Part | RoHS | Manufacturer | RF or Microwave Device Type | Mounting Feature | No. of Terminals | Package Body Material | Technology | Screening Level | Maximum Input Power (CW) | Maximum Voltage Standing Wave Ratio | Maximum Supply Current | Construction | Power Supplies (V) | Package Equivalence Code | Characteristic Impedance | Sub-Category | Maximum Operating Temperature | Minimum Operating Temperature | Terminal Finish | Maximum Conversion Loss | Additional Features | JESD-609 Code | Minimum Operating Frequency | Maximum Operating Frequency |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
GAAS |
22 dBm |
220 mA |
COMPONENT |
5 |
LCC24,.16SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
e0 |
1800 MHz |
3900 MHz |
||||||
|
Analog Devices |
DOUBLE BALANCED |
27 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
10.5 dB |
e3 |
1800 MHz |
2200 MHz |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
36 |
PLASTIC/EPOXY |
BICMOS |
COMPONENT |
3.3/5 |
LCC36,.25SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
HIGH ISOLATION |
500 MHz |
1700 MHz |
||||||||
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
GAAS |
27 dBm |
COMPONENT |
SOP8,.25 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
11.5 dB |
e0 |
700 MHz |
1200 MHz |
|||||||
|
Analog Devices |
DOUBLE BALANCED |
13 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
13.5 dB |
24000 MHz |
32000 MHz |
||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
GAAS |
20 dBm |
COMPONENT |
LCC24,.16SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
10 dB |
e4 |
6000 MHz |
10000 MHz |
||||||
|
Analog Devices |
DOUBLE BALANCED |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
700 MHz |
3000 MHz |
|||||||||||||||
|
Analog Devices |
|||||||||||||||||||||||
|
Analog Devices |
SURFACE MOUNT |
24 |
CERAMIC |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
||||||||||||||||
|
Analog Devices |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
e4 |
|||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
13 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) |
13 dB |
e4 |
33000 MHz |
42000 MHz |
||||||||||||
|
Analog Devices |
|||||||||||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
13 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Gold Flash (Au) - with Nickel (Ni) barrier |
12.5 dB |
SMA |
24000 MHz |
32000 MHz |
||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
25 dBm |
COAXIAL |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
11 dB |
SMA-F |
e4 |
11000 MHz |
20000 MHz |
|||||||||||
|
Analog Devices |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
BICMOS |
5 |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
Analog Devices |
DOUBLE BALANCED |
25 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
10 dB |
e0 |
700 MHz |
1000 MHz |
|||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
10 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
1500 MHz |
3800 MHz |
|||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
6.2 dB |
HIGH ISOLATION |
e3 |
300 MHz |
1100 MHz |
|||||||||||
|
Analog Devices |
SURFACE MOUNT |
40 |
PLASTIC/EPOXY |
BICMOS |
5 |
LCC40,.24SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
Analog Devices |
DOUBLE BALANCED |
MODULE |
50 ohm |
85 Cel |
-25 Cel |
Tin/Lead (Sn/Pb) |
e0 |
|||||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-55 Cel |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
20 dBm |
COAXIAL |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
12 dB |
SMA |
e4 |
11000 MHz |
16000 MHz |
|||||||||||
|
Analog Devices |
DOUBLE BALANCED |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) |
e4 |
70000 MHz |
90000 MHz |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
GAAS |
22 dBm |
COMPONENT |
TSSOP8,.19 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
11 dB |
e3 |
1500 MHz |
3800 MHz |
||||||
|
Analog Devices |
DOUBLE BALANCED |
19 dBm |
COAXIAL |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
14 dB |
SMA |
e4 |
30000 MHz |
38000 MHz |
|||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
24 |
CERAMIC |
GAAS |
25 dBm |
COMPONENT |
LCC24,.16SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
10.5 dB |
e4 |
2500 MHz |
7000 MHz |
||||||
|
Analog Devices |
IMAGE REJECTION |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) |
10 dB |
e4 |
4000 MHz |
8500 MHz |
||||||||||||
|
Analog Devices |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
BIPOLAR |
5 |
LCC16,.12SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
GAAS |
TSSOP8,.19 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
Analog Devices |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
BICMOS |
125 mA |
5 |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
|
Analog Devices |
IMAGE REJECTION |
20 dBm |
COAXIAL |
50 ohm |
85 Cel |
-55 Cel |
Gold (Au) - with Nickel (Ni) barrier |
9.5 dB |
SMA-F |
e4 |
4000 MHz |
8500 MHz |
|||||||||||
|
Analog Devices |
SURFACE MOUNT |
20 |
PLASTIC/EPOXY |
BICMOS |
5 |
LCC20,.20SQ,25 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
13 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
MATTE TIN |
10.5 dB |
e3 |
4000 MHz |
7000 MHz |
||||||||||||
|
Analog Devices |
SURFACE MOUNT |
40 |
PLASTIC/EPOXY |
BICMOS |
5 |
LCC40,.24SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
16 |
CERAMIC |
GAAS |
23 dBm |
COMPONENT |
LCC16,.12SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
Gold (Au) - with Nickel (Ni) barrier |
14 dB |
e4 |
6000 MHz |
12000 MHz |
||||||
Analog Devices |
TRIPLE BALANCED |
23 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
Tin/Lead (Sn/Pb) |
12 dB |
e0 |
3100 MHz |
3900 MHz |
|||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
12 |
CERAMIC |
GAAS |
LCC12,.12SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
||||||||||||||
|
Analog Devices |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
BICMOS |
168 mA |
5 |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
|||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
GAAS |
27 dBm |
COMPONENT |
SOP8,.25 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
11.5 dB |
e3 |
700 MHz |
1200 MHz |
||||||
|
Analog Devices |
TRIPLE BALANCED |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
BICMOS |
168 mA |
5 |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
||||||||||
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
GAAS |
22 dBm |
COMPONENT |
TSSOP8,.19 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
TIN LEAD |
11 dB |
e0 |
1500 MHz |
3800 MHz |
|||||||
|
Analog Devices |
DOUBLE BALANCED |
20 dBm |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
TIN |
e3 |
700 MHz |
3000 MHz |
|||||||||||||
|
Analog Devices |
SURFACE MOUNT |
8 |
PLASTIC/EPOXY |
3 |
SOLCC8,.08,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
|||||||||||||||
Analog Devices |
TRIPLE BALANCED |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
BICMOS |
195 mA |
5 |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
|||||||||||||
Analog Devices |
DOUBLE BALANCED |
COMPONENT |
50 ohm |
85 Cel |
-40 Cel |
HIGH ISOLATION |
500 MHz |
1700 MHz |
||||||||||||||||
|
Analog Devices |
DOUBLE BALANCED |
SURFACE MOUNT |
16 |
PLASTIC/EPOXY |
BIPOLAR |
12 dBm |
113 mA |
COMPONENT |
5 |
LCC16,.12SQ,20 |
50 ohm |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
MATTE TIN |
e3 |
50 MHz |
2400 MHz |
|||||
|
Analog Devices |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
BICMOS |
140 mA |
5 |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
|||||||||||||
Analog Devices |
SURFACE MOUNT |
24 |
PLASTIC/EPOXY |
BICMOS |
168 mA |
5 |
LCC24,.16SQ,20 |
RF/Microwave Mixers |
85 Cel |
-40 Cel |
RF/microwave mixers are electronic devices used in radio frequency (RF) and microwave systems to convert one frequency to another. They perform frequency translation by multiplying two input signals, a local oscillator (LO) signal and a radio frequency (RF) or intermediate frequency (IF) signal, to produce an output signal that has the sum and difference frequencies of the inputs.
RF/microwave mixers are commonly used in a variety of applications, including frequency conversion, phase detection, modulation and demodulation, and signal generation. They are widely used in telecommunications, radar systems, navigation systems, and satellite communication systems.
RF/microwave mixers are available in various types, including diode mixers, transistor mixers, and monolithic microwave integrated circuit (MMIC) mixers. The choice of mixer depends on the application requirements, such as the desired frequency range, signal bandwidth, conversion gain, and noise figure.