Infineon Technologies Flash Memory 2,400+

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Part RoHS Manufacturer Memory IC Type Temperature Grade No. of Terminals Package Code Package Shape Package Body Material Surface Mount No. of Functions Technology Screening Level Terminal Form Parallel or Serial Operating Mode Sector Size (Words) Maximum Supply Current No. of Words Input/Output Type Nominal Supply Voltage / Vsup (V) Mixed Memory Type Toggle Bit Power Supplies (V) Memory Width Package Style (Meter) Package Equivalence Code Alternate Memory Width Sub-Category Minimum Data Retention Time Terminal Pitch Maximum Operating Temperature Reverse Pinout Output Characteristics Organization No. of Words Code Minimum Operating Temperature No. of Sectors/Size Command User Interface Terminal Finish Ready or Busy Terminal Position No. of Ports Write Protection JESD-30 Code Moisture Sensitivity Level (MSL) Maximum Supply Voltage (Vsup) Maximum Seated Height Endurance Maximum Clock Frequency (fCLK) Width Qualification Maximum Write Cycle Time (tWC) Serial Bus Type Boot Block Memory Density Minimum Supply Voltage (Vsup) Additional Features Page Size (words) JESD-609 Code Maximum Time At Peak Reflow Temperature (s) Peak Reflow Temperature (C) Type Maximum Standby Current Length Common Flash Interface Maximum Access Time Programming Voltage (V) Data Polling

