Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
52160 |
YES |
1.05 V |
4075 |
CMOS |
250 |
1 |
1 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
.95 V |
1 mm |
85 Cel |
1.05 ns |
4075 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2.6 mm |
23 mm |
Not Qualified |
e1 |
1286 MHz |
30 |
250 |
250 |
23 mm |
|||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
169 |
BGA |
SQUARE |
PLASTIC/EPOXY |
2000 |
YES |
3.15 V |
125 |
246 |
3 |
3/3.3 |
GRID ARRAY |
BGA169,13X13,32 |
Field Programmable Gate Arrays |
2.85 V |
.8 mm |
100 Cel |
125 CLBS |
-40 Cel |
BOTTOM |
S-PBGA-B169 |
3 |
1.55 mm |
11 mm |
Not Qualified |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
NOT SPECIFIED |
246 |
NOT SPECIFIED |
11 mm |
|||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
144 |
QFP |
SQUARE |
PLASTIC/EPOXY |
8000 |
YES |
3.15 V |
500 |
250 |
3 |
3/3.3 |
FLATPACK |
HQFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.85 V |
.5 mm |
85 Cel |
500 CLBS |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
Not Qualified |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
e3 |
30 |
250 |
260 |
20 mm |
|||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
2910 |
YES |
1.575 V |
291 |
65 |
1.5 |
1.5,1.5/3.3 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
85 Cel |
291 CLBS |
0 Cel |
Matte Tin (Sn) - annealed |
QUAD |
S-PQFP-G100 |
3 |
1.2 mm |
14 mm |
Not Qualified |
e3 |
275 MHz |
30 |
65 |
260 |
14 mm |
|||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
8256 |
YES |
1.25 V |
516 |
CMOS |
182 |
1.2 |
1.2,1.5/3.3,3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 Cel |
516 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
Not Qualified |
ALSO REQUIRES 3.3 SUPPLY |
e1 |
402.5 MHz |
174 |
17 mm |
|||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
GULL WING |
144 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
8000 |
YES |
3.15 V |
500 |
250 |
3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
HQFP144,.87SQ,20 |
2.85 V |
.5 mm |
100 Cel |
500 CLBS |
-40 Cel |
QUAD |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
250 |
20 mm |
||||||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
15408 |
YES |
1.25 V |
15408 |
CMOS |
346 |
1.2 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 Cel |
15408 CLBS |
0 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
R-PBGA-B484 |
3 |
2.6 mm |
23 mm |
Not Qualified |
e1 |
472.5 MHz |
30 |
346 |
260 |
23 mm |
|||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
1280 |
YES |
3.465 V |
CMOS |
80 |
2.5 |
2.5/3.3 |
FLATPACK |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 Cel |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G100 |
3 |
Not Qualified |
e3 |
133 MHz |
30 |
80 |
260 |
|||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
324 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
24624 |
YES |
1.25 V |
24624 |
CMOS |
215 |
1.2 |
GRID ARRAY |
BGA324,18X18,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
100 Cel |
24624 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B324 |
3 |
2.2 mm |
19 mm |
Not Qualified |
e1 |
472.5 MHz |
215 |
19 mm |
|||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
256 |
BGA |
SQUARE |
PLASTIC/EPOXY |
6272 |
YES |
392 |
179 |
1.2 |
1.2,1.2/3.3,2.5 |
GRID ARRAY |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1 mm |
392 CLBS |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B256 |
3 |
2.2 mm |
17 mm |
Not Qualified |
e1 |
472.5 MHz |
40 |
179 |
260 |
17 mm |
||||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
169 |
BGA |
SQUARE |
PLASTIC/EPOXY |
4000 |
YES |
3.15 V |
250 |
246 |
3 |
3/3.3 |
GRID ARRAY |
BGA169,13X13,32 |
Field Programmable Gate Arrays |
2.85 V |
.8 mm |
100 Cel |
250 CLBS |
-40 Cel |
BOTTOM |
S-PBGA-B169 |
3 |
1.55 mm |
11 mm |
Not Qualified |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
NOT SPECIFIED |
246 |
NOT SPECIFIED |
11 mm |
|||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
28848 |
YES |
1.25 V |
1803 |
331 |
1.2 |
1.2,1.2/3.3,2.5 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
