Infineon Technologies - CY15B108QN-50BKXQT

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CY15B108QN-50BKXQT by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number CY15B108QN-50BKXQT
Description FRAM; No. of Terminals: 24; Package Code: TBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; Serial Bus Type: SPI;
Datasheet CY15B108QN-50BKXQT Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .000305 Amp
Organization: 1MX8
Maximum Seated Height: 1.2 mm
Minimum Supply Voltage (Vsup): 1.8 V
Surface Mount: YES
Maximum Supply Current: 8 mA
No. of Terminals: 24
Maximum Clock Frequency (fCLK): 50 MHz
No. of Words: 1048576 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, THIN PROFILE
Write Protection: HARDWARE/SOFTWARE
Technology: CMOS
JESD-30 Code: R-PBGA-B24
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 105 Cel
Endurance: 100000000000000 Write/Erase Cycles
Package Code: TBGA
Width: 6 mm
Serial Bus Type: SPI
Memory Density: 8388608 bit
Minimum Standby Voltage: 1.8 V
Memory IC Type: FRAM
Minimum Operating Temperature: -40 Cel
Memory Width: 8
No. of Functions: 1
Package Equivalence Code: BGA24,5X5,40
Length: 8 mm
No. of Words Code: 1M
Nominal Supply Voltage / Vsup (V): 3.3
Additional Features: 2kv ESD available
Minimum Data Retention Time: 1
Parallel or Serial: SERIAL
Terminal Pitch: 1 mm
Maximum Supply Voltage (Vsup): 3.6 V
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