Telecom - Switching ICs

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Screening Level	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Width	Qualification	Additional Features	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
LAN9303M-AKZE	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V	1.8,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	Network Interfaces	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N72		1 mm	10 mm	Not Qualified		e3			10 mm
KSZ9563RNXI-TR	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N64	3	.9 mm	8 mm			e3	30	260	8 mm
LAN9353I/PT	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	64	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	PQFP64,.48SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.2 mm	10 mm			e3			10 mm
KSZ9567RTXI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G128	3	1.2 mm	14 mm			e3		260	14 mm
KSZ9567STXI-TR	Microchip Technology	ETHERNET TRANSCEIVER	INDUSTRIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G128	3	1.2 mm	14 mm			e3		260	14 mm
KSZ8463RLI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.6 mm	10 mm			e3			10 mm
KSZ8863FLLI-TR	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G48		1.6 mm	7 mm			e3			7 mm
KSZ9563RNXI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-N64	3	.9 mm	8 mm			e3	30	260	8 mm
LAN9355I/PT	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	80	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP80,.55SQ		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G80		1.2 mm	12 mm			e3			12 mm
KSZ8567STXI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G128		1.2 mm	14 mm						14 mm
KSZ8873MLLI-TR	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.6 mm	10 mm		Internal 1.8V LDO	e3	30	260	10 mm
KSZ8567STXI-TR	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16		.4 mm	85 Cel	-40 Cel		QUAD	S-PQFP-G128		1.2 mm	14 mm						14 mm
KSZ8462HLI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.6 mm	10 mm			e3			10 mm
KSZ8895RQXCA-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949		1.2 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	Matte Tin (Sn)	QUAD	R-PQFP-G128	1	3.4 mm	14 mm			e3	30	260	20 mm
KSZ8995M	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		375 mA	1.8 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified		e3			20 mm
KSZ9563RNXC-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQCC-N64	3	.9 mm	8 mm			e3	30	260	8 mm
KSZ8895FQXI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949		1.2 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm			e3			20 mm
KSZ8997	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				2.1 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm	Not Qualified		e3			20 mm
KSZ8873MLL	Microchip Technology	LAN SWITCHING CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		1.8 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified		e3	30	260	10 mm
KSZ9563RNXC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQCC-N64	3	.9 mm	8 mm			e3	30	260	8 mm
LAN9303MI-AKZE	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	72	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V	1.8,3.3	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC72,.39SQ,20	Network Interfaces	.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N72		1 mm	10 mm	Not Qualified		e3			10 mm
KSZ8895RQXC-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949		1.2 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	Matte Tin (Sn)	QUAD	R-PQFP-G128		3.4 mm	14 mm			e3	30	260	20 mm
KSZ8895MLXI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		1.2 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G128		1.6 mm	14 mm			e3			14 mm
KSZ8864CNXI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	.9 mm	8 mm		SEATED HT-CALCULATED	e3		260	8 mm
KSZ8864CNXCA	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1	CMOS			1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-XQCC-N64		.9 mm	8 mm			e3	30	260	8 mm
KSZ8873RLL	Microchip Technology	LAN SWITCHING CIRCUIT	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified		e3	30	260	10 mm
VSC7512XMY	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	NO LEAD	172	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			1600 mA	1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC172,.52SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N172		.9 mm	13 mm						13 mm
KSZ8895FQXI-TR	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm			e3			20 mm
KSZ8993MI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.8 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	R-PQFP-G128	3	3.4 mm	14 mm	Not Qualified		e3			20 mm
KSZ8563RNXV-TR	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N64		.9 mm	8 mm						8 mm
KSZ8864CNXI-TR	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N64	3	.9 mm	8 mm		SEATED HT-CALCULATED	e3		260	8 mm
KSZ8895MQXC-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1				1.2 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm			e3			20 mm
VSC7511XMY	Microchip Technology	ETHERNET SWITCH	AUTOMOTIVE	NO LEAD	172	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1			1600 mA	1 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC172,.52SQ,20		.5 mm	125 Cel	-40 Cel		QUAD	S-PQCC-N172		.9 mm	13 mm						13 mm
KSZ8567STXV-VAO	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16		.4 mm	105 Cel	-40 Cel		QUAD	S-PQFP-G128		1.2 mm	14 mm						14 mm
LAN9354I/ML	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-XQCC-N56	3	1 mm	8 mm		integrated 1.2V regulator	e3	30	260	8 mm
SJA1105RELY	NXP Semiconductors	ETHERNET SWITCH		BALL	159	LFBGA	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; ISO 26262	200 mA	1.2 V		GRID ARRAY, LOW PROFILE, FINE PITCH	BGA159,14X14,32		.8 mm	105 Cel	-40 Cel		BOTTOM	S-PBGA-B159	3	1.5 mm	12 mm					260	12 mm
KSZ8895FQXC	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	128	FQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1		TS 16949		1.2 V		FLATPACK, FINE PITCH	QFP128,.68X.91,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	R-PQFP-G128		3.4 mm	14 mm			e3			20 mm
KSZ8463FRLI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.6 mm	10 mm			e3			10 mm
KSZ8563RNXI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N64		.9 mm	8 mm						8 mm
KSZ8563RNXV-TRVAO	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N64		.9 mm	8 mm						8 mm
KSZ8863FLL	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	GULL WING	48	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP48,.35SQ,20		.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G48		1.6 mm	7 mm			e3			7 mm
KSZ8873MMLI	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1.8 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	10 mm	Not Qualified		e3			10 mm
KSZ8873FLLI	Microchip Technology	LAN SWITCHING CIRCUIT	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100; TS 16949		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.6 mm	10 mm	Not Qualified		e3	30	260	10 mm
LAN9303-ABZJ-TR	Microchip Technology	ETHERNET SWITCH	COMMERCIAL	NO LEAD	56	HVQCCN	SQUARE	UNSPECIFIED	YES	1		TS 16949		3.3 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC56,.31SQ,20		.5 mm	70 Cel	0 Cel		QUAD	S-XQCC-N56		1 mm	8 mm						8 mm
KSZ8563RNXI-TR	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	NO LEAD	64	HVQCCN	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE	LCC64,.32SQ,16		.4 mm	105 Cel	-40 Cel		QUAD	S-PQCC-N64		.9 mm	8 mm						8 mm
KSZ8567STXV-TRVAO	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	HTFQFP	SQUARE	PLASTIC/EPOXY	YES	1		AEC-Q100		1.2 V		FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH	TQFP128,.63SQ,16		.4 mm	105 Cel	-40 Cel		QUAD	S-PQFP-G128		1.2 mm	14 mm						14 mm
KSZ8895MLXI-TR	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	128	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1				1.2 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP128,.63SQ,16		.4 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G128		1.6 mm	14 mm			e3			14 mm
KSZ8463MLI-TR	Microchip Technology	ETHERNET SWITCH	INDUSTRIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		TS 16949		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20		.5 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQFP-G64		1.6 mm	10 mm			e3			10 mm

Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.

Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.

TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.

Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.

Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.