Samsung - KS58527E

  1. Home
  2. Samsung - KS58527E
KS58527E by Samsung

Image shown is a representation only.

Manufacturer Samsung
Manufacturer's Part Number KS58527E
Description Telephone Circuits; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 22; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet KS58527E Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Crystal Frequency (MHz): 3.58
Sub-Category: Telephone Circuits
Surface Mount: NO
Maximum Supply Current: .7 mA
Terminal Finish: Tin/Lead (Sn/Pb)
JESD-609 Code: e0
Minimum Operating Temperature: -20 Cel
No. of Terminals: 22
Qualification: Not Qualified
Package Equivalence Code: DIP22,.3
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: CMOS
JESD-30 Code: R-PDIP-T22
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 70 Cel
Package Code: DIP
Terminal Pitch: 2.54 mm
Temperature Grade: COMMERCIAL
Repertory: REPERTORY
Power Supplies (V): 2/6
Plant 5!
Your quote plants 5 trees.

Popular Products

Category Top Products

TEA1064B by NXP Semiconductors

TEA1064B

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
935008920112 by NXP Semiconductors

935008920112

NXP Semiconductors

TELEPHONE MULTIFUNCTION CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
PCD3344P/011 by NXP Semiconductors

PCD3344P/011

NXP Semiconductors

TELEPHONE DIALER CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR;
935263379112 by NXP Semiconductors

935263379112

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
EFG71891PD by STMicroelectronics

EFG71891PD

STMicroelectronics

TELEPHONE DIALER CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
ST3917AD by STMicroelectronics

ST3917AD

STMicroelectronics

TELEPHONE MULTIFUNCTION CIRCUIT; Temperature Grade: OTHER; Terminal Form: GULL WING; No. of Terminals: 28; Package Code: SOP; Package Shape: RECTANGULAR;
TEA7063FP by STMicroelectronics

TEA7063FP

STMicroelectronics

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
935079230112 by NXP Semiconductors

935079230112

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;
TC31020P by Toshiba

TC31020P

Toshiba

TELEPHONE DIALER CIRCUIT; Terminal Form: THROUGH-HOLE; No. of Terminals: 24; Package Code: DIP; Package Shape: RECTANGULAR; Package Style (Meter): IN-LINE;
TEA1111AUH/C1 by NXP Semiconductors

TEA1111AUH/C1

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: NO LEAD; No. of Terminals: 17; Package Code: DIE; Package Shape: RECTANGULAR;
PCD3311CPN by NXP Semiconductors

PCD3311CPN

NXP Semiconductors

TELEPHONE MULTIFUNCTION CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;
TEA1062T/C4 by NXP Semiconductors

TEA1062T/C4

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
KS58D19E by Samsung

KS58D19E

Samsung

Telephone Circuits; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 22; Package Code: DIP; Package Shape: RECTANGULAR;
TEA1111AUH by NXP Semiconductors

TEA1111AUH

NXP Semiconductors

TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: NO LEAD; No. of Terminals: 17; Package Code: DIE; Package Shape: RECTANGULAR;
TA31076F(ER) by Toshiba

TA31076F(ER)

Toshiba

TELEPHONE RINGER CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: SSOP; Package Shape: RECTANGULAR;
KA2428 by Samsung

KA2428

Samsung

TELEPHONE RINGER CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
TCM1512P by Texas Instruments

TCM1512P

Texas Instruments

Telephone Circuits; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
PCD3311CT-T by NXP Semiconductors

PCD3311CT-T

NXP Semiconductors

TELEPHONE MULTIFUNCTION CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
S1T8503X01-D0B0 by Samsung

S1T8503X01-D0B0

Samsung

TELEPHONE SPEECH CIRCUIT; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;
KS5806NA+ by Samsung

KS5806NA+

Samsung

Telephone Circuits; Temperature Grade: OTHER; Terminal Form: THROUGH-HOLE; No. of Terminals: 18; Package Code: DIP; Package Shape: RECTANGULAR;