Analog Devices - HMC339

DOUBLE BALANCED; Characteristic Impedance: 50 ohm; Maximum Operating Frequency: 2500 MHz; Construction: COMPONENT; Additional Features: HIGH ISOLATION; Maximum Operating Temperature: 85 Cel;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Minimum Operating Temperature: -40 Cel; JESD-609 Code: e0;

RF/Microwave Mixers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Minimum Operating Temperature: -40 Cel;

DOUBLE BALANCED; Technology: GAAS; Construction: COMPONENT; Terminal Finish: Gold (Au); Package Equivalence Code: DIE OR CHIP; Characteristic Impedance: 50 ohm;

DOUBLE BALANCED; Maximum Operating Temperature: 100 Cel; Characteristic Impedance: 50 ohm; Maximum Operating Frequency: 2500 MHz; Minimum Operating Frequency: 10 MHz; Maximum Input Power (CW): 17 dBm;

TRIPLE BALANCED; JESD-609 Code: e4; Construction: COMPONENT; Maximum Input Power (CW): 15.5 dBm; Maximum Operating Temperature: 85 Cel; Minimum Operating Temperature: -55 Cel;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: CERAMIC; Minimum Operating Temperature: -55 Cel; Maximum Conversion Loss: 8 dB;

SINGLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Package Equivalence Code: TSSOP8,.19;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 20; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; JESD-609 Code: e3;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: CERAMIC; Technology: GAAS; Package Equivalence Code: LCC24,.16SQ,20;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 14; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Characteristic Impedance: 50 ohm;

DOUBLE BALANCED; Maximum Conversion Loss: 10 dB; Construction: COMPONENT; Maximum Input Power (CW): 25 dBm; Characteristic Impedance: 50 ohm; Maximum Operating Temperature: 85 Cel;

DOUBLE BALANCED; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Maximum Input Power (CW): 15 dBm; JESD-609 Code: e3;

DOUBLE BALANCED; Maximum Operating Temperature: 85 Cel; Construction: COMPONENT; Minimum Operating Frequency: 700 MHz; Maximum Input Power (CW): 20 dBm; Minimum Operating Temperature: -40 Cel;

IMAGE REJECTION; Mounting Feature: SURFACE MOUNT; No. of Terminals: 7; Maximum Conversion Loss: 11 dB; Maximum Operating Temperature: 85 Cel; Package Equivalence Code: DIE OR CHIP;

DOUBLE BALANCED; Maximum Operating Temperature: 85 Cel; Maximum Input Power (CW): 15 dBm; Maximum Operating Frequency: 20000 MHz; Construction: COMPONENT; Minimum Operating Frequency: 6000 MHz;

DOUBLE BALANCED; Construction: COMPONENT; Maximum Input Power (CW): 20 dBm; Maximum Operating Temperature: 70 Cel; Minimum Operating Temperature: 0 Cel; Maximum Operating Frequency: 1200 MHz;

IMAGE REJECTION; Mounting Feature: SURFACE MOUNT; No. of Terminals: 24; Package Body Material: CERAMIC; Technology: GAAS; Minimum Operating Temperature: -40 Cel;

DOUBLE BALANCED; Minimum Operating Temperature: -40 Cel; Terminal Finish: MATTE TIN; Characteristic Impedance: 50 ohm; Minimum Operating Frequency: 3500 MHz; Maximum Operating Temperature: 85 Cel;

DOUBLE BALANCED; Construction: COMPONENT; Minimum Operating Temperature: -55 Cel; Maximum Operating Frequency: 32000 MHz; Characteristic Impedance: 50 ohm; Minimum Operating Frequency: 14000 MHz;