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| Manufacturer | Samsung |
|---|---|
| Manufacturer's Part Number | K3N3C1000D-DC100 |
| Description | MASK ROM; Temperature Grade: COMMERCIAL; No. of Terminals: 40; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY; |
| Datasheet | K3N3C1000D-DC100 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Organization: | 256KX16 |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | 5.08 mm |
| Minimum Supply Voltage (Vsup): | 4.5 V |
| Surface Mount: | NO |
| No. of Terminals: | 40 |
| No. of Words: | 262144 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Technology: | CMOS |
| JESD-30 Code: | R-PDIP-T40 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | DIP |
| Width: | 15.24 mm |
| Memory Density: | 4194304 bit |
| Memory IC Type: | MASK ROM |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 16 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Alternate Memory Width: | 8 |
| Length: | 52.43 mm |
| Maximum Access Time: | 100 ns |
| No. of Words Code: | 256K |
| Nominal Supply Voltage / Vsup (V): | 5 |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | COMMERCIAL |
| Maximum Supply Voltage (Vsup): | 5.5 V |
