Digital Transmission Controllers

Reset All

Part	Manufacturer	Telecom IC Type	Temperature Grade	Terminal Form	No. of Terminals	Package Code	Package Shape	Package Body Material	Surface Mount	No. of Functions	Technology	Maximum Supply Current	Nominal Supply Voltage	Power Supplies (V)	Package Style (Meter)	Package Equivalence Code	Sub-Category	Terminal Pitch	Maximum Operating Temperature	Minimum Operating Temperature	Terminal Finish	Terminal Position	JESD-30 Code	Maximum Seated Height	Width	Qualification	JESD-609 Code	Maximum Time At Peak Reflow Temperature (s)	Peak Reflow Temperature (C)	Length
L-T-8105---BAL4-DB	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.275 mA	3.3 V	3.3	GRID ARRAY	BGA217,17X17,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B217	2.32 mm	23 mm	Not Qualified	e1			23 mm
L-T-8100A--BAL4-DB	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.275 mA	3.3 V	3.3	GRID ARRAY	BGA217,17X17,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B217	2.32 mm	23 mm	Not Qualified	e1			23 mm
L-T-8105---SC4-DB	Broadcom	TIME SLOT ASSIGNER	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1		.275 mA	3.3 V	3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	TIN BISMUTH	QUAD	S-PQFP-G208	4.1 mm	28 mm	Not Qualified	e6			28 mm
T-8105---SC4-DB	Broadcom	TIME SLOT ASSIGNER	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1		.275 mA	3.3 V	3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G208	4.1 mm	28 mm	Not Qualified	e0			28 mm
TTSI144641BL-1	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	BALL	388	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B388	2.51 mm	27 mm	Not Qualified	e0	30	225	27 mm
TFRA08C13-DB	Broadcom	FRAMER	INDUSTRIAL	BALL	352	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B352	2.54 mm	35 mm	Not Qualified	e0	30	225	35 mm
TTSI008321BL-1	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	BALL	240	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B240	2.07 mm	19 mm	Not Qualified	e0	30	225	19 mm
L-T-8102---SC4-DB	Broadcom	TIME SLOT ASSIGNER	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1		.275 mA	3.3 V	3.3	FLATPACK, FINE PITCH	QFP208,1.2SQ,20	Other Telecom ICs	.5 mm	70 Cel	0 Cel	TIN BISMUTH	QUAD	S-PQFP-G208	4.1 mm	28 mm	Not Qualified	e6			28 mm
TTSI001041BL-2	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	BALL	240	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B240	2.07 mm	19 mm	Not Qualified	e0	30	225	19 mm
T-8102---BAL4-DB	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.275 mA	3.3 V	3.3	GRID ARRAY	BGA217,17X17,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B217	2.32 mm	23 mm	Not Qualified	e0			23 mm
T8105---BAL-DB	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B217	2.32 mm	23 mm	Not Qualified	e0	30	225	23 mm
TTSI002081BL-2	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	BALL	240	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B240	2.07 mm	19 mm	Not Qualified	e0	30	225	19 mm
T8102---BAL-DB	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B217	2.32 mm	23 mm	Not Qualified	e0	30	225	23 mm
TTSI1K16T3TL	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G144	1.6 mm	20 mm	Not Qualified	e0	30	225	20 mm
T-7633---TL-DB	Broadcom	FRAMER	INDUSTRIAL	GULL WING	144	LFQFP	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		FLATPACK, LOW PROFILE, FINE PITCH			.5 mm	85 Cel	-40 Cel	TIN LEAD	QUAD	S-PQFP-G144	1.6 mm	20 mm	Not Qualified	e0	30	225	20 mm
T8100A---SC-DB	Broadcom	TIME SLOT ASSIGNER	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G208	4.1 mm	28 mm	Not Qualified	e0	30	225	28 mm
