Part | RoHS | Manufacturer | Programmable IC Type | Grading Of Temperature | Form Of Terminal | No. of Terminals | Package Code | Package Shape | Total Dose (V) | Package Body Material | No. of Logic Cells | Surface Mount | Maximum Supply Voltage | No. of CLBs | Technology Used | Screening Level | No. of Inputs | No. of Equivalent Gates | Nominal Supply Voltage (V) | Packing Method | Power Supplies (V) | Package Style (Meter) | Package Equivalence Code | Sub-Category | Minimum Supply Voltage | Pitch Of Terminal | Maximum Operating Temperature | Maximum Combinatorial Delay of a CLB | Organization | Minimum Operating Temperature | Finishing Of Terminal Used | Position Of Terminal | JESD-30 Code | Moisture Sensitivity Level (MSL) | Maximum Seated Height | Width | Qualification | Additional Features | JESD-609 Code | Maximum Clock Frequency | Maximum Time At Peak Reflow Temperature (s) | No. of Outputs | Peak Reflow Temperature (C) | Length |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
16640 |
YES |
1.05 V |
1300 |
250 |
1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA256,16X16,40 |
.95 V |
1 mm |
85 Cel |
1.27 ns |
1300 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
e1 |
1098 MHz |
30 |
250 |
260 |
17 mm |
||||||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
325 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
33280 |
YES |
1.05 V |
2600 |
250 |
1 |
1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA325,18X18,32 |
Field Programmable Gate Arrays |
.95 V |
.8 mm |
100 Cel |
1.05 ns |
2600 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B325 |
3 |
1.5 mm |
15 mm |
Not Qualified |
e1 |
1286 MHz |
30 |
250 |
260 |
15 mm |
|||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
GULL WING |
144 |
QFP |
SQUARE |
PLASTIC/EPOXY |
2000 |
YES |
3.15 V |
125 |
246 |
3 |
3/3.3 |
FLATPACK |
HQFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.85 V |
.5 mm |
100 Cel |
125 CLBS |
-40 Cel |
QUAD |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
Not Qualified |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
NOT SPECIFIED |
246 |
NOT SPECIFIED |
20 mm |
||||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
NO LEAD |
32 |
HVQCCN |
SQUARE |
UNSPECIFIED |
256 |
YES |
3.465 V |
32 |
21 |
2.5 |
TRAY |
2.5/3.3 |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC32,.2SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 Cel |
32 CLBS |
-40 Cel |
QUAD |
S-XQCC-N32 |
3 |
.6 mm |
5 mm |
Not Qualified |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
NOT SPECIFIED |
21 |
NOT SPECIFIED |
5 mm |
||||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
640 |
YES |
3.6 V |
80 |
40 |
2.5 |
TRAY |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.27SQ,20 |
2.375 V |
.5 mm |
100 Cel |
80 CLBS |
-40 Cel |
QUAD |
S-XQCC-N48 |
3 |
1 mm |
7 mm |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
40 |
260 |
7 mm |
||||||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
144 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
22320 |
YES |
1.25 V |
1395 |
79 |
1.2 |
1.2,1.2/3.3,2.5 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 Cel |
1395 CLBS |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
Not Qualified |
e3 |
472.5 MHz |
79 |
20 mm |
||||||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
75520 |
YES |
1.05 V |
5900 |
300 |
1 |
1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
.95 V |
1 mm |
85 Cel |
1.05 ns |
5900 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
Not Qualified |
e1 |
1286 MHz |
30 |
300 |
260 |
17 mm |
|||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
240 |
FQFP |
SQUARE |
PLASTIC/EPOXY |
12060 |
YES |
1.575 V |
1206 |
173 |
1.5 |
1.5,1.5/3.3 |
FLATPACK, FINE PITCH |
QFP240,1.3SQ,20 |
Field Programmable Gate Arrays |
1.425 V |
.5 mm |
85 Cel |
1206 CLBS |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G240 |
