		SEATED HT-CALCULATED	e3	40	260	8 mm
LAN9303M-AKZE-CAG	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20		.5 mm	70 Cel	0 Cel		QUAD	S-XQCC-N72		1 mm	10 mm						10 mm
KSZ8873MLLAM	Microchip Technology	LAN SWITCHING CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949		1.8 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified			30	260	10 mm
LAN9354/ML	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	1 mm	8 mm		integrated 1.2V regulator	e3	30	260	8 mm
KSZ8765CLXCC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.47SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G80		1.6 mm	10 mm			e3			10 mm
KSZ8864RMNI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64		.9 mm	8 mm		SEATED HT-CALCULATED	e3	30	260	8 mm
LAN9354T/ML	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	1 mm	8 mm		integrated 1.2V regulator	e3	30	260	8 mm
KSZ8873RLLU	Microchip Technology	LAN SWITCHING CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G64		1.6 mm	10 mm				30	260	10 mm
KSZ8873FLL	Microchip Technology	LAN SWITCHING CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified		e3	30	260	10 mm
KSZ8864RMNUB-VAO	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		AEC-Q100		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64		.9 mm	8 mm		SEATED HT-CALCULATED	e3	30	260	8 mm
KSZ8864CNXC-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N64		.9 mm	8 mm		SEATED HT-CALCULATED	e3	30	260	8 mm
VSC7420XJG-04	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	BGA	SQUARE	PLASTIC/EPOXY	YES	1			2 mA	1 V		GRID ARRAY	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm						27 mm
LAN9353/ML	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	1 mm	9 mm			e3	40	260	9 mm
MT90812AP1	Microchip Technology	DIGITAL TIME SWITCH	INDUSTRIAL	J BEND	68	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		15 mA	5 V	5	CHIP CARRIER	LDCC68,1.0SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	Matte Tin (Sn)	QUAD	S-PQCC-J68		4.57 mm	24.23 mm	Not Qualified		e3			24.23 mm
LAN9353/PT	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	PQFP64,.48SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.2 mm	10 mm			e3			10 mm
VSC7428XJG-02	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	BALL	672	HBGA	SQUARE	PLASTIC/EPOXY	YES	1			2100 mA	1 V		GRID ARRAY, HEAT SINK/SLUG	BGA672,26X26,40		1 mm	125 Cel	-40 Cel		BOTTOM	S-PBGA-B672		2.44 mm	27 mm						27 mm
LAN9353TI/ML	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.35SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	1 mm	9 mm			e3	40	260	9 mm
72V73263BBG8	Renesas Electronics	DIGITAL TIME SWITCH																				TIN SILVER COPPER			3					e1		260
KSZ8765CLXIC	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS			1.2 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP80,.47SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G80		1.6 mm	10 mm			e3			10 mm
KSZ8864CNXC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N64		.9 mm	8 mm		SEATED HT-CALCULATED	e3		260	8 mm
KSZ8775CLXIC	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	80	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS	TS 16949		1.2 V		FLATPACK, LOW PROFILE, FINE PITCH	SPQFP80,.48SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G80		1.6 mm	10 mm			e3			10 mm
KS8995MAI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		230 mA	1.8 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	85 Cel	-40 Cel		QUAD	R-PQFP-G128		3.4 mm	14 mm				NOT SPECIFIED	NOT SPECIFIED	20 mm
KSZ8565RTXV-VAO	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16		.4 mm	105 Cel	-40 Cel		QUAD	S-PQFP-G128		1.2 mm	14 mm				30	260	14 mm
VSC7422XJQ-04	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	GULL WING	302	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1			2.6 mA	1 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP302,.1SQ		.5 mm	125 Cel	-40 Cel		QUAD	S-PQFP-G302		1.2 mm	24 mm						24 mm

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.