S29GL128S10TFV023

Infineon Technologies

FLASH

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

100 mA

16777216 words

3

YES

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

1

2

.5 mm

105 Cel

3-STATE

16MX8

16M

-40 Cel

128

YES

MATTE TIN

YES

DUAL

R-PDSO-G56

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

14 mm

BOTTOM/TOP

134217728 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e3

30

260

NAND TYPE

.0002 Amp

18.4 mm

YES

100 ns

3

YES

S29GL01GS11TFIV23

Infineon Technologies

FLASH

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

100 mA

134217728 words

3

YES

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

1

2

.5 mm

85 Cel

3-STATE

128MX8

128M

-40 Cel

1K

YES

MATTE TIN

YES

DUAL

R-PDSO-G56

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

14 mm

1073741824 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e3

NAND TYPE

.0001 Amp

18.4 mm

YES

110 ns

3

YES

S29GL01GS11TFA013

Infineon Technologies

FLASH

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

GULL WING

PARALLEL

ASYNCHRONOUS

128K

100 mA

134217728 words

3

YES

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

1

2

.5 mm

85 Cel

3-STATE

128MX8

128M

-40 Cel

1K

YES

YES

DUAL

R-PDSO-G56

3.6 V

1.2 mm

100000 Write/Erase Cycles

14 mm

1073741824 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

NAND TYPE

.0001 Amp

18.4 mm

YES

110 ns

3

YES

S29GL128S11TFVV10

Infineon Technologies

FLASH

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

100 mA

16777216 words

3

YES

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

1

2

.5 mm

105 Cel

3-STATE

16MX8

16M

-40 Cel

128

YES

MATTE TIN

YES

DUAL

R-PDSO-G56

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

14 mm

BOTTOM/TOP

134217728 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e3

30

260

NAND TYPE

.0002 Amp

18.4 mm

YES

110 ns

3

YES

S29GL128S90GHI023

Infineon Technologies

FLASH

56

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

16777216 words

3

YES

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA56,8X8,32

1

2

.8 mm

85 Cel

3-STATE

16MX8

16M

-40 Cel

128

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B56

3

3.6 V

1 mm

100000 Write/Erase Cycles

7 mm

BOTTOM/TOP

134217728 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e1

30

260

NAND TYPE

.0001 Amp

9 mm

YES

90 ns

3

YES

S29GL128S10DHV020

Infineon Technologies

FLASH

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

16777216 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

105 Cel

3-STATE

16MX8

16M

-40 Cel

128

YES

TIN SILVER COPPER

YES

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

9 mm

BOTTOM/TOP

134217728 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e1

30

260

NAND TYPE

.0002 Amp

9 mm

YES

100 ns

3

YES

S29GL01GS11FHB010

Infineon Technologies

FLASH

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

134217728 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

105 Cel

3-STATE

128MX8

128M

-40 Cel

1K

YES

YES

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

100000 Write/Erase Cycles

11 mm

1073741824 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

NAND TYPE

.0002 Amp

13 mm

YES

110 ns

3

YES

S29GL01GS11DHIV13

Infineon Technologies

FLASH

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

134217728 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

85 Cel

3-STATE

128MX8

128M

-40 Cel

1K

YES

TIN SILVER COPPER

YES

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

9 mm

1073741824 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e1

30

260

NAND TYPE

.0001 Amp

9 mm

YES

110 ns

3

YES

S29GL01GS10DHA010

Infineon Technologies

FLASH

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

134217728 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

85 Cel

3-STATE

128MX8

128M

-40 Cel

1K

YES

YES

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

100000 Write/Erase Cycles

9 mm

1073741824 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

NAND TYPE

.0001 Amp

9 mm

YES

100 ns

3

YES

S29GL512S12DHVV10

Infineon Technologies

FLASH

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

67108864 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

105 Cel

3-STATE

64MX8

64M

-40 Cel

512

YES

TIN SILVER COPPER

YES

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

9 mm

BOTTOM/TOP

536870912 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e1

30

260

NAND TYPE

.0002 Amp

9 mm

YES

120 ns

3

YES

S29GL01GS12TFVV13

Infineon Technologies

FLASH

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

100 mA

134217728 words

3

YES

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

1

2

.5 mm

105 Cel

3-STATE

128MX8

128M

-40 Cel

1K

YES

YES

DUAL

R-PDSO-G56

3.6 V

1.2 mm

100000 Write/Erase Cycles

14 mm

1073741824 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

NAND TYPE

.0002 Amp

18.4 mm

YES

120 ns

3

YES

S29GL128S90FAI020

Infineon Technologies

FLASH

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

16777216 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

85 Cel

3-STATE

16MX8

16M

-40 Cel

128

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

11 mm

BOTTOM/TOP

134217728 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e0

NAND TYPE

.0001 Amp

13 mm

YES

90 ns

3

YES

S29GL128S11FHVV20

Infineon Technologies

FLASH

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

16777216 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

105 Cel

3-STATE

16MX8

16M

-40 Cel

128

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

11 mm

BOTTOM/TOP

134217728 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e1

30

260

NAND TYPE

.0002 Amp

13 mm

YES