1803 CLBS |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2.4 mm |
23 mm |
Not Qualified |
e1 |
472.5 MHz |
331 |
23 mm |
||||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
301000 |
YES |
1.13 V |
CMOS |
230 |
1.1 |
1.1,1.2/3.3,2.5 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.07 V |
1 mm |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
2 mm |
23 mm |
Not Qualified |
e1 |
230 |
23 mm |
|||||||||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
144 |
QFP |
SQUARE |
PLASTIC/EPOXY |
2112 |
YES |
3.465 V |
111 |
2.5 |
TRAY |
2.5/3.3 |
FLATPACK |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 Cel |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
e3 |
133 MHz |
30 |
111 |
260 |
20 mm |
|||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
GULL WING |
144 |
QFP |
SQUARE |
PLASTIC/EPOXY |
2112 |
YES |
3.465 V |
264 |
111 |
2.5 |
TRAY |
2.5/3.3 |
FLATPACK |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 Cel |
264 CLBS |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
e3 |
133 MHz |
30 |
111 |
260 |
20 mm |
||||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
24051 |
YES |
1.26 V |
1879 |
CMOS |
226 |
1.2 |
1.2,2.5/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
Field Programmable Gate Arrays |
1.14 V |
.8 mm |
100 Cel |
.26 ns |
1879 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
1.5 mm |
15 mm |
Not Qualified |
e1 |
667 MHz |
30 |
226 |
260 |
15 mm |
|||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
400 |
BGA |
SQUARE |
PLASTIC/EPOXY |
19512 |
YES |
1.26 V |
2168 |
CMOS |
AEC-Q100 |
304 |
1200000 |
1.2 |
1.2,1.2/3.3,2.5 |
GRID ARRAY |
BGA400,20X20,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
85 Cel |
4.88 ns |
2168 CLBS, 1200000 GATES |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B400 |
3 |
2.43 mm |
21 mm |
Not Qualified |
e1 |
572 MHz |
30 |
232 |
250 |
21 mm |
|||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
GULL WING |
100 |
TFQFP |
SQUARE |
PLASTIC/EPOXY |
1280 |
YES |
1.26 V |
160 |
CMOS |
72 |
1.2 |
1.2 |
FLATPACK, THIN PROFILE, FINE PITCH |
TQFP100,.63SQ |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 Cel |
7.3 ns |
160 CLBS |
-40 Cel |
QUAD |
S-PQFP-G100 |
1.2 mm |
14 mm |
Not Qualified |
133 MHz |
NOT SPECIFIED |
72 |
NOT SPECIFIED |
14 mm |
||||||||||
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
4320 |
YES |
3.465 V |
114 |
2.5 |
TRAY |
2.5/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 Cel |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
e3 |
NOT SPECIFIED |
114 |
260 |
20 mm |
|||||||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
12800 |
YES |
1.05 V |
1000 |
100 |
1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,40 |
.95 V |
1 mm |
100 Cel |
1.27 ns |
1000 CLBS |
-40 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B196 |
1.55 mm |
15 mm |
e3 |
1098 MHz |
100 |
15 mm |
||||||||||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
16640 |
YES |
1.05 V |
1300 |
250 |
1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA256,16X16,40 |
.95 V |
1 mm |
100 Cel |
1.27 ns |
1300 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
e1 |
1098 MHz |
30 |
250 |
260 |
17 mm |
|||||||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
225 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
9152 |
YES |
1.26 V |
715 |
CMOS |
160 |
1.2 |
1.2,2.5/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA225,15X15,32 |
Field Programmable Gate Arrays |
1.14 V |
.8 mm |
85 Cel |
.21 ns |
715 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B225 |
3 |
1.4 mm |
13 mm |
Not Qualified |
e1 |
862 MHz |
30 |
160 |
260 |
13 mm |
|||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
101440 |
YES |
1.05 V |
7925 |
CMOS |
285 |
1 |
1 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
.95 V |
1 mm |
85 Cel |
1.27 ns |
7925 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2.6 mm |
23 mm |
Not Qualified |
e1 |
1098 MHz |
30 |
285 |
250 |
23 mm |
|||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
52160 |
YES |
1.05 V |
4075 |
250 |
1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
.95 V |
.8 mm |
100 Cel |
1.27 ns |
4075 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
1.5 mm |
15 mm |
e1 |
1098 MHz |
250 |
15 mm |
||||||||||||||
Altera |
FIELD PROGRAMMABLE GATE ARRAY |
|||||||||||||||||||||||||||||||||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
AUTOMOTIVE |
BALL |
169 |
BGA |
SQUARE |
PLASTIC/EPOXY |
8000 |
YES |
3.15 V |
500 |
250 |
3 |
GRID ARRAY |
BGA169,13X13,32 |
2.85 V |
.8 mm |
125 Cel |
500 CLBS |
-40 Cel |
BOTTOM |
S-PBGA-B169 |
1.55 mm |
11 mm |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
NOT SPECIFIED |
250 |
NOT SPECIFIED |
11 mm |
|||||||||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
153 |
BGA |
SQUARE |
PLASTIC/EPOXY |
8000 |
YES |
3.15 V |
500 |
250 |
3 |
3/3.3 |
GRID ARRAY |
BGA153,15X15,20 |
Field Programmable Gate Arrays |
2.85 V |
.5 mm |
100 Cel |
500 CLBS |
-40 Cel |
BOTTOM |
S-PBGA-B153 |
3 |
1 mm |
8 mm |
Not Qualified |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
NOT SPECIFIED |
250 |
NOT SPECIFIED |
8 mm |
|||||||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
43661 |
YES |
1.26 V |
3411 |
CMOS |
296 |
1.2 |
1.2,2.5/3.3 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
100 Cel |
.21 ns |
3411 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2.6 mm |
23 mm |
Not Qualified |
e1 |
862 MHz |
30 |
296 |
250 |
23 mm |
|||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
16640 |
YES |
1.05 V |
1300 |
250 |
1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA256,16X16,40 |
.95 V |
1 mm |
100 Cel |
.94 ns |
1300 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
e1 |
1412 MHz |
30 |
250 |
260 |
17 mm |
|||||||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
101440 |
YES |
1.05 V |
7925 |
300 |
1 |
1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
.95 V |
1 mm |
100 Cel |
1.27 ns |
7925 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
Not Qualified |
e1 |
1098 MHz |
30 |
300 |
260 |
17 mm |
||||||||
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
4608 |
YES |
1.25 V |
288 |
CMOS |
89 |
1.2 |
1.2,1.5/3.3,3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 Cel |
288 CLBS |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
ALSO REQUIRES 3.3 SUPPLY |
e3 |
450 MHz |
81 |
20 mm |
|||||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
14579 |
YES |
1.26 V |
1139 |
CMOS |
232 |
1.2 |
1.2,2.5/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
Field Programmable Gate Arrays |
1.14 V |
.8 mm |
100 Cel |
.21 ns |
1139 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
1.5 mm |
15 mm |
Not Qualified |
e1 |
862 MHz |
30 |
232 |
260 |
15 mm |
|||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
14579 |
YES |
1.26 V |
1139 |
CMOS |
232 |
1.2 |
1.2,2.5/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
Field Programmable Gate Arrays |
1.14 V |
.8 mm |
85 Cel |
.26 ns |
1139 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
1.5 mm |
15 mm |
Not Qualified |
e1 |
667 MHz |
30 |
232 |
260 |
15 mm |
|||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
33280 |
YES |
1.05 V |
2600 |
250 |
1 |
1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
.95 V |
1 mm |
85 Cel |
1.05 ns |
2600 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
Not Qualified |
e1 |
1286 MHz |
30 |
250 |
260 |
17 mm |
||||||||
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
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Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
324 |
BGA |
RECTANGULAR |
PLASTIC/EPOXY |
24624 |
YES |
1.25 V |
24624 |
CMOS |
215 |
1.2 |
GRID ARRAY |
BGA324,18X18,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 Cel |
24624 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
R-PBGA-B324 |
3 |
2.2 mm |
19 mm |
Not Qualified |
e1 |
472.5 MHz |
215 |
19 mm |
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Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.25 V |
1539 |
1.2 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
1.15 V |
.8 mm |
100 Cel |
1539 CLBS |
-40 Cel |
Tin/Silver/Copper (Sn/Ag/Cu) |
BOTTOM |
S-PBGA-B256 |
3 |
1.5 mm |
14 mm |
e1 |
30 |
260 |
14 mm |
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Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
TIN SILVER COPPER |
3 |
e1 |
30 |
260 |
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Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
225 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
23360 |
YES |
1.05 V |
1825 |
150 |
1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA225,15X15,32 |
.95 V |
.8 mm |
85 Cel |
1.27 ns |
1825 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B225 |
1.4 mm |
13 mm |
e1 |
1098 MHz |
150 |
13 mm |
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Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
6864 |
YES |
3.465 V |
114 |
2.5 |
TRAY |
2.5/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 Cel |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
e3 |
30 |
114 |
260 |
20 mm |
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Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
24051 |
YES |
1.26 V |
1879 |
CMOS |
226 |
1.2 |
1.2,2.5/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
Field Programmable Gate Arrays |
1.14 V |
.8 mm |
85 Cel |
.26 ns |
1879 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
1.5 mm |
15 mm |
Not Qualified |
e1 |
667 MHz |
30 |
226 |
260 |
15 mm |
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Intel |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
75408 |
YES |
1.25 V |
4713 |
295 |
1.2 |
1.2,1.2/3.3,2.5 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
4713 CLBS |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2.4 mm |
23 mm |
Not Qualified |
e1 |
472.5 MHz |
295 |
23 mm |
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Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
240 |
FQFP |
RECTANGULAR |
PLASTIC/EPOXY |
15408 |
YES |
1.25 V |
15408 |
CMOS |
160 |
1.2 |
FLATPACK, FINE PITCH |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 Cel |
15408 CLBS |
0 Cel |
MATTE TIN |
QUAD |
R-PQFP-G240 |
3 |
4.1 mm |
32 mm |
Not Qualified |
e3 |
472.5 MHz |
160 |
32 mm |
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Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
74637 |
YES |
1.26 V |
5831 |
CMOS |
280 |
1.2 |
1.2,2.5/3.3 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
100 Cel |
.26 ns |
5831 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2.6 mm |
23 mm |
Not Qualified |
e1 |
667 MHz |
30 |
280 |
250 |
23 mm |
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Microchip Technology |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
GULL WING |
208 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
YES |
1.575 V |
6144 |
CMOS |
250000 |
1.5 |
TRAY |
FLATPACK, FINE PITCH |
1.425 V |
.5 mm |
100 Cel |
6144 CLBS, 250000 GATES |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G208 |
3 |
4.1 mm |
28 mm |
Not Qualified |
e3 |
350 MHz |
30 |
245 |
28 mm |
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Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
23360 |
YES |
.98 V |
1825 |
150 |
0.95 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,40 |
.92 V |
1 mm |
100 Cel |
1.27 ns |
1825 CLBS |
-40 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B196 |
1.55 mm |
15 mm |
e3 |
1098 MHz |
150 |
15 mm |
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Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
GULL WING |
144 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
8000 |
YES |
3.15 V |
500 |
250 |
3 |
3/3.3 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
HQFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.85 V |
.5 mm |
100 Cel |
500 CLBS |
-40 Cel |
QUAD |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
Not Qualified |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
250 |
20 mm |
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Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
YES |
1.05 V |
16825 |
1 |
GRID ARRAY |
.95 V |
1 mm |
100 Cel |
1.05 ns |
16825 CLBS |
-40 Cel |
TIN LEAD |
BOTTOM |
S-PBGA-B676 |
4 |
2.54 mm |
27 mm |
e0 |
30 |
225 |
27 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.