Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Package Body Material | Propagation Delay | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of Macro Cells | Technology Used | Screening Level | No. of Inputs | Architecture | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | In-System Programmable | Output Function | Minimum Supply Voltage | No. of Product Terms | Pitch Of Terminal | Maximum Operating Temperature | Organization | No. of Dedicated Inputs | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length | JTAG Boundary Scan Test | No. of I/O Lines |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Xilinx |
FLASH PLD |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
3.6 V |
72 |
CMOS |
72 |
3.3 |
2.5/3.3,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 72 I/O |
0 |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
72 MACROCELLS |
e4 |
100 MHz |
72 |
14 mm |
YES |
72 |
||||||||
|
Intel |
FLASH PLD |
OTHER |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
11.2 ns |
YES |
1.89 V |
1700 |
CMOS |
203 |
1.8 |
1.8,1.2/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Programmable Logic Devices |
YES |
MACROCELL |
1.71 V |
1 mm |
85 Cel |
203 I/O |
0 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
1.55 mm |
17 mm |
Not Qualified |
YES |
e1 |
201.1 MHz |
203 |
17 mm |
YES |
203 |
|||||||||
|
Intel |
EE PLD |
INDUSTRIAL |
GULL WING |
44 |
LQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 |
FLATPACK, LOW PROFILE |
LDCC44,.7SQ |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.8 mm |
85 Cel |
0 DEDICATED INPUTS, 34 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G44 |
3 |
1.27 mm |
10 mm |
Not Qualified |
YES |
e3 |
100 MHz |
10 mm |
YES |
34 |
||||||||||
|
Xilinx |
FLASH PLD |
INDUSTRIAL |
NO LEAD |
32 |
SON |
SQUARE |
PLASTIC/EPOXY |
6 ns |
YES |
1.9 V |
32 |
CMOS |
1.8 |
1.5/3.3,1.8 |
SMALL OUTLINE |
LCC32,.2SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.5 mm |
85 Cel |
21 I/O |
-40 Cel |
MATTE TIN |
DUAL |
S-PDSO-N32 |
3 |
1 mm |
5 mm |
Not Qualified |
REAL DIGITAL DESIGN TECHNOLOGY |
e3 |
300 MHz |
30 |
260 |
5 mm |
YES |
21 |
|||||||||
|
Xilinx |
FLASH PLD |
INDUSTRIAL |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
6 ns |
YES |
1.9 V |
32 |
CMOS |
1.8 |
1.5/3.3,1.8 |
FLATPACK, THIN PROFILE |
LCC32,.2SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.8 mm |
85 Cel |
33 I/O |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
Not Qualified |
REAL DIGITAL DESIGN TECHNOLOGY |
e3 |
300 MHz |
30 |
260 |
10 mm |
YES |
33 |
|||||||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
3.6 V |
72 |
CMOS |
34 |
3.3 |
2.5/3.3,3.3 |
FLATPACK, THIN PROFILE |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.8 mm |
70 Cel |
0 DEDICATED INPUTS, 34 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
Not Qualified |
72 MACROCELLS |
e3 |
125 MHz |
30 |
34 |
260 |
10 mm |
YES |
34 |
||||||
|
Intel |
FLASH PLD |
OTHER |
GULL WING |
64 |
HTFQFP |
SQUARE |
PLASTIC/EPOXY |
7.9 ns |
YES |
1.89 V |
1.8 |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH |
MACROCELL |
1.71 V |
.4 mm |
85 Cel |
54 I/O |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
1.2 mm |
7 mm |
Not Qualified |
e3 |
184.1 MHz |
7 mm |
54 |
||||||||||||||||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
48 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
64 |
CMOS |
1.8 |
1.8 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP48,.35SQ |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.5 mm |
4 DEDICATED INPUTS, 32 I/O |
4 |
MATTE TIN |
QUAD |
S-PQFP-G48 |
3 |
1.2 mm |
7 mm |
Not Qualified |
YES |
e3 |
111 MHz |
40 |
260 |
7 mm |
YES |
32 |
|||||||||||
|
Intel |
FLASH PLD |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
2.625 V |
980 |
CMOS |
212 |
2.5 |
1.5/3.3,2.5/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Programmable Logic Devices |
YES |
MACROCELL |
2.375 V |
1 mm |
85 Cel |
0 DEDICATED INPUTS, 212 I/O |
0 |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B256 |
3 |
2.2 mm |
17 mm |
Not Qualified |
IT CAN ALSO OPERATE AT 3.3V |
e1 |
30 |
212 |
260 |
17 mm |
YES |
212 |
|||||||
|
Lattice Semiconductor |
EE PLD |
COMMERCIAL |
GULL WING |
48 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
5.25 V |
32 |
CMOS |
34 |
PAL-TYPE |
5 |
5 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP48,.35SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
4.75 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 32 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G48 |
3 |
1.6 mm |
7 mm |
Not Qualified |
YES |
e3 |
62.5 MHz |
40 |
32 |
260 |
7 mm |
YES |
32 |
|||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
3.6 V |
36 |
CMOS |
34 |
3.3 |
2.5/3.3,3.3 |
FLATPACK, THIN PROFILE |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.8 mm |
70 Cel |
0 DEDICATED INPUTS, 34 I/O |
0 |
0 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
Not Qualified |
YES |
e4 |
138.88 MHz |
34 |
10 mm |
YES |
34 |
||||||||
|
Xilinx |
FLASH PLD |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
3.6 V |
144 |
CMOS |
81 |
3.3 |
2.5/3.3,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 81 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
YES |
e3 |
138.88 MHz |
30 |
81 |
260 |
14 mm |
YES |
81 |
||||||
|
Microchip Technology |
EE PLD |
INDUSTRIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
15 ns |
YES |
3.6 V |
128 |
3.3 |
TUBE |
3.3 |
CHIP CARRIER |
LDCC84,1.2SQ |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
1.27 mm |
85 Cel |
0 DEDICATED INPUTS, 64 I/O |
0 |
-40 Cel |
QUAD |
S-PQCC-J84 |
4.572 mm |
29.3115 mm |
Not Qualified |
YES |
100 MHz |
29.3115 mm |
YES |
64 |
|||||||||||||
|
Xilinx |
FLASH PLD |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
3.6 V |
288 |
CMOS |
117 |
3.3 |
2.5/3.3,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 117 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
YES |
e3 |
100 MHz |
30 |
117 |
260 |
20 mm |
YES |
117 |
||||||
|
Xilinx |
EE PLD |
COMMERCIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
3.6 V |
128 |
CMOS |
3.3 |
3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 84 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
YES |
e3 |
95 MHz |
30 |
260 |
14 mm |
YES |
84 |
||||||||
|
Xilinx |
FLASH PLD |
INDUSTRIAL |
GULL WING |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
3.6 V |
72 |
CMOS |
36 |
3.3 |
2.5/3.3,3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 52 I/O |
0 |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
72 MACROCELLS |
e4 |
100 MHz |
36 |
10 mm |
YES |
52 |
||||||||
Xilinx |
FLASH PLD |
INDUSTRIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
64 |
CMOS |
1.8 |
1.5/3.3,1.8 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 64 I/O |
0 |
-40 Cel |
TIN LEAD |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
REAL DIGITAL DESIGN TECHNOLOGY |
e0 |
200 MHz |
30 |
240 |
14 mm |
YES |
64 |
|||||||||
|
Xilinx |
FLASH PLD |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
256 |
CMOS |
118 |
PLA-TYPE |
1.8 |
1.5/3.3,1.8 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 118 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
REAL DIGITAL DESIGN TECHNOLOGY |
e3 |
108 MHz |
30 |
118 |
260 |
20 mm |
YES |
118 |
|||||
|
Microchip Technology |
FLASH PLD |
INDUSTRIAL |
J BEND |
28 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
20 ns |
YES |
5.5 V |
CMOS |
22 |
PAL-TYPE |
5 |
TUBE |
5 |
CHIP CARRIER |
LDCC28,.5SQ |
Programmable Logic Devices |
MACROCELL |
4.5 V |
132 |
1.27 mm |
85 Cel |
11 DEDICATED INPUTS, 10 I/O |
11 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J28 |
4.57 mm |
11.5062 mm |
Not Qualified |
e3 |
38.5 MHz |
10 |
11.5062 mm |
10 |
||||||||||
|
Microchip Technology |
EE PLD |
COMMERCIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
5.25 V |
128 |
5 |
TRAY |
3.3/5,5 |
FLATPACK, THIN PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
4.75 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 80 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
YES |
e3 |
166.7 MHz |
40 |
260 |
14 mm |
YES |
80 |
||||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
3.6 V |
128 |
74 |
PAD-TYPE |
3.3 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
83 |
.5 mm |
90 Cel |
10 DEDICATED INPUTS, 64 I/O |
10 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
111 MHz |
40 |
64 |
260 |
14 mm |
YES |
64 |
|||||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
NO LEAD |
48 |
VQCCN |
SQUARE |
UNSPECIFIED |
5 ns |
YES |
1.9 V |
64 |
CMOS |
1.8 |
1.5/3.3,1.8 |
CHIP CARRIER, VERY THIN PROFILE |
LCC48,.27SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 37 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-XQCC-N48 |
3 |
1 mm |
7 mm |
Not Qualified |
REAL DIGITAL DESIGN TECHNOLOGY |
e3 |
333 MHz |
30 |
260 |
7 mm |
YES |
37 |
||||||||
|
Lattice Semiconductor |
EE PLD |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
3.6 V |
64 |
74 |
PAD-TYPE |
3.3 |
3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
83 |
.5 mm |
90 Cel |
10 DEDICATED INPUTS, 64 I/O |
10 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
e3 |
111 MHz |
40 |
64 |
260 |
14 mm |
YES |
64 |
|||||||
|
Xilinx |
FLASH PLD |
INDUSTRIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
64 |
CMOS |
1.8 |
1.5/3.3,1.8 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 64 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
REAL DIGITAL DESIGN TECHNOLOGY |
e3 |
200 MHz |
30 |
260 |
14 mm |
YES |
64 |
||||||||
|
Microchip Technology |
EE PLD |
INDUSTRIAL |
J BEND |
84 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
25 ns |
YES |
5.5 V |
128 |
5 |
TUBE |
3.3/5,5 |
CHIP CARRIER |
LDCC84,1.2SQ |
Programmable Logic Devices |
YES |
MACROCELL |
4.5 V |
1.27 mm |
85 Cel |
0 DEDICATED INPUTS, 64 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J84 |
2 |
4.572 mm |
29.3115 mm |
Not Qualified |
128 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V |
e3 |
33.3 MHz |
29.3115 mm |
YES |
64 |
||||||||||
|
Intel |
FLASH PLD |
OTHER |
BALL |
100 |
BGA |
SQUARE |
PLASTIC/EPOXY |
12 ns |
YES |
1.89 V |
192 |
CMOS |
80 |
1.8 |
1.5/3.3,1.8 |
GRID ARRAY |
BGA100,11X11,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.71 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 80 I/O |
0 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B100 |
3 |
6 mm |
Not Qualified |
IT CAN ALSO OPERATE AT 3.3V |
e1 |
80 |
6 mm |
YES |
80 |
||||||||||
|
Intel |
FLASH PLD |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
6.2 ns |
YES |
2.625 V |
980 |
CMOS |
116 |
2.5 |
1.5/3.3,2.5/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
2.375 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 116 I/O |
0 |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
IT CAN ALSO OPERATE AT 3.3V |
e3 |
30 |
116 |
260 |
20 mm |
YES |
116 |
|||||||
|
Microchip Technology |
FLASH PLD |
INDUSTRIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
15 ns |
YES |
5.5 V |
CMOS |
18 |
PAL-TYPE |
5 |
TUBE |
5 |
CHIP CARRIER |
LDCC20,.4SQ |
Programmable Logic Devices |
MACROCELL |
4.5 V |
64 |
1.27 mm |
85 Cel |
8 DEDICATED INPUTS, 8 I/O |
8 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQCC-J20 |
4.572 mm |
8.966 mm |
Not Qualified |
e3 |
45 MHz |
8 |
8.966 mm |
8 |
||||||||||
|
Intel |
FLASH PLD |
OTHER |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
11.2 ns |
YES |
2.625 V |
1700 |
CMOS |
204 |
2.5 |
1.5/3.3,2.5/3.3 |
GRID ARRAY |
BGA256,16X16,40 |
Programmable Logic Devices |
YES |
MACROCELL |
2.375 V |
1 mm |
85 Cel |
0 DEDICATED INPUTS, 204 I/O |
0 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
2.2 mm |
17 mm |
Not Qualified |
IT CAN ALSO OPERATE AT 3.3V |
e1 |
204 |
17 mm |
YES |
204 |
|||||||||
|
Intel |
FLASH PLD |
OTHER |
BALL |
100 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
8.7 ns |
YES |
2.625 V |
440 |
CMOS |
76 |
2.5 |
1.5/3.3,2.5/3.3 |
GRID ARRAY, LOW PROFILE |
BGA100,10X10,40 |
Programmable Logic Devices |
YES |
MACROCELL |
2.375 V |
1 mm |
85 Cel |
0 DEDICATED INPUTS, 76 I/O |
0 |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B100 |
3 |
1.7 mm |
11 mm |
Not Qualified |
IT CAN ALSO OPERATE AT 3.3V |
e1 |
30 |
76 |
260 |
11 mm |
YES |
76 |
|||||||
|
Lattice Semiconductor |
EE PLD |
COMMERCIAL |
J BEND |
20 |
QCCJ |
SQUARE |
PLASTIC/EPOXY |
15 ns |
YES |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 |
CHIP CARRIER |
LDCC20,.4SQ |
Programmable Logic Devices |
MACROCELL |
4.75 V |
64 |
1.27 mm |
70 Cel |
8 DEDICATED INPUTS, 8 I/O |
8 |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQCC-J20 |
1 |
4.572 mm |
8.9662 mm |
Not Qualified |
e3 |
45.5 MHz |
40 |
8 |
250 |
8.9662 mm |
8 |
||||||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
64 |
CMOS |
1.8 |
1.5/3.3,1.8 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 64 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
REAL DIGITAL DESIGN TECHNOLOGY |
e3 |
200 MHz |
30 |
260 |
14 mm |
YES |
64 |
||||||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
BALL |
56 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
64 |
CMOS |
1.8 |
1.5/3.3,1.8 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA56,10X10,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 45 I/O |
0 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B56 |
3 |
1.35 mm |
6 mm |
Not Qualified |
REAL DIGITAL DESIGN TECHNOLOGY |
e1 |
200 MHz |
30 |
260 |
6 mm |
YES |
45 |
||||||||
|
Lattice Semiconductor |
EE PLD |
COMMERCIAL |
THROUGH-HOLE |
20 |
DIP |
RECTANGULAR |
PLASTIC/EPOXY |
25 ns |
NO |
5.25 V |
CMOS |
18 |
PAL-TYPE |
5 |
5 |
IN-LINE |
DIP20,.3 |
Programmable Logic Devices |
MACROCELL |
4.75 V |
64 |
2.54 mm |
70 Cel |
8 DEDICATED INPUTS, 8 I/O |
8 |
0 Cel |
MATTE TIN |
DUAL |
R-PDIP-T20 |
5.334 mm |
7.62 mm |
Not Qualified |
e3 |
37 MHz |
30 |
8 |
260 |
26.162 mm |
8 |
|||||||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
1.9 V |
256 |
CMOS |
184 |
PLA-TYPE |
1.8 |
1.5/3.3,1.8 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
1 mm |
70 Cel |
0 DEDICATED INPUTS, 184 I/O |
0 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
Not Qualified |
REAL DIGITAL DESIGN TECHNOLOGY |
e1 |
108 MHz |
30 |
184 |
260 |
17 mm |
YES |
184 |
|||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
5 ns |
YES |
3.6 V |
36 |
CMOS |
34 |
3.3 |
2.5/3.3,3.3 |
FLATPACK, THIN PROFILE |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.8 mm |
70 Cel |
0 DEDICATED INPUTS, 34 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
Not Qualified |
YES |
e3 |
138.88 MHz |
30 |
34 |
260 |
10 mm |
YES |
34 |
||||||
|
Intel |
FLASH PLD |
OTHER |
BALL |
144 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
15.1 ns |
YES |
1.89 V |
440 |
CMOS |
116 |
1.8 |
1.5/3.3,1.8 |
GRID ARRAY |
BGA144,13X13,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.71 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS |
0 |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B144 |
3 |
7 mm |
Not Qualified |
IT CAN ALSO OPERATE AT 3.3V |
e1 |
116 |
7 mm |
YES |
116 |
||||||||||
|
Intel |
FLASH PLD |
INDUSTRIAL |
GULL WING |
64 |
QFP |
SQUARE |
PLASTIC |
14 ns |
SURFACE MOUNT |
128 |
CMOS |
AEC-Q100 |
1.2/3.3,1.8 |
FLATPACK |
TQFP64,.35SQ,16 |
Programmable Logic Devices |
YES |
.4 mm |
105 Cel |
-40 Cel |
QUAD |
S-PQFP-G64 |
Not Qualified |
YES |
YES |
|||||||||||||||||||||||
|
Intel |
LOADABLE PLD |
INDUSTRIAL |
GULL WING |
240 |
HFQFP |
SQUARE |
PLASTIC/EPOXY |
.6 ns |
2880 |
YES |
5.25 V |
CMOS |
189 |
5 |
3.3/5 |
FLATPACK, HEAT SINK/SLUG, FINE PITCH |
HQFP240,1.37SQ,20 |
Field Programmable Gate Arrays |
REGISTERED |
4.75 V |
.5 mm |
85 Cel |
4 DEDICATED INPUTS, 189 I/O |
4 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
Not Qualified |
2880 LOGIC ELEMENTS |
e3 |
62.89 MHz |
189 |
32 mm |
189 |
||||||||||
|
Renesas Electronics |
OT PLD |
NO LEAD |
20 |
VQCCN |
RECTANGULAR |
UNSPECIFIED |
YES |
5.5 V |
19 |
13 |
PLA-TYPE |
2.5 |
CHIP CARRIER, VERY THIN PROFILE |
LCC20,.08X.12,16 |
YES |
MACROCELL |
2.3 V |
.4 mm |
85 Cel |
0 DEDICATED INPUTS, 13 I/O |
0 |
-40 Cel |
QUAD |
R-XQCC-N20 |
1 |
.6 mm |
2 mm |
15 |
3 mm |
NO |
13 |
|||||||||||||||||
|
Intel |
FLASH PLD |
INDUSTRIAL |
GULL WING |
144 |
QFP |
SQUARE |
PLASTIC |
10 ns |
SURFACE MOUNT |
980 |
CMOS |
AEC-Q100 |
1.8,1.2/3.3 |
FLATPACK |
QFP144,.87SQ,20 |
Programmable Logic Devices |
YES |
.5 mm |
105 Cel |
-40 Cel |
QUAD |
S-PQFP-G144 |
Not Qualified |
YES |
YES |
|||||||||||||||||||||||
|
Intel |
EE PLD |
COMMERCIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
3.6 V |
64 |
CMOS |
3.3 |
2.5/3.3,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.5 mm |
70 Cel |
0 DEDICATED INPUTS, 66 I/O |
0 |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
Not Qualified |
YES |
e3 |
100 MHz |
14 mm |
YES |
66 |
||||||||||
|
Intel |
EE PLD |
INDUSTRIAL |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
7.5 ns |
YES |
3.6 V |
64 |
CMOS |
68 |
PLA-TYPE |
3.3 |
2.5/3.3,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
TQFP100,.63SQ |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
2048 |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 68 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G100 |
3 |
1.27 mm |
14 mm |
Not Qualified |
e3 |
135.1 MHz |
68 |
14 mm |
YES |
68 |
|||||||
|
Xilinx |
FLASH PLD |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
3.6 V |
144 |
CMOS |
117 |
3.3 |
2.5/3.3,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 117 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
YES |
e3 |
138.88 MHz |
30 |
117 |
260 |
20 mm |
YES |
117 |
||||||
|
Xilinx |
FLASH PLD |
INDUSTRIAL |
GULL WING |
64 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
3.6 V |
36 |
CMOS |
36 |
3.3 |
2.5/3.3,3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP64,.47SQ |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.5 mm |
85 Cel |
0 DEDICATED INPUTS, 36 I/O |
0 |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G64 |
3 |
1.2 mm |
10 mm |
Not Qualified |
YES |
e3 |
138.88 MHz |
30 |
36 |
260 |
10 mm |
YES |
36 |
||||||
|
Xilinx |
FLASH PLD |
COMMERCIAL |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
6 ns |
YES |
1.9 V |
32 |
CMOS |
1.8 |
1.5/3.3,1.8 |
FLATPACK, THIN PROFILE |
LCC32,.2SQ,20 |
Programmable Logic Devices |
YES |
MACROCELL |
1.7 V |
.8 mm |
70 Cel |
33 I/O |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
Not Qualified |
REAL DIGITAL DESIGN TECHNOLOGY |
e3 |
300 MHz |
30 |
260 |
10 mm |
YES |
33 |
|||||||||
|
Xilinx |
FLASH PLD |
INDUSTRIAL |
GULL WING |
44 |
TQFP |
SQUARE |
PLASTIC/EPOXY |
10 ns |
YES |
3.6 V |
36 |
CMOS |
34 |
3.3 |
2.5/3.3,3.3 |
FLATPACK, THIN PROFILE |
TQFP44,.47SQ,32 |
Programmable Logic Devices |
YES |
MACROCELL |
3 V |
.8 mm |
85 Cel |
0 DEDICATED INPUTS, 34 I/O |
0 |
-40 Cel |
NICKEL PALLADIUM GOLD |
QUAD |
S-PQFP-G44 |
3 |
1.2 mm |
10 mm |
Not Qualified |
YES |
e4 |
138.88 MHz |
34 |
10 mm |
YES |
34 |
||||||||
|
Intel |
FLASH PLD |
OTHER |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
11.2 ns |
YES |
2.625 V |
1700 |
CMOS |
272 |
2.5 |
1.5/3.3,2.5/3.3 |
GRID ARRAY |
BGA324,18X18,40 |
Programmable Logic Devices |
YES |
MACROCELL |
2.375 V |
1 mm |
85 Cel |
0 DEDICATED INPUTS, 272 I/O |
0 |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B324 |
3 |
2.2 mm |
19 mm |
Not Qualified |
IT CAN ALSO OPERATE AT 3.3V |
e1 |
30 |
272 |
260 |
19 mm |
YES |
272 |
Programmable Logic Devices (PLDs) are digital circuits that are designed to be programmed by the user to perform specific logic functions. They consist of an array of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes PLDs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
PLDs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the PLD hardware. The resulting configuration data is then loaded onto the PLD, allowing it to perform the desired logic functions.
PLDs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.