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| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer's Part Number | MