Digital Transmission Controllers

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Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Moisture Sensitivity Level (MSL)	Maximum Seated Height	Carrier Type-2	Carrier Type-1	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
DS26401N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.33 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	ATM/SONET/SDH ICs	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.77 mm			17 mm	Not Qualified	e0			17 mm
DS26401A2	Maxim Integrated	FRAMER																													NOT SPECIFIED	NOT SPECIFIED
DS26401A2+	Maxim Integrated	FRAMER																													NOT SPECIFIED	NOT SPECIFIED
DS26504L+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	64	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1		.15 mA	3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP64,.47SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G64	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e3	30	260	10 mm
DS26514G	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B256		1.76 mm			17 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	17 mm
DS34S104GN	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.28 mA	1.8 V	1.8/3.3	GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.76 mm			17 mm	Not Qualified	e0			17 mm
DS34S108DK-L7	Maxim Integrated	FRAMER																													NOT SPECIFIED	NOT SPECIFIED
DS26524G	Maxim Integrated	TIME SLOT 0/16 TRANSCEIVER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.45 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified	e0			17 mm
DS34S101GN	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.28 mA	1.8 V	1.8/3.3	GRID ARRAY	BGA256,16X16,40	Digital Transmission Interfaces	1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256		1.76 mm			17 mm	Not Qualified	e1		225	17 mm
DS2282	Maxim Integrated	FRAMER	COMMERCIAL	NO LEAD	30		RECTANGULAR	UNSPECIFIED	NO	1			5 V		MICROELECTRONIC ASSEMBLY				70 Cel	0 Cel	TIN LEAD	SINGLE	R-XSMA-N30						Not Qualified	e0
DS26514G+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.8 V		GRID ARRAY			1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.76 mm			17 mm	Not Qualified	e1	30	260	17 mm
DS26528GNA4	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		1.76 mm			17 mm	Not Qualified	e0			17 mm
DS26504LNB2	Maxim Integrated	FRAMER																			MATTE TIN			3						e3	30	260
DS26524G+	Maxim Integrated	TIME SLOT 0/16 TRANSCEIVER	COMMERCIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR	.45 mA	3.3 V	3.3	GRID ARRAY	BGA256,16X16,40	Other Telecom ICs	1 mm	70 Cel	0 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B256	3	1.76 mm	T-1(DS1)	CEPT PCM-30/E-1	17 mm	Not Qualified	e1			17 mm
DS2141Q	Maxim Integrated	FRAMER		J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER			1.27 mm			TIN LEAD	QUAD	S-PQCC-J44		4.57 mm			16.585 mm	Not Qualified	e0			16.585 mm
DS2182Q	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-J28	1	4.57 mm			11.505 mm	Not Qualified	e0			11.505 mm
DS2151QB+T&R	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.572 mm		T-1(DS1)	16.585 mm	Not Qualified	e3	30	260	16.585 mm
DS2151QN+	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44		4.572 mm		T-1(DS1)	16.585 mm	Not Qualified	e3			16.585 mm
DS2151QB/T&R+	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.572 mm		T-1(DS1)	16.5862 mm	Not Qualified	e3			16.5862 mm
DS2155GNB	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	GRID ARRAY, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.8 mm	85 Cel	-40 Cel		BOTTOM	S-PBGA-B100	1		T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified				10 mm
DS21FT42+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel		BOTTOM	S-PBGA-B300		2.54 mm			27 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	27 mm
DS2182N	Maxim Integrated	FRAMER	COMMERCIAL	THROUGH-HOLE	28	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		5 V	5	IN-LINE	DIP28,.6	Other Telecom ICs	2.54 mm	70 Cel	0 Cel	TIN LEAD	DUAL	R-PDIP-T28	1	5.08 mm			15.24 mm	Not Qualified	e0			36.83 mm
DS2181AQN	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.57 mm		CEPT PCM-30/E-1	16.585 mm	Not Qualified	e0			16.585 mm
DS2180AQN+T&R	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.57 mm			16.585 mm	Not Qualified	e3			16.585 mm
DS2182AQN	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC28,.5SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-J28		4.57 mm			11.505 mm	Not Qualified	e0			11.505 mm
DS2154L+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	Matte Tin (Sn)	QUAD	S-PQFP-G100	3	1.6 mm		CEPT PCM-30/E-1	14 mm	Not Qualified	e3	30	260	14 mm
DS2181AQN+T&R	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.57 mm			16.585 mm	Not Qualified	e3			16.585 mm
DS21455N	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	256	BGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	GRID ARRAY	BGA256,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B256		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS2156L+	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQFP-G100	3	1.6 mm	T-1(DS1)	CEPT PCM-30/E-1	14 mm	Not Qualified	e3	30	260	14 mm
DS2141AQ/T&R	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.57 mm			16.585 mm	Not Qualified	e0			16.585 mm
DS2156G+	Maxim Integrated	FRAMER	COMMERCIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	GRID ARRAY, FINE PITCH	BGA100,10X10,32	Other Telecom ICs	.8 mm	70 Cel	0 Cel	MATTE TIN	BOTTOM	S-PBGA-B100			T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e3			10 mm
DS2143Q+T&R	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.57 mm			16.585 mm	Not Qualified	e3	30	260	16.585 mm
DS21Q58LN	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm		CEPT PCM-30/E-1	14 mm	Not Qualified	e0			14 mm
DS21Q44TN+	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	128	LFQFP	RECTANGULAR	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel		QUAD	R-PQFP-G128		1.6 mm			14 mm	Not Qualified		NOT SPECIFIED	NOT SPECIFIED	20 mm
DS21FT40	Maxim Integrated	FRAMER	COMMERCIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B300		2.54 mm			27 mm	Not Qualified	e0			27 mm
DS2154LN	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	FLATPACK, LOW PROFILE, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.5 mm	85 Cel	-40 Cel	Tin/Lead (Sn/Pb)	QUAD	S-PQFP-G100	3	1.6 mm		CEPT PCM-30/E-1	14 mm	Not Qualified	e0	20	240	14 mm
DS2155G	Maxim Integrated	FRAMER	COMMERCIAL	BALL	100	FBGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V	3.3	GRID ARRAY, FINE PITCH	QFP100,.63SQ,20	Other Telecom ICs	.8 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B100	3		T-1(DS1)	CEPT PCM-30/E-1	10 mm	Not Qualified	e0			10 mm
DS2152L-C01	Maxim Integrated	FRAMER	COMMERCIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	70 Cel	0 Cel		QUAD	S-PQFP-G100		1.6 mm			14 mm			NOT SPECIFIED	NOT SPECIFIED	14 mm
DS21FF42N+	Maxim Integrated	FRAMER	INDUSTRIAL	BALL	300	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V	3.3	GRID ARRAY	BGA300,20X20,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	MATTE TIN	BOTTOM	S-PBGA-B300	4	2.54 mm			27 mm	Not Qualified	e3			27 mm
DS2181AQ+	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V		CHIP CARRIER			1.27 mm	70 Cel	0 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.57 mm			16.5862 mm	Not Qualified	e3			16.5862 mm
DS2181A+	Maxim Integrated	FRAMER	COMMERCIAL	THROUGH-HOLE	40	DIP	RECTANGULAR	PLASTIC/EPOXY	NO	1	CMOS		5 V		IN-LINE			2.54 mm	70 Cel	0 Cel	MATTE TIN	DUAL	R-PDIP-T40	1	4.064 mm			15.24 mm	Not Qualified	e3	30	260	52.3875 mm
DS2151QB	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.572 mm		T-1(DS1)	16.585 mm	Not Qualified	e0			16.585 mm
DS21458	Maxim Integrated	FRAMER	COMMERCIAL	BALL	256	LBGA	SQUARE	PLASTIC/EPOXY	YES	1	BIPOLAR		3.3 V	3.3	GRID ARRAY, LOW PROFILE	BGA256,16X16,40	Other Telecom ICs	1 mm	70 Cel	0 Cel	TIN LEAD	BOTTOM	S-PBGA-B256	3	1.5 mm			17 mm	Not Qualified	e0			17 mm
DS2151QB/T&R	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.572 mm		T-1(DS1)	16.585 mm	Not Qualified	e0			16.585 mm
DS2153Q-A7/T&R	Maxim Integrated	FRAMER	COMMERCIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQCC-J44	3	4.572 mm		CEPT PCM-30/E-1	16.5862 mm	Not Qualified	e0			16.5862 mm
DS2143QN+T&R	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1			5 V		CHIP CARRIER			1.27 mm	85 Cel	-40 Cel	MATTE TIN	QUAD	S-PQCC-J44	3	4.57 mm			16.585 mm	Not Qualified	e3			16.585 mm
DS2196LN	Maxim Integrated	FRAMER	INDUSTRIAL	GULL WING	100	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G100	3	1.6 mm			14 mm	Not Qualified	e0		245	14 mm
DS2153QN	Maxim Integrated	FRAMER	INDUSTRIAL	J BEND	44	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		5 V	5	CHIP CARRIER	LDCC44,.7SQ	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQCC-J44		4.572 mm		CEPT PCM-30/E-1	16.585 mm	Not Qualified	e0			16.585 mm

Digital Transmission Controllers are electronic components that provide the processing power and functionality for data transmission and communication systems. They are responsible for encoding and decoding digital signals, as well as managing data flow, error correction, and network synchronization.

Some common types of Digital Transmission Controllers include:

1. Modems: These are devices that convert digital signals to analog signals for transmission over telephone lines or other analog communication channels. They also receive and decode analog signals and convert them back into digital signals.

2. Ethernet controllers: These are ICs that manage the data flow and transmission over Ethernet networks. They handle packet routing, error correction, and network synchronization.

3. Wireless communication controllers: These are ICs that manage the data flow and transmission over wireless communication networks, such as Wi-Fi and Bluetooth. They handle packet routing, error correction, and network synchronization.

4. Serial communication controllers: These are ICs that manage the data flow and transmission over serial communication channels, such as RS-232 and USB. They handle packet framing, error correction, and flow control.

Digital Transmission Controllers offer several advantages over traditional analog communication systems. They provide higher data rates, increased noise immunity, and more efficient use of transmission bandwidth. They also offer greater flexibility and ease of use, enabling seamless integration with other digital systems.

However, Digital Transmission Controllers also have some limitations, such as the need for specialized hardware and software, and the potential for data loss or corruption due to transmission errors.