NXP Semiconductors - TEA1112TD-T

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TEA1112TD-T by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number TEA1112TD-T
Description TELEPHONE SPEECH CIRCUIT; Temperature Grade: COMMERCIAL EXTENDED; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
Datasheet TEA1112TD-T Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 2.9 V
Maximum Seated Height: 1.75 mm
Sub-Category: Telephone Circuits
Surface Mount: YES
Maximum Supply Current: .0014 mA
No. of Terminals: 16
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
Technology: BIPOLAR
JESD-30 Code: R-PDSO-G16
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 75 Cel
Package Code: SOP
Width: 3.9 mm
Telecom IC Type: TELEPHONE SPEECH CIRCUIT
Minimum Operating Temperature: -25 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: SOP16,.25
Length: 9.9 mm
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL EXTENDED
Power Supplies (V): 2.9
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