Xilinx - XC7Z045-2FF676E

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE;

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 404; Package Code: LFBGA; Package Shape: SQUARE;

XA7Z020-1CLG484Q by Xilinx is a MICROPROCESSOR CIRCUIT with 484 terminals in a GRID ARRAY package. Operating b/w -40 to 125 °C, it's AEC-Q100 compliant for AUTOMOTIVE use. Features include 1.8V power supply, 0.8mm terminal pitch, and TIN SILVER COPPER finish.

SYSTEM ON CHIP; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 441; Package Code: FBGA; Package Shape: SQUARE; Package Equivalence Code: BGA441,21X21,32;

PROGRAMMABLE SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

NXP Semiconductors' MIMXRT1173CVM8A is a low-profile, fine-pitch SoC with 289 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 1.1V to 1.15V. Ideal for applications requiring high-performance uPs and uCs in compact designs.

Microchip Technology's RN2903A-I/RMSA103 is a CMOS microprocessor circuit with 47 terminals and a rectangular package style. It operates b/w -40 to 85 °C, with a supply voltage range of 2.1V to 3.6V. Ideal for industrial applications requiring high-performance uPs/uCs & peripheral ICs in surface-mount assemblies.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE;

SoC;

Infineon's CY8C5268LTI-LP030 is an Industrial-grade PSoC with Nickel Palladium Gold finish. It can withstand peak reflow temp of 260°C for 30s. Ideal for various applications in Other Function uPs,uCs & Peripheral ICs due to MSL level of 3.

MICROPROCESSOR CIRCUIT; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 4; JESD-609 Code: e1; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Maximum Time At Peak Reflow Temperature (s): 30;

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

XCZU4EV-2FBVB900E by Xilinx is a CMOS microprocessor with 900 terminals in a grid array package. It operates b/w 0-100°C, with supply voltage range of 0.825-0.876 V. Ideal for applications requiring high-performance computing in compact form factors.

MSP430F6779IPZR by Texas Instruments is a 16-bit microprocessor with 524288 ROM words and 32 RAM words. Operating at a max frequency of 25 MHz, it's ideal for industrial applications requiring low power consumption and high performance. With I2C, SPI, and UART compatibility, this microprocessor offers versatile connectivity options in a compact FLATPACK package.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 529; Package Code: LFBGA; Package Shape: SQUARE;

W5300 by Wiznet is a 100-terminal IC with 3-3.6V supply voltage range, ideal for microprocessor circuits. Its CMOS technology and quad terminal position make it suitable for commercial extended temperature applications at up to 80°C. The package style is flatpack with low profile and fine pitch, making it surface-mountable in a compact 14x14mm square shape.

TMS320DM368ZCED by Texas Instruments is a 32-bit microprocessor with 8192 RAM words. Operating at temperatures from -40 to 85 °C, it supports I2C, SPI, UART, and USB buses. Ideal for industrial applications requiring a low-profile grid array package with a 0.65 mm terminal pitch.