Texas Instruments - MSP430F6779IPZR

XC7Z014S-2CLG484I by Xilinx is a System on Chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. This package, measuring 19mm x 19mm, features a grid array style and is ideal for various applications requiring low profile, fine pitch ICs.

Other uPs/uCs/Peripheral ICs;

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Length: 27 mm;

SYSTEM ON CHIP; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE;

Microchip ATECC508A-MAHDA-T is a cryptographic authenticator IC with 8 terminals, operating from -40 to 85°C. It supports supply voltage range of 2-5.5V and TS16949 screening level. Ideal for secure applications needing small outline, heat sink package style.

LTC4263IDE#PBF by Analog Devices is a MICROPROCESSOR CIRCUIT with 14 terminals, operating b/w -40 to 85 °C. It has a supply voltage range of 4.5-5.5 V and comes in a small outline package suitable for industrial applications requiring CMOS technology.

SYSTEM ON CHIP;

The NXP Semiconductors MIMXRT1021CAG4A is an SoC with a peak reflow temperature of 260°C and industrial-grade temperature tolerance. It has a max time at peak reflow temperature of 40s, making it suitable for applications requiring high-performance processing in harsh environments.

SLB9670XQ20FW785XUMA1 by Infineon: 32-terminal IC with CMOS tech, 1.65-1.95V supply, -40 to 85°C temp range. Ideal for industrial cryptographic authentication applications due to its compact square chip carrier package and low profile design.

Other uPs/uCs/Peripheral ICs; Terminal Finish: Matte Tin (Sn); JESD-609 Code: e3;

SoC; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Maximum Seated Height: .9 mm;

Xilinx XAZU7EV-1FBVB900Q is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates in automotive grade temperature range (-40 to 125 °C) and supports CAN, I2C, SPI, UART bus compatibility. The package has 900 terminals in a GRID ARRAY style suitable for surface mount applications.

SYSTEM ON CHIP; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

XCZU4EV-2SFVC784E by Xilinx is a rectangular, surface mount microprocessor circuit with 784 terminals. It operates on a supply voltage range of 0.825 V to 0.876 V and has a max operating temperature of 100°C. This IC is commonly used in various applications requiring high-performance computing and advanced processing capabilities.

AM6411BKCGHAALV by Texas Instruments is a System on Chip with 441 terminals in a grid array package. It operates b/w -40 to 105°C, with supply voltage ranging from 0.715 to 0.79 V. Ideal for applications requiring fine pitch and ball terminal form technology.

FT245RQ-TRAY by FTDI is a 32-terminal chip carrier with a square package shape. It operates b/w -40 to 85 °C, suitable for industrial use. With a terminal pitch of 0.5 mm, it is ideal for microprocessor circuits requiring supply voltage b/w 3.3 V to 5.25 V.

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;