3 |
4.1 mm |
32 mm |
Not Qualified |
e3 |
275 MHz |
173 |
32 mm |
||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
144 |
QFP |
SQUARE |
PLASTIC/EPOXY |
2000 |
YES |
3.15 V |
125 |
246 |
3 |
3/3.3 |
FLATPACK |
HQFP144,.87SQ,20 |
Field Programmable Gate Arrays |
2.85 V |
.5 mm |
85 Cel |
125 CLBS |
0 Cel |
QUAD |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
Not Qualified |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
NOT SPECIFIED |
246 |
NOT SPECIFIED |
20 mm |
||||||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
GULL WING |
144 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
3840 |
YES |
1.26 V |
300 |
CMOS |
100 |
1.2 |
1.2,2.5/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.14 V |
.5 mm |
100 Cel |
.26 ns |
300 CLBS |
-40 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
e3 |
667 MHz |
30 |
100 |
260 |
20 mm |
||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
28848 |
YES |
1.25 V |
1803 |
331 |
1.2 |
1.2,1.2/3.3,2.5 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 Cel |
1803 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2.4 mm |
23 mm |
Not Qualified |
e1 |
472.5 MHz |
331 |
23 mm |
||||||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
24051 |
YES |
1.26 V |
1879 |
CMOS |
186 |
1.2 |
1.2,2.5/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
100 Cel |
.26 ns |
1879 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
Not Qualified |
e1 |
667 MHz |
30 |
186 |
260 |
17 mm |
||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
144 |
HLFQFP |
SQUARE |
PLASTIC/EPOXY |
10320 |
YES |
1.25 V |
645 |
91 |
1.2 |
1.2,1.2/3.3,2.5 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 Cel |
645 CLBS |
0 Cel |
MATTE TIN |
QUAD |
S-PQFP-G144 |
3 |
1.65 mm |
20 mm |
Not Qualified |
e3 |
472.5 MHz |
91 |
20 mm |
||||||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
101440 |
YES |
1.05 V |
7925 |
CMOS |
300 |
1 |
1 |
GRID ARRAY |
BGA676,26X26,40 |
Field Programmable Gate Arrays |
.95 V |
1 mm |
85 Cel |
1.27 ns |
7925 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B676 |
3 |
2.44 mm |
27 mm |
Not Qualified |
e1 |
1098 MHz |
30 |
300 |
250 |
27 mm |
||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
33280 |
YES |
1.05 V |
2600 |
CMOS |
250 |
1 |
1 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
.95 V |
1 mm |
85 Cel |
1.27 ns |
2600 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2.6 mm |
23 mm |
Not Qualified |
e1 |
1098 MHz |
30 |
250 |
250 |
23 mm |
||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
6000 |
YES |
1.05 V |
469 |
100 |
1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,40 |
.95 V |
1 mm |
85 Cel |
1.27 ns |
469 CLBS |
0 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B196 |
1.55 mm |
15 mm |
e3 |
1098 MHz |
100 |
15 mm |
|||||||||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
484 |
FBGA |
SQUARE |
PLASTIC/EPOXY |
74637 |
YES |
1.26 V |
5831 |
CMOS |
328 |
1.2 |
1.2,2.5/3.3 |
GRID ARRAY, FINE PITCH |
BGA484,22X22,32 |
Field Programmable Gate Arrays |
1.14 V |
.8 mm |
100 Cel |
.21 ns |
5831 CLBS |
-40 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
S-PBGA-B484 |
3 |
1.8 mm |
19 mm |
Not Qualified |
e1 |
862 MHz |
30 |
328 |
260 |
19 mm |
||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
1156 |
BGA |
SQUARE |
PLASTIC/EPOXY |
215360 |
YES |
1.05 V |
16825 |
500 |
1 |
1 |
GRID ARRAY |
BGA1156,34X34,40 |
Field Programmable Gate Arrays |
.95 V |
1 mm |
100 Cel |
.94 ns |
16825 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B1156 |
4 |
3.1 mm |
35 mm |
Not Qualified |
e1 |
1412 MHz |
30 |
500 |
245 |
35 mm |
|||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
9152 |
YES |
1.26 V |
715 |
CMOS |
186 |
1.2 |
1.2,2.5/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
100 Cel |
.26 ns |
715 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
Not Qualified |
e1 |
667 MHz |
30 |
186 |
260 |
17 mm |
||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
169 |
BGA |
SQUARE |
PLASTIC/EPOXY |
8000 |
YES |
3.15 V |
500 |
250 |
3 |
GRID ARRAY |
BGA169,13X13,32 |
2.85 V |
.8 mm |
85 Cel |
500 CLBS |
0 Cel |
BOTTOM |
S-PBGA-B169 |
3 |
1.55 mm |
11 mm |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
NOT SPECIFIED |
250 |
NOT SPECIFIED |
11 mm |
|||||||||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
215360 |
YES |
1.05 V |
16825 |
CMOS |
400 |
1 |
1 |
GRID ARRAY |
BGA676,26X26,40 |
Field Programmable Gate Arrays |
.95 V |
1 mm |
100 Cel |
1.05 ns |
16825 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B676 |
4 |
2.54 mm |
27 mm |
Not Qualified |
e1 |
1286 MHz |
30 |
400 |
250 |
27 mm |
|||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
43661 |
YES |
1.26 V |
3411 |
CMOS |
218 |
1.2 |
1.2,2.5/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
Field Programmable Gate Arrays |
1.14 V |
.8 mm |
85 Cel |
.26 ns |
3411 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
1.5 mm |
15 mm |
Not Qualified |
e1 |
667 MHz |
30 |
218 |
260 |
15 mm |
||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
75520 |
YES |
1.05 V |
5900 |
CMOS |
285 |
1 |
1 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
.95 V |
1 mm |
100 Cel |
1.05 ns |
5900 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2.6 mm |
23 mm |
Not Qualified |
e1 |
1286 MHz |
30 |
285 |
250 |
23 mm |
|||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
1156 |
BGA |
SQUARE |
PLASTIC/EPOXY |
215360 |
YES |
1.05 V |
16825 |
500 |
1 |
1 |
GRID ARRAY |
BGA1156,34X34,40 |
Field Programmable Gate Arrays |
.95 V |
1 mm |
100 Cel |
1.05 ns |
16825 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B1156 |
4 |
3.1 mm |
35 mm |
Not Qualified |
e1 |
1286 MHz |
30 |
500 |
245 |
35 mm |
|||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
324 |
BGA |
SQUARE |
PLASTIC/EPOXY |
4000 |
YES |
1.25 V |
250 |
246 |
1.2 |
1.2 |
GRID ARRAY |
BGA324,18X18,32 |
Field Programmable Gate Arrays |
1.15 V |
.8 mm |
100 Cel |
250 CLBS |
-40 Cel |
BOTTOM |
S-PBGA-B324 |
3 |
1.55 mm |
15 mm |
Not Qualified |
NOT SPECIFIED |
246 |
NOT SPECIFIED |
15 mm |
|||||||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
14579 |
YES |
1.26 V |
1139 |
CMOS |
186 |
1.2 |
1.2,2.5/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
85 Cel |
.26 ns |
1139 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
Not Qualified |
e1 |
667 MHz |
30 |
186 |
260 |
17 mm |
||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
43661 |
YES |
1.26 V |
3411 |
CMOS |
296 |
1.2 |
1.2,2.5/3.3 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
85 Cel |
.21 ns |
3411 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2.6 mm |
23 mm |
Not Qualified |
e1 |
862 MHz |
30 |
296 |
250 |
23 mm |
||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
6000 |
YES |
1.05 V |
469 |
100 |
1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,40 |
.95 V |
1 mm |
100 Cel |
1.05 ns |
469 CLBS |
-40 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B196 |
1.55 mm |
15 mm |
e3 |
1286 MHz |
100 |
15 mm |
|||||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
149500 |
YES |
1.13 V |
CMOS |
240 |
1.1 |
1.1,1.2/3.3,2.5 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.07 V |
1 mm |
BOTTOM |
S-PBGA-B484 |
2 mm |
23 mm |
Not Qualified |
NOT SPECIFIED |
240 |
NOT SPECIFIED |
23 mm |
||||||||||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
100 |
LFQFP |
SQUARE |
PLASTIC/EPOXY |
640 |
YES |
3.465 V |
80 |
78 |
2.5 |
TRAY |
2.5/3.3 |
FLATPACK, LOW PROFILE, FINE PITCH |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
85 Cel |
80 CLBS |
0 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
e3 |
30 |
78 |
260 |
14 mm |
|||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
162240 |
YES |
1.03 V |
12675 |
CMOS |
400 |
1 |
1,1.8,3.3 |
GRID ARRAY |
BGA676,26X26,40 |
Field Programmable Gate Arrays |
.97 V |
1 mm |
100 Cel |
.61 ns |
12675 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B676 |
4 |
3.37 mm |
27 mm |
Not Qualified |
e1 |
1286 MHz |
30 |
400 |
250 |
27 mm |
||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
52160 |
YES |
1.05 V |
4075 |
250 |
1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,40 |
.95 V |
1 mm |
100 Cel |
1.05 ns |
4075 CLBS |
-40 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B196 |
1.55 mm |
15 mm |
e3 |
1286 MHz |
250 |
15 mm |
|||||||||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
GULL WING |
100 |
QFP |
SQUARE |
PLASTIC/EPOXY |
2112 |
YES |
3.465 V |
79 |
2.5 |
TRAY |
2.5/3.3 |
FLATPACK |
QFP100,.63SQ,20 |
Field Programmable Gate Arrays |
2.375 V |
.5 mm |
100 Cel |
-40 Cel |
Matte Tin (Sn) |
QUAD |
S-PQFP-G100 |
3 |
1.6 mm |
14 mm |
Not Qualified |
ALSO OPERATES AT 3.3 V NOMINAL SUPPLY |
e3 |
133 MHz |
30 |
79 |
260 |
14 mm |
|||||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
238 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
12800 |
YES |
1.05 V |
1000 |
HKMG |
150 |
1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA238,19X19,20 |
.95 V |
.5 mm |
100 Cel |
1.05 ns |
1000 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B238 |
1.38 mm |
10 mm |
e1 |
1286 MHz |
150 |
10 mm |
||||||||||||
Altera |
FIELD PROGRAMMABLE GATE ARRAY |
|||||||||||||||||||||||||||||||||||||||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
101440 |
YES |
1.05 V |
7925 |
CMOS |
285 |
1 |
1 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
.95 V |
1 mm |
85 Cel |
1.05 ns |
7925 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2.6 mm |
23 mm |
Not Qualified |
e1 |
1286 MHz |
30 |
285 |
250 |
23 mm |
||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
6000 |
YES |
1.05 V |
469 |
100 |
1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,40 |
.95 V |
1 mm |
100 Cel |
1.27 ns |
469 CLBS |
-40 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B196 |
1.55 mm |
15 mm |
e3 |
1098 MHz |
100 |
15 mm |
|||||||||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
24051 |
YES |
1.26 V |
1879 |
CMOS |
190 |
1.2 |
1.2,2.5/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
Field Programmable Gate Arrays |
1.14 V |
.8 mm |
85 Cel |
.26 ns |
1879 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
1.5 mm |
15 mm |
Not Qualified |
e1 |
667 MHz |
30 |
190 |
260 |
15 mm |
||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
INDUSTRIAL |
BALL |
324 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
14579 |
YES |
1.26 V |
1139 |
CMOS |
232 |
1.2 |
1.2,2.5/3.3 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA324,18X18,32 |
Field Programmable Gate Arrays |
1.14 V |
.8 mm |
100 Cel |
.26 ns |
1139 CLBS |
-40 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B324 |
3 |
1.5 mm |
15 mm |
Not Qualified |
e1 |
667 MHz |
30 |
232 |
260 |
15 mm |
||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
196 |
LFBGA |
SQUARE |
PLASTIC/EPOXY |
23360 |
YES |
1.05 V |
1825 |
150 |
1 |
GRID ARRAY, LOW PROFILE, FINE PITCH |
BGA196,14X14,40 |
.95 V |
1 mm |
85 Cel |
1.27 ns |
1825 CLBS |
0 Cel |
MATTE TIN |
BOTTOM |
S-PBGA-B196 |
1.55 mm |
15 mm |
e3 |
1098 MHz |
150 |
15 mm |
|||||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
GULL WING |
144 |
LFQFP |
RECTANGULAR |
PLASTIC/EPOXY |
5136 |
YES |
1.25 V |
5136 |
CMOS |
94 |
1.2 |
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH |
QFP144,.87SQ,20 |
Field Programmable Gate Arrays |
1.15 V |
.5 mm |
85 Cel |
5136 CLBS |
0 Cel |
MATTE TIN |
QUAD |
R-PQFP-G144 |
3 |
1.6 mm |
20 mm |
Not Qualified |
e3 |
94 |
20 mm |
|||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
22320 |
YES |
1.25 V |
1395 |
153 |
1.2 |
