FRAMs

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Part RoHS Manufacturer Memory IC Type No. of Terminals Package Code Package Shape Total Dose (V) Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Maximum Supply Current No. of Words Nominal Supply Voltage / Vsup (V) Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Organization No. of Words Code Minimum Standby Voltage Minimum Operating Temperature Terminal Finish Terminal Position Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Serial Bus Type Memory Density Minimum Supply Voltage (Vsup) Additional Features JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Maximum Standby Current Length Maximum Access Time

FM25040B-GA

Infineon Technologies

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

3 mA

512 words

5

8

SMALL OUTLINE

SOP8,.25

11

1.27 mm

125 Cel

512X8

512

4.5 V

-40 Cel

DUAL

HARDWARE/SOFWARE

R-PDSO-G8

5.5 V

1.727 mm

10000000000000 Write/Erase Cycles

14 MHz

3.8985 mm

SPI

4096 bit

4.5 V

.00003 Amp

4.889 mm

FM25040B-GATR

Infineon Technologies

FRAM

8

SOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100

GULL WING

SERIAL

SYNCHRONOUS

3 mA

512 words

5

8

SMALL OUTLINE

SOP8,.25

11

1.27 mm

125 Cel

512X8

512

4.5 V

-40 Cel

DUAL

HARDWARE/SOFWARE

R-PDSO-G8

5.5 V

1.727 mm

10000000000000 Write/Erase Cycles

14 MHz

3.8985 mm

SPI

4096 bit

4.5 V

.00003 Amp

4.889 mm

CY15V108QN-50BKXI

Infineon Technologies

FRAM

24

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

4.5 mA

1048576 words

1.8

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA24,5X5,40

10

1 mm

85 Cel

1MX8

1M

1.71 V

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

1.89 V

1.2 mm

1000000000000000 Write/Erase Cycles

50 MHz

6 mm

SPI

8388608 bit

1.71 V

.000135 Amp

8 mm

CY15B108QN-50BKXIT

Infineon Technologies

FRAM

24

TFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

4.5 mA

1048576 words

3.3

8

GRID ARRAY, THIN PROFILE, FINE PITCH

BGA24,5X5,40

10

1 mm

85 Cel

1MX8

1M

1.8 V

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

1000000000000000 Write/Erase Cycles

50 MHz

6 mm

SPI

8388608 bit

1.8 V

.000135 Amp

8 mm

CY15B108QN-50BKXQT

Infineon Technologies

FRAM

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

8 mA

1048576 words

3.3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

1

1 mm

105 Cel

1MX8

1M

1.8 V

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000000000000 Write/Erase Cycles

50 MHz

6 mm

SPI

8388608 bit

1.8 V

2kv ESD available

.000305 Amp

8 mm

CY15V108QN-50BKXQT

Infineon Technologies

FRAM

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

7.5 mA

1048576 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

1

1 mm

105 Cel

1MX8

1M

1.71 V

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

1.89 V

1.2 mm

100000000000000 Write/Erase Cycles

50 MHz

6 mm

SPI

8388608 bit

1.71 V

2kv ESD available

.0003 Amp

8 mm

CY15V108QN-50BKXQ

Infineon Technologies

FRAM

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

7.5 mA

1048576 words

1.8

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

1

1 mm

105 Cel

1MX8

1M

1.71 V

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

1.89 V

1.2 mm

100000000000000 Write/Erase Cycles

50 MHz

6 mm

SPI

8388608 bit

1.71 V

2kv ESD available

.0003 Amp

8 mm

CY15V116QN-40BKXQT

Infineon Technologies

FRAM

CY15B116QN-40BKXQT

Infineon Technologies

FRAM

CY15B108QN-50BKXQ

Infineon Technologies

FRAM

24

TBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

SERIAL

SYNCHRONOUS

8 mA

1048576 words

3.3

8

GRID ARRAY, THIN PROFILE

BGA24,5X5,40

1

1 mm

105 Cel

1MX8

1M

1.8 V

-40 Cel

BOTTOM

HARDWARE/SOFTWARE

R-PBGA-B24

3.6 V

1.2 mm

100000000000000 Write/Erase Cycles

50 MHz

6 mm

SPI

8388608 bit

1.8 V

2kv ESD available

.000305 Amp

8 mm

CY15V108QSN-108BKXQ

Infineon Technologies

FRAM

CY15V116QSN-108BKXQ

Infineon Technologies

FRAM

CY15V108QSN-108BKXQT

Infineon Technologies

FRAM

CY15B116QSN-108BKXQT

Infineon Technologies

FRAM

CY15B108QSN-108BKXQ

Infineon Technologies

FRAM

CY15V116QSN-108BKXQT

Infineon Technologies

FRAM

CY15B108QSN-108BKXQT

Infineon Technologies

FRAM

CY15B116QSN-108BKXQ

Infineon Technologies

FRAM

CY15V104Q-PZXI

Infineon Technologies

FRAM

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

SYNCHRONOUS

3 mA

524288 words

1.8

8

IN-LINE

DIP8,.3

10

2.54 mm

85 Cel

512KX8

512K

1.71 V

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDIP-T8

1.89 V

4.572 mm

1000000000000000 Write/Erase Cycles

40 MHz

7.62 mm

SPI

4194304 bit

1.71 V

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE

.00007 Amp

9.779 mm

CY15B104Q-PZXI

Infineon Technologies

FRAM

8

DIP

RECTANGULAR

PLASTIC/EPOXY

NO

1

CMOS

THROUGH-HOLE

SERIAL

SYNCHRONOUS

3 mA

524288 words

3.3

8

IN-LINE

DIP8,.3

10

2.54 mm

85 Cel

512KX8

512K

1.8 V

-40 Cel

DUAL

HARDWARE/SOFTWARE

R-PDIP-T8

3.6 V

4.572 mm

1000000000000000 Write/Erase Cycles

40 MHz

7.62 mm

SPI

4194304 bit

1.8 V

DATA RETENTION TIME @ 85 DEGREE CENTIGRADE

.00007 Amp

9.779 mm

FRAMs

Ferroelectric Random-Access Memories (or FRAMs), are a type of non-volatile memory technology that combines the advantages of both traditional dynamic random-access memory (DRAM) and non-volatile memory (NVRAM) technologies. FRAMs store data using a ferroelectric material, which has the unique property of being able to retain data even when the power is removed.

FRAMs are used in a variety of fields, including industrial automation, automotive systems, smart meters, and more, where their combination of non-volatility, speed, and endurance can be advantageous. While they may not be as prevalent as other memory types like Flash or DRAM, FRAMs offer a unique set of features that make them suitable for specific use cases.

Here are some key features and characteristics of FRAMs:

Non-Volatile: FRAMs are non-volatile, meaning they can retain data even when the power supply is turned off. This is in contrast to traditional DRAM, which is volatile and loses data when power is removed.

Fast Write Speeds: FRAMs offer very fast write speeds, comparable to DRAM. This makes them suitable for applications where high-speed write operations are required.

Low Power Consumption: FRAMs typically consume less power than other non-volatile memory technologies like Flash memory. This makes them suitable for battery-powered devices and applications where power efficiency is critical.

High Endurance: FRAMs have a high endurance, meaning they can withstand a large number of write cycles without degrading. This is in contrast to some Flash memory technologies that have limited write endurance.

Bit-Addressable: FRAMs are bit-addressable, which means you can read or write individual bits of data. This granularity is useful in applications where precise control over specific data is required.

Radiation Resistance: FRAMs are resistant to radiation, which makes them suitable for use in aerospace and other high-radiation environments.

Limited Density: One limitation of FRAM technology is that it has historically had lower storage density compared to other non-volatile memory technologies like Flash. However, advancements in FRAM technology have been made to increase storage capacity.