Telecom - Switching ICs
| Part | RoHS | Manufacturer | Telecom IC Type | Temperature Grade | Terminal Form | No. of Terminals | Package Code | Package Shape | Package Body Material | Surface Mount | No. of Functions | Technology | Screening Level | Maximum Supply Current | Nominal Supply Voltage | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Terminal Pitch | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Terminal Position | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Time At Peak Reflow Temperature (s) | Peak Reflow Temperature (C) | Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
48 |
SSOP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
SMALL OUTLINE, SHRINK PITCH |
.635 mm |
85 Cel |
-40 Cel |
MATTE TIN |
DUAL |
R-PDSO-G48 |
1 |
2.794 mm |
7.5 mm |
Not Qualified |
e3 |
15.875 mm |
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|
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
Not Qualified |
e3 |
28 mm |
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|
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
FLATPACK, FINE PITCH |
.5 mm |
85 Cel |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
Not Qualified |
e3 |
28 mm |
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|
|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
BALL |
144 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
GRID ARRAY, LOW PROFILE |
1 mm |
85 Cel |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B144 |
1.5 mm |
13 mm |
Not Qualified |
e1 |
13 mm |
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|
Renesas Electronics |
DIGITAL TIME SWITCH |
INDUSTRIAL |
GULL WING |
100 |
LQFP |
RECTANGULAR |
PLASTIC/EPOXY |
YES |
1 |
5 V |
FLATPACK, LOW PROFILE |
.65 mm |
85 Cel |
-40 Cel |
TIN LEAD |
QUAD |
R-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e0 |
20 mm |
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|
|
Littelfuse |
TELECOM CIRCUIT |
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|
|
Littelfuse |
TELECOM CIRCUIT |
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|
|
Littelfuse |
TELECOM CIRCUIT |
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|
|
Littelfuse |
TELECOM CIRCUIT |
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|
|
Broadcom |
ETHERNET SWITCH |
BALL |
3315 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
236470 mA |
.75 V |
GRID ARRAY |
BGA3315,62X107,40 |
1 mm |
70 Cel |
0 Cel |
BOTTOM |
S-PBGA-B3315 |
4.181 mm |
55 mm |
55 mm |
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|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.2 V |
GRID ARRAY |
BGA484,22X22,40 |
1 mm |
70 Cel |
0 Cel |
BOTTOM |
S-PBGA-B484 |
2.43 mm |
23 mm |
23 mm |
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|
|
Broadcom |
ETHERNET SWITCH |
BALL |
896 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
23846.4 mA |
.88 V |
GRID ARRAY, FINE PITCH |
BGA896,30X30,32 |
.8 mm |
70 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B896 |
2.768 mm |
25 mm |
e1 |
25 mm |
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|
|
Broadcom |
ETHERNET SWITCH |
Nickel/Palladium/Gold (Ni/Pd/Au) |
e4 |
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|
|
Broadcom |
ETHERNET SWITCH |
COMMERCIAL |
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|
Broadcom |
ETHERNET SWITCH |
NO LEAD |
8371 |
LGA |
RECTANGULAR |
UNSPECIFIED |
YES |
1 |
.75 V |
GRID ARRAY |
BGA8371,98X170,35 |
.9 mm |
70 Cel |
0 Cel |
BOTTOM |
R-XBGA-N8371 |
5.138 mm |
77.5 mm |
77.8 mm |
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|
|
Broadcom |
ETHERNET SWITCH |
BALL |
3315 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
246610 mA |
.75 V |
GRID ARRAY |
BGA3315,62X107,40 |
1 mm |
70 Cel |
0 Cel |
BOTTOM |
S-PBGA-B3315 |
4.181 mm |
55 mm |
55 mm |
|||||||||||||
|
|
Broadcom |
ETHERNET SWITCH |
BALL |
896 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
23846.4 mA |
.88 V |
GRID ARRAY, FINE PITCH |
BGA896,30X30,32 |
.8 mm |
70 Cel |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B896 |
2.768 mm |
25 mm |
e1 |
25 mm |
||||||||||
|
Broadcom |
ETHERNET TRANSCEIVER |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
CMOS |
1.2 V |
GRID ARRAY |
BGA484,22X22,40 |
1 mm |
85 Cel |
-40 Cel |
BOTTOM |
S-PBGA-B484 |
2.43 mm |
23 mm |
23 mm |
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|
Broadcom |
DIGITAL TIME SWITCH |
INDUSTRIAL |
BALL |
272 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
3.3 V |
3.3 |
GRID ARRAY |
BGA272,20X20,50 |
Other Telecom ICs |
1.27 mm |
85 Cel |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B272 |
2.32 mm |
27 mm |
Not Qualified |
e0 |
30 |
225 |
27 mm |
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|
Broadcom |
ETHERNET SWITCH |
1 |
CMOS |
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|
Broadcom |
ETHERNET SWITCH |
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|
Broadcom |
ETHERNET SWITCH |
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|
Broadcom |
ETHERNET SWITCH |
GULL WING |
176 |
QFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1 |
AEC-Q100; TS 16949 |
FLATPACK |
QUAD |
S-PQFP-G176 |
Telecom Switching ICs are electronic components used in telecommunications systems to switch between various communication channels and protocols. These ICs are designed to provide efficient and reliable switching capabilities, allowing for the efficient routing and management of telecommunication traffic.
Telecom Switching ICs use various techniques to switch between communication channels and protocols. These techniques include time-division multiplexing (TDM), packet switching, and circuit switching.
TDM Switching ICs are used to divide a high-speed transmission line into several lower-speed channels, allowing multiple signals to be transmitted simultaneously. TDM is commonly used in voice communication systems, such as traditional telephone systems.
Packet Switching ICs are used to route data packets through a network, allowing for efficient communication between multiple devices. Packet switching is commonly used in data communication systems, such as the internet and IP-based networks.
Circuit Switching ICs are used to establish a dedicated communication channel between two devices, providing a consistent and reliable connection. Circuit switching is commonly used in voice communication systems, such as traditional telephone systems.