1.2,1.2/3.3,2.5 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 Cel |
1395 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
Not Qualified |
e1 |
472.5 MHz |
153 |
17 mm |
||||||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
33280 |
YES |
1.05 V |
2600 |
CMOS |
250 |
1 |
1 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
.95 V |
1 mm |
1.05 ns |
2600 CLBS |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B484 |
3 |
2.6 mm |
23 mm |
Not Qualified |
e1 |
1286 MHz |
30 |
250 |
250 |
23 mm |
|||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
10320 |
YES |
1.03 V |
10320 |
179 |
1 |
1.2,1.2/3.3,2.5 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
.97 V |
1 mm |
85 Cel |
10320 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
Not Qualified |
IT CAN ASO OPERATE AT 1.2V SUPPLY |
e1 |
472.5 MHz |
179 |
17 mm |
|||||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
676 |
BGA |
SQUARE |
PLASTIC/EPOXY |
162240 |
YES |
1.03 V |
12675 |
CMOS |
400 |
1 |
1,1.8,3.3 |
GRID ARRAY |
BGA676,26X26,40 |
Field Programmable Gate Arrays |
.97 V |
1 mm |
85 Cel |
.74 ns |
12675 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B676 |
4 |
2.54 mm |
27 mm |
Not Qualified |
e1 |
1098 MHz |
30 |
400 |
250 |
27 mm |
||||||
|
Xilinx |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
256 |
LBGA |
SQUARE |
PLASTIC/EPOXY |
24051 |
YES |
1.26 V |
1879 |
CMOS |
186 |
1.2 |
1.2,2.5/3.3 |
GRID ARRAY, LOW PROFILE |
BGA256,16X16,40 |
Field Programmable Gate Arrays |
1.14 V |
1 mm |
85 Cel |
.26 ns |
1879 CLBS |
0 Cel |
TIN SILVER COPPER |
BOTTOM |
S-PBGA-B256 |
3 |
1.55 mm |
17 mm |
Not Qualified |
e1 |
667 MHz |
30 |
186 |
260 |
17 mm |
||||||
|
Lattice Semiconductor |
FIELD PROGRAMMABLE GATE ARRAY |
NO LEAD |
48 |
HVQCCN |
SQUARE |
UNSPECIFIED |
5280 |
YES |
1.26 V |
660 |
CMOS |
39 |
1.2 |
TR |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
LCC48,.24SQ,20 |
1.14 V |
.5 mm |
100 Cel |
660 CLBS |
-40 Cel |
QUAD |
S-XQCC-N48 |
3 |
1 mm |
7 mm |
30 |
39 |
260 |
7 mm |
|||||||||||||
|
Intel |
FIELD PROGRAMMABLE GATE ARRAY |
OTHER |
BALL |
484 |
BGA |
SQUARE |
PLASTIC/EPOXY |
15408 |
YES |
1.25 V |
963 |
346 |
1.2 |
1.2,1.2/3.3,2.5 |
GRID ARRAY |
BGA484,22X22,40 |
Field Programmable Gate Arrays |
1.15 V |
1 mm |
85 Cel |
963 CLBS |
0 Cel |
Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) |
BOTTOM |
S-PBGA-B484 |
3 |
2.4 mm |
23 mm |
Not Qualified |
e1 |
472.5 MHz |
30 |
346 |
260 |
23 mm |
Field Programmable Gate Arrays (FPGAs) are digital integrated circuits that are programmable by the user to perform specific logic functions. They consist of a matrix of configurable logic blocks (CLBs) that can be programmed to perform any digital function, as well as programmable interconnects that allow these blocks to be connected in any way the designer wishes. This makes FPGAs highly versatile and customizable, and they are often used in applications where a high degree of flexibility and performance is required.
FPGAs are programmed using specialized software tools that allow the designer to specify the logic functions and interconnects that are required for a particular application. This process is known as synthesis and involves translating the high-level design into a format that can be implemented on the FPGA hardware. The resulting configuration data is then loaded onto the FPGA, allowing it to perform the desired logic functions.
FPGAs are used in a wide range of applications, including digital signal processing, computer networking, and high-performance computing. They offer a number of advantages over traditional fixed-function digital circuits, including the ability to be reprogrammed in the field, lower development costs, and faster time-to-market. However, they also have some disadvantages, including higher power consumption and lower performance compared to custom-designed digital circuits.