Intel - 5CSXFC6C6U23I7N

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: RECTANGULAR;

ESP32-C3-MINI-1U-H4 by Espressif Systems (Shanghai) is a 53-terminal SoC with max supply voltage of 3.6V and operating temp range from -40 to 105°C. Ideal for IoT applications due to its compact rectangular package style, CMOS technology, and low nominal voltage of 3.3V.

The Xilinx XC7Z010-1CLG400I is a System on Chip with 400 terminals, operating b/w -40 to 100 °C. It features a low profile grid array package style and CMOS technology, suitable for various applications requiring high performance in a compact form factor. With a supply voltage range of 0.95V to 1.05V, it is ideal for projects demanding efficient power consumption and advanced processing capabilities.

SYSTEM ON CHIP; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1156; Package Code: BGA; Package Shape: RECTANGULAR;

SoC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 250;

MCIMX6S7CVM08AD by NXP Semiconductors is a SYSTEM ON CHIP with 624 terminals, operating temperature range of -40 to 105 °C. It is used in industrial applications and has a package style of GRID ARRAY, LOW PROFILE, FINE PITCH.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 128; Package Code: LFQFP; Package Shape: RECTANGULAR;

SoC; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE;

SYSTEM ON CHIP; Terminal Form: BALL; No. of Terminals: 225; Package Code: LFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B225;

The Xilinx XC7Z020-2CLG484I is a System on Chip with CMOS technology. It operates b/w -40 to 100°C, with supply voltage ranging from 0.95V to 1.05V. Featuring a grid array package style, it is ideal for applications requiring low profile and fine pitch components in the Other Function uPs,uCs & Peripheral ICs category.

XC7Z035-1FFG900I by Xilinx is a programmable system on chip with CMOS technology. It operates b/w -40 to 100 °C and has a supply voltage range of 0.95V to 1.05V. With 900 terminals in a square grid array package, it's ideal for various applications requiring high-performance processing capabilities.

SoC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 624; Package Code: FBGA; Package Shape: SQUARE;

ATECC608B-SSHDA-T by Microchip Technology is a cryptographic authenticator IC with I2C bus compatibility. It operates b/w -40 to 85°C, has a supply voltage range of 2-5.5V, and comes in a small outline package suitable for industrial applications.

ATSHA204A-XHDA-T by Microchip Technology is a cryptographic authenticator IC with 8 terminals. It operates b/w -40 to 85°C, with supply voltage ranging from 2V to 5.5V. This small outline package is ideal for secure applications in automotive and industrial sectors.

PROGRAMMABLE SoC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

NRF52832-CIAA-R7 by Nordic Semiconductor Asa is a SoC with 56 terminals, operating from -40 to 85 °C. It has a supply voltage range of 1.7V to 3.6V and uses CMOS technology. This IC is suitable for applications requiring low-profile, fine-pitch components in plastic/epoxy packages.

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 71; Package Code: VFLGA; Package Shape: SQUARE;

MCIMX257CJM4A by NXP Semiconductors is a SYSTEM ON CHIP with 400 terminals, operating at -40 to 85 °C. It has a supply voltage range of 1.2/1.5V to 1.8/3.3V and uses CMOS technology. This low profile, fine pitch IC is ideal for industrial applications requiring high performance in a compact form factor.