NXP Semiconductors - SPC5200CVR400BR2

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 324; Package Code: TFBGA; Package Shape: SQUARE; No. of External Interrupts: 1;

MICROPROCESSOR, RISC; Terminal Finish: TIN SILVER COPPER; Technology: CMOS; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: TFBGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;

MCIMX537CVV8C by NXP Semiconductors is a microprocessor with 32-bit architecture, 26-bit address bus width, and integrated cache. Ideal for automotive applications, it features a max clock frequency of 27 MHz and low power mode support. With a package style of grid array and fine pitch, this processor offers compatibility with various bus interfaces like CAN, Ethernet, I2C, SPI, UART, and USB.

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE;

MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 668; Package Code: HBGA; Package Shape: SQUARE; Surface Mount: YES;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE;

The Freescale Semiconductor KMPC852TVR100A microprocessor features a 32-bit address and external data bus width, with a max clock frequency of 66 MHz. It is designed for low power mode applications, with integrated cache and boundary scan capabilities. Ideal for use in embedded systems requiring high-speed processing within a compact form factor.

MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 1170; Package Code: BGA; Package Shape: RECTANGULAR; Bit Size: 64;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;

MICROPROCESSOR; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e2;

AM3358BZCZ60 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for low power applications like IoT devices due to its low supply voltage range of 0.95-1.1 V and boundary scan feature.

MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 245; JESD-609 Code: e1; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu); Maximum Time At Peak Reflow Temperature (s): 30;

The NXP Semiconductors LX2160XC72232B microprocessor features a 64-bit architecture with 128 external data bus width and integrated cache. It is designed for industrial applications, offering low power mode and operating temperature range from -40 to 105°C. With 1517 terminals in a grid array package style, it supports boundary scan and RISC technology for efficient performance.

AM3351BZCE30R by Texas Instruments is a 32-bit microprocessor with integrated cache and a max clock frequency of 26 MHz. It is commonly used in applications requiring low power mode, such as embedded systems and IoT devices.

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LBGA; Package Shape: SQUARE;