110 ns

3

YES

S29GL512S10TFA013

Infineon Technologies

FLASH

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

GULL WING

PARALLEL

ASYNCHRONOUS

128K

100 mA

67108864 words

3

YES

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

1

2

.5 mm

85 Cel

3-STATE

64MX8

64M

-40 Cel

512

YES

YES

DUAL

R-PDSO-G56

3.6 V

1.2 mm

100000 Write/Erase Cycles

14 mm

BOTTOM/TOP

536870912 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

NAND TYPE

.0001 Amp

18.4 mm

YES

100 ns

3

YES

S29GL01GS12DHVV10

Infineon Technologies

FLASH

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

134217728 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

105 Cel

3-STATE

128MX8

128M

-40 Cel

1K

YES

TIN SILVER COPPER

YES

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

9 mm

1073741824 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e1

30

260

NAND TYPE

.0002 Amp

9 mm

YES

120 ns

3

YES

S29GL512S11FHAV20

Infineon Technologies

FLASH

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

67108864 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

85 Cel

3-STATE

64MX8

64M

-40 Cel

512

YES

YES

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

100000 Write/Erase Cycles

11 mm

BOTTOM/TOP

536870912 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

NAND TYPE

.0001 Amp

13 mm

YES

110 ns

3

YES

S29GL01GS12FHBV10

Infineon Technologies

FLASH

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

134217728 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

105 Cel

3-STATE

128MX8

128M

-40 Cel

1K

YES

YES

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

100000 Write/Erase Cycles

11 mm

1073741824 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

NAND TYPE

.0002 Amp

13 mm

YES

120 ns

3

YES

S29GL128S11TFBV20

Infineon Technologies

FLASH

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

GULL WING

PARALLEL

ASYNCHRONOUS

128K

100 mA

16777216 words

3

YES

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

1

2

.5 mm

105 Cel

3-STATE

16MX8

16M

-40 Cel

128

YES

MATTE TIN

YES

DUAL

R-PDSO-G56

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

14 mm

BOTTOM/TOP

134217728 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e3

30

260

NAND TYPE

.0002 Amp

18.4 mm

YES

110 ns

3

YES

S29GL01GS11DHIV23

Infineon Technologies

FLASH

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

134217728 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

85 Cel

3-STATE

128MX8

128M

-40 Cel

1K

YES

TIN SILVER COPPER

YES

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

9 mm

1073741824 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e1

30

260

NAND TYPE

.0001 Amp

9 mm

YES

110 ns

3

YES

S29GL01GS11DHV010

Infineon Technologies

FLASH

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

134217728 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

105 Cel

3-STATE

128MX8

128M

-40 Cel

1K

YES

TIN SILVER COPPER

YES

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

9 mm

1073741824 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e1

30

260

NAND TYPE

.0002 Amp

9 mm

YES

110 ns

3

YES

S29GL01GS11TFAV20

Infineon Technologies

FLASH

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

GULL WING

PARALLEL

ASYNCHRONOUS

128K

100 mA

134217728 words

3

YES

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

1

2

.5 mm

85 Cel

3-STATE

128MX8

128M

-40 Cel

1K

YES

YES

DUAL

R-PDSO-G56

3.6 V

1.2 mm

100000 Write/Erase Cycles

14 mm

1073741824 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

NAND TYPE

.0001 Amp

18.4 mm

YES

110 ns

3

YES

S29GL512S12FHBV20

Infineon Technologies

FLASH

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

67108864 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

105 Cel

3-STATE

64MX8

64M

-40 Cel

512

YES

YES

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

100000 Write/Erase Cycles

11 mm

BOTTOM/TOP

536870912 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

NAND TYPE

.0002 Amp

13 mm

YES

120 ns

3

YES

S29GL01GS11DHB013

Infineon Technologies

FLASH

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

134217728 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

105 Cel

3-STATE

128MX8

128M

-40 Cel

1K

YES

TIN SILVER COPPER

YES

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

9 mm

1073741824 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e1

30

260

NAND TYPE

.0002 Amp

9 mm

YES

110 ns

3

YES

S29GL128S90TFA010

Infineon Technologies

FLASH

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

GULL WING

PARALLEL

ASYNCHRONOUS

128K

100 mA

16777216 words

3

YES

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

1

2

.5 mm

85 Cel

3-STATE

16MX8

16M

-40 Cel

128

YES

MATTE TIN

YES

DUAL

R-PDSO-G56

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

14 mm

BOTTOM/TOP

134217728 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e3

30

260

NAND TYPE

.0001 Amp

18.4 mm

YES

90 ns

3

YES

S29GL256S11DHVV13

Infineon Technologies

FLASH

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

33554432 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

105 Cel

3-STATE

32MX8

32M

-40 Cel

256

YES

TIN SILVER COPPER

YES

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

9 mm

268435456 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e1

30

260

NAND TYPE

.0002 Amp

9 mm

YES

110 ns

3

YES

S29GL512S10TFI023

Infineon Technologies

FLASH

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

100 mA

67108864 words

3

YES

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

1

2

.5 mm

85 Cel

3-STATE

64MX8

64M

-40 Cel

512

YES

MATTE TIN

YES

DUAL

R-PDSO-G56

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

14 mm

BOTTOM/TOP

536870912 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e3

NAND TYPE

.0001 Amp

18.4 mm

YES

100 ns

3

YES

S29GL128S11TFBV13

Infineon Technologies

FLASH

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

GULL WING

PARALLEL

ASYNCHRONOUS

128K

100 mA

16777216 words

3

YES

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

1

2

.5 mm

105 Cel

3-STATE

16MX8

16M

-40 Cel

128

YES

MATTE TIN

YES

DUAL

R-PDSO-G56

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

14 mm

BOTTOM/TOP

134217728 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e3

30

260

NAND TYPE

.0002 Amp

18.4 mm

YES

110 ns

3

YES

S29GL128S10FHIV23

Infineon Technologies

FLASH

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

16777216 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

85 Cel

3-STATE

16MX8

16M

-40 Cel

128

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

11 mm

BOTTOM/TOP

134217728 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e1

30

260

NAND TYPE

.0001 Amp

13 mm

YES

100 ns

3

YES

S29GL128S10FAIV20

Infineon Technologies

FLASH

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

16777216 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

85 Cel

3-STATE

16MX8

16M

-40 Cel

128

YES

YES

BOTTOM

R-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

11 mm

BOTTOM/TOP

134217728 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

NAND TYPE

.0001 Amp

13 mm

YES

100 ns

3

YES

S29GL128S10FHB023

Infineon Technologies

FLASH

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

16777216 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

105 Cel

3-STATE

16MX8

16M

-40 Cel

128

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

11 mm

BOTTOM/TOP

134217728 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e1

30

260

NAND TYPE

.0002 Amp

13 mm

YES

100 ns

3

YES

S29GL01GS11TFAV23

Infineon Technologies

FLASH

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

GULL WING

PARALLEL

ASYNCHRONOUS

128K

100 mA

134217728 words

3

YES

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

1

2

.5 mm

85 Cel

3-STATE

128MX8

128M

-40 Cel

1K

YES

YES

DUAL

R-PDSO-G56

3.6 V

1.2 mm

100000 Write/Erase Cycles

14 mm

1073741824 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

NAND TYPE

.0001 Amp

18.4 mm

YES

110 ns

3

YES

S29GL128S11TFVV20

Infineon Technologies

FLASH

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

100 mA

16777216 words

3

YES

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

1

2

.5 mm

105 Cel

3-STATE

16MX8

16M

-40 Cel

128

YES

MATTE TIN

YES

DUAL

R-PDSO-G56

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

14 mm

BOTTOM/TOP

134217728 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e3

30

260

NAND TYPE

.0002 Amp

18.4 mm

YES

110 ns

3

YES

S29GL512S10FHI023

Infineon Technologies

FLASH

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

67108864 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

85 Cel

3-STATE

64MX8

64M

-40 Cel

512

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

11 mm

BOTTOM/TOP

536870912 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e1

30

260

NAND TYPE

.0001 Amp

13 mm

YES

100 ns

3

YES

S29GL01GS11TFB020

Infineon Technologies

FLASH

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

GULL WING

PARALLEL

ASYNCHRONOUS

128K

100 mA

134217728 words

3

YES

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

1

2

.5 mm

105 Cel

3-STATE

128MX8

128M

-40 Cel

1K

YES

MATTE TIN

YES

DUAL

R-PDSO-G56

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

14 mm

1073741824 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e3

NAND TYPE

.0002 Amp

18.4 mm

YES

110 ns

3

YES

S29GL128S11FHBV10

Infineon Technologies

FLASH

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

16777216 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

105 Cel

3-STATE

16MX8

16M

-40 Cel

128

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

11 mm

BOTTOM/TOP

134217728 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e1

30

260

NAND TYPE

.0002 Amp

13 mm

YES

110 ns

3

YES

S29GL128S10DHV010

Infineon Technologies

FLASH

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

16777216 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

105 Cel

3-STATE

16MX8

16M

-40 Cel

128

YES

TIN SILVER COPPER

YES

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

9 mm

BOTTOM/TOP

134217728 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e1

30

260

NAND TYPE

.0002 Amp

9 mm

YES

100 ns

3

YES

S29GL512S12FHBV23

Infineon Technologies

FLASH

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

67108864 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

105 Cel

3-STATE

64MX8

64M

-40 Cel

512

YES

YES

BOTTOM

R-PBGA-B64

3.6 V

1.4 mm

100000 Write/Erase Cycles

11 mm

BOTTOM/TOP

536870912 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

NAND TYPE

.0002 Amp

13 mm

YES

120 ns

3

YES

S29GL256S90FHI010

Infineon Technologies

FLASH

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

33554432 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

85 Cel

3-STATE

32MX8

32M

-40 Cel

256

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

11 mm

268435456 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e1

30

260

NAND TYPE

.0001 Amp

13 mm

YES

90 ns

3

YES

S29GL128S10TFV013

Infineon Technologies

FLASH

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

100 mA

16777216 words

3

YES

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

1

2

.5 mm

105 Cel

3-STATE

16MX8

16M

-40 Cel

128

YES

MATTE TIN

YES

DUAL

R-PDSO-G56

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

14 mm

BOTTOM/TOP

134217728 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e3

30

260

NAND TYPE

.0002 Amp

18.4 mm

YES

100 ns

3

YES

S29GL256S10DHB010

Infineon Technologies

FLASH

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

33554432 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

105 Cel

3-STATE

32MX8

32M

-40 Cel

256

YES

YES

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

100000 Write/Erase Cycles

9 mm

268435456 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

NAND TYPE

.0002 Amp

9 mm

YES

100 ns

3

YES

S29GL256S11TFVV10

Infineon Technologies

FLASH

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

100 mA

33554432 words

3

YES

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

1

2

.5 mm

105 Cel

3-STATE

32MX8

32M

-40 Cel

256

YES

MATTE TIN

YES

DUAL

R-PDSO-G56

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

14 mm

268435456 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e3

NAND TYPE

.0002 Amp

18.4 mm

YES

110 ns

3

YES

S29GL256S90DHA013

Infineon Technologies

FLASH

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

33554432 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

85 Cel

3-STATE

32MX8

32M

-40 Cel

256

YES

YES

BOTTOM

S-PBGA-B64

3.6 V

1.4 mm

100000 Write/Erase Cycles

9 mm

268435456 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

NAND TYPE

.0001 Amp

9 mm

YES

90 ns

3

YES

S29GL256S10DHV023

Infineon Technologies

FLASH

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

33554432 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

105 Cel

3-STATE

32MX8

32M

-40 Cel

256

YES

TIN SILVER COPPER

YES

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

9 mm

268435456 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e1

30

260

NAND TYPE

.0002 Amp

9 mm

YES

100 ns

3

YES

S29GL128S90FAI013

Infineon Technologies

FLASH

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

16777216 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

85 Cel

3-STATE

16MX8

16M

-40 Cel

128

YES

TIN LEAD

YES

BOTTOM

R-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

11 mm

BOTTOM/TOP

134217728 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e0

NAND TYPE

.0001 Amp

13 mm

YES

90 ns

3

YES

S29GL512S11GHI010

Infineon Technologies

FLASH

56

VFBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

67108864 words

3

YES

8

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

BGA56,8X8,32

1

2

.8 mm

85 Cel

3-STATE

64MX8

64M

-40 Cel

512

YES

YES

BOTTOM

R-PBGA-B56

3.6 V

1 mm

100000 Write/Erase Cycles

7 mm

BOTTOM/TOP

536870912 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

NAND TYPE

.0001 Amp

9 mm

YES

110 ns

3

YES

S29GL128S11FHVV23

Infineon Technologies

FLASH

64

LBGA

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

16777216 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

105 Cel

3-STATE

16MX8

16M

-40 Cel

128

YES

TIN SILVER COPPER

YES

BOTTOM

R-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

11 mm

BOTTOM/TOP

134217728 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e1

30

260

NAND TYPE

.0002 Amp

13 mm

YES

110 ns

3

YES

S29GL256S10DHAV23

Infineon Technologies

FLASH

64

LBGA

SQUARE

PLASTIC/EPOXY

YES

1

CMOS

AEC-Q100; TS 16949

BALL

PARALLEL

ASYNCHRONOUS

128K

100 mA

33554432 words

3

YES

8

GRID ARRAY, LOW PROFILE

BGA64,8X8,40

1

2

1 mm

85 Cel

3-STATE

32MX8

32M

-40 Cel

256

YES

TIN SILVER COPPER

YES

BOTTOM

S-PBGA-B64

3

3.6 V

1.4 mm

100000 Write/Erase Cycles

9 mm

268435456 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e1

30

260

NAND TYPE

.0001 Amp

9 mm

YES

100 ns

3

YES

S29GL01GS10TFI023

Infineon Technologies

FLASH

56

TSSOP

RECTANGULAR

PLASTIC/EPOXY

YES

1

CMOS

GULL WING

PARALLEL

ASYNCHRONOUS

128K

100 mA

134217728 words

3

YES

8

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

TSSOP56,.8,20

1

2

.5 mm

85 Cel

3-STATE

128MX8

128M

-40 Cel

1K

YES

MATTE TIN

YES

DUAL

R-PDSO-G56

3

3.6 V

1.2 mm

100000 Write/Erase Cycles

14 mm

1073741824 bit

2.7 V

20 YEARS DATA RETENTION; 10000 ERASE/PROGRAM CYCLES

32

e3

NAND TYPE

.0001 Amp

18.4 mm

YES

100 ns

3

YES

Flash Memory

Flash memory is a type of non-volatile computer memory that is commonly used in digital devices such as USB drives, solid-state drives, and digital cameras. It is a type of EEPROM (Electrically Erasable Programmable Read-Only Memory) that allows data to be erased and reprogrammed in blocks instead of one byte at a time. Flash memory uses a floating gate transistor to store data, which allows it to retain information even when the power is turned off.

Flash memory is widely used in digital devices because of its high capacity, small size, and fast access times. It is also more durable than other types of memory, such as hard disk drives, because it has no moving parts. This makes it ideal for use in portable devices that may be subject to physical shock or vibration.

There are two types of flash memory: NOR flash and NAND flash. NOR flash is faster than NAND flash, but it has lower density and higher cost per bit. NOR flash is typically used for code storage, such as firmware or boot code, because it provides faster access times. NAND flash has higher density and lower cost per bit, which makes it ideal for data storage applications.

Flash memory has a limited lifespan, as it can only be erased and reprogrammed a limited number of times. This is because the process of erasing and reprogramming the memory causes wear and tear on the floating gate transistor. However, modern flash memory devices have a sophisticated wear-leveling algorithm that distributes writes evenly across the memory, which extends the lifespan of the device.