NXP Semiconductors - TEA1064B

TEA1064B by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number TEA1064B
Description TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: THROUGH-HOLE; No. of Terminals: 20; Package Code: DIP; Package Shape: RECTANGULAR;
Datasheet TEA1064B Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 2.7 V
Maximum Seated Height: 4.2 mm
Sub-Category: Telephone Circuits
Surface Mount: NO
Maximum Supply Current: .0016 mA
No. of Terminals: 20
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: BIPOLAR
JESD-30 Code: R-PDIP-T20
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 75 Cel
Package Code: DIP
Width: 7.62 mm
Telecom IC Type: TELEPHONE SPEECH CIRCUIT
Minimum Operating Temperature: -25 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: DIP20,.3
Length: 26.73 mm
Terminal Pitch: 2.54 mm
Temperature Grade: COMMERCIAL EXTENDED
Power Supplies (V): 2.7
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