TTSI4K32T	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1	CMOS		3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B217	2.32 mm	23 mm	Not Qualified	e0	30	225	23 mm
L-T-8102---BAL4-DB	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1		.275 mA	3.3 V	3.3	GRID ARRAY	BGA217,17X17,50	Other Telecom ICs	1.27 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B217	2.32 mm	23 mm	Not Qualified	e1			23 mm
L-TFRA84J131BL-3	Broadcom	FRAMER	INDUSTRIAL	BALL	909	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B909	2.51 mm	35 mm	Not Qualified	e1	40	250	35 mm
L-TTSI004161BL-2	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	BALL	240	BGA	SQUARE	PLASTIC/EPOXY	YES	1			1.5 V		GRID ARRAY			1 mm	85 Cel	-40 Cel	TIN SILVER COPPER	BOTTOM	S-PBGA-B240	2.07 mm	19 mm	Not Qualified	e1	40	260	19 mm
T8100A--BAL3-DB	Broadcom	TIME SLOT ASSIGNER	INDUSTRIAL	BALL	217	BGA	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		GRID ARRAY			1.27 mm	85 Cel	-40 Cel	TIN LEAD	BOTTOM	S-PBGA-B217	2.32 mm	23 mm	Not Qualified	e0	30	225	23 mm
T8105---SC3-DB	Broadcom	TIME SLOT ASSIGNER	COMMERCIAL	GULL WING	208	FQFP	SQUARE	PLASTIC/EPOXY	YES	1			3.3 V		FLATPACK, FINE PITCH			.5 mm	70 Cel	0 Cel	TIN LEAD	QUAD	S-PQFP-G208	4.1 mm	28 mm	Not Qualified	e0	30	225	28 mm
KT8555	Samsung	TIME SLOT ASSIGNER		THROUGH-HOLE	20	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1			5 V		IN-LINE			2.54 mm				DUAL	R-GDIP-T20	5.08 mm	7.62 mm	Not Qualified				25.855 mm
KT8580	Samsung	TIME SLOT ASSIGNER		J BEND	28	QCCJ	SQUARE	PLASTIC/EPOXY	YES	1					CHIP CARRIER			1.27 mm				QUAD	S-PQCC-J28	4.52 mm	11.53 mm	Not Qualified				11.53 mm
KT8555J	Samsung	TIME SLOT ASSIGNER	OTHER	THROUGH-HOLE	20	DIP	RECTANGULAR	CERAMIC, GLASS-SEALED	NO	1	CMOS	.0015 mA	5 V	5	IN-LINE	DIP20,.3	Other Telecom ICs	2.54 mm	125 Cel	-20 Cel	TIN LEAD	DUAL	R-GDIP-T20	5.08 mm	7.62 mm	Not Qualified	e0			25.855 mm

Digital Transmission Controllers are electronic components that provide the processing power and functionality for data transmission and communication systems. They are responsible for encoding and decoding digital signals, as well as managing data flow, error correction, and network synchronization.

Some common types of Digital Transmission Controllers include:

1. Modems: These are devices that convert digital signals to analog signals for transmission over telephone lines or other analog communication channels. They also receive and decode analog signals and convert them back into digital signals.

2. Ethernet controllers: These are ICs that manage the data flow and transmission over Ethernet networks. They handle packet routing, error correction, and network synchronization.

3. Wireless communication controllers: These are ICs that manage the data flow and transmission over wireless communication networks, such as Wi-Fi and Bluetooth. They handle packet routing, error correction, and network synchronization.

4. Serial communication controllers: These are ICs that manage the data flow and transmission over serial communication channels, such as RS-232 and USB. They handle packet framing, error correction, and flow control.

Digital Transmission Controllers offer several advantages over traditional analog communication systems. They provide higher data rates, increased noise immunity, and more efficient use of transmission bandwidth. They also offer greater flexibility and ease of use, enabling seamless integration with other digital systems.

However, Digital Transmission Controllers also have some limitations, such as the need for specialized hardware and software, and the potential for data loss or corruption due to transmission errors.