Silicon Labs - SI4461-C2A-GMR

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LFBGA; Package Shape: SQUARE;

BGM113A256V2R by Silicon Labs is a telecom IC with 36 terminals, operating temperature range of -40 to 85°C. It has a nominal voltage of 3.3V and terminal pitch of 0.8mm. This surface-mount IC is ideal for industrial applications requiring compact microelectronic assemblies.

BT832F by Fanstel is a surface mount telecom IC with 40 terminals. It operates in an industrial temperature range of -40 to 85°C and has a data rate of 1 Mbps. This compact rectangular package is suitable for various telecom circuit applications.

TELECOM CIRCUIT;

TELECOM CIRCUIT; Temperature Grade: MILITARY; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 39; Package Shape: RECTANGULAR; Minimum Operating Temperature: -40 Cel;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 64; Package Code: VQCCN; Package Shape: SQUARE;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Package Code: DIP; Terminal Pitch: 2.54 mm; Minimum Operating Temperature: -40 Cel; Maximum Seated Height: 4.2 mm;

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 63; Package Code: QCCN; Package Shape: RECTANGULAR;

ESP32-WROOM-32U by Espressif Systems (Shanghai) is a surface-mount telecom IC with 38 terminals. It operates in industrial temperature range (-40 to 85°C) and has a nominal voltage of 3.3V. This rectangular microelectronic assembly, with no lead terminal form, is ideal for telecom circuit applications due to its compact size (18mm x 19.2mm) and high peak reflow temperature (260°C).

TELECOM CIRCUIT;

MRF24J40MAT-I/RM by Microchip: Telecom IC with 3.3V supply, 12 terminals, -40 to 85°C temp range. Ideal for industrial applications requiring reliable wireless communication in a compact MICROELECTRONIC ASSEMBLY package.

TCA8418RTWR by Texas Instruments is a 24-terminal telecom IC with a nominal voltage of 1.8V. It operates in industrial temperature range (-40 to 85°C) and features nickel palladium gold terminal finish. This square-shaped chip carrier is suitable for telecom circuit applications requiring very thin profile and surface mount compatibility.

SA616DK/01,118 by NXP Semiconductors is a telecom interface IC with 1 function. It has a small outline, low profile package style and operates at temperatures ranging from -40 to 85 °C. It is suitable for telecom circuit applications.

TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: XMA; Package Shape: RECTANGULAR;

NEO-M8Q-0 by U-blox Ag is a telecom IC with 24 terminals, operating at -40 to 85°C. With AEC-Q100 screening and TS 16949 certification, it's ideal for industrial applications requiring a 3V supply voltage. Its compact rectangular package measures 12.2mm x 16mm with a seated height of 2.6mm, making it suitable for space-constrained designs in automotive or telecommunications systems.

ADL5350ACPZ-R7 by Analog Devices is a telecom IC with 8 terminals, operating from -40 to 85°C. It has a small outline package style, matte tin finish, and no lead terminal form. Ideal for telecom circuits, it operates at 3V with a peak reflow temp of 260°C.

TELECOM CIRCUIT; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 2; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Time At Peak Reflow Temperature (s): 40;

TELECOM CIRCUIT; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Terminal Finish: Tin (Sn);

WL1801MODGBMOCT by Texas Instruments is a telecom IC with 100 terminals in a grid array package. It operates at -20 to 70°C, with a supply voltage of 3.7V and data rate of 100 Mbps. Ideal for telecom circuits, it has a compact rectangular shape and surface-mount capability.