Linear Technology - LTC4263IDE-1#PBF

CRYPTOGRAPHIC AUTHENTICATOR; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; JESD-30 Code: S-XQCC-N32;

MCP2221-I/SL by Microchip: 3.3-5.5V supply, -40 to 85°C temp range, CMOS tech for industrial use. Small outline package with 14 terminals ideal for microprocessor circuits and peripherals. Matte tin finish, dual position terminals in a compact rectangular shape.

SLM9670AQ20FW1311XTMA1 by Infineon is a 32-terminal IC with max supply voltage of 1.95V and min operating temp of -40°C. Ideal for cryptographic authentication applications due to its CMOS technology, quad terminal position, and compact square package style.

SoC;

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 289; Package Code: LFBGA; Package Shape: SQUARE;

The Xilinx XCZU2EG-1SBVA484I is a programmable SoC with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. With 484 terminals in a grid array package, it's ideal for industrial applications requiring high-performance processing capabilities.

CY8C6137BZI-F34 by Infineon is a 124-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7V to 3.6V. With a grid array package style, it's ideal for applications requiring fine pitch and thin profile designs.

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: .997 V;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

CY8C6247BZI-D54 by Infineon Technologies is a 124-terminal, programmable SoC with CMOS technology. It operates b/w -40 to 85 °C and has a supply voltage range of 1.7V to 3.6V, making it suitable for various applications requiring a compact GRID ARRAY package style.

ESP32-WROOM-32UE-H4 by Espressif Systems is a 38-terminal SoC with CMOS technology. It operates b/w -40 to 105°C, with supply voltage range of 3-3.6V. Ideal for IoT applications due to its compact size and surface mount capability.

MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

SoC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 486; Package Code: LFBGA; Package Shape: SQUARE;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B225;

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.24 mm;

PROGRAMMABLE SoC; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3;

SYSTEM ON CHIP;

XCZU9CG-1FFVB1156I by Xilinx is a MICROPROCESSOR CIRCUIT with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.825V to 0.876V. This GRID ARRAY package is ideal for industrial applications requiring high performance uPs/uCs.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE;