National Semiconductor - SCANSTA112SM/NOPB

SCANSTA112SM/NOPB by National Semiconductor

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Manufacturer National Semiconductor
Manufacturer's Part Number SCANSTA112SM/NOPB
Description MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 100; Package Code: LFBGA; Package Shape: SQUARE;
Datasheet SCANSTA112SM/NOPB Datasheet
NAME DESCRIPTION
Minimum Supply Voltage: 3 V
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Maximum Time At Peak Reflow Temperature (s): 40
Maximum Seated Height: 1.5 mm
Sub-Category: Other Microprocessor ICs
Surface Mount: YES
Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals: 100
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B100
Package Shape: SQUARE
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: LFBGA
Width: 10 mm
Moisture Sensitivity Level (MSL): 4
Peripheral IC Type: MICROPROCESSOR CIRCUIT
Maximum Supply Voltage: 3.6 V
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA100,10X10,32
Length: 10 mm
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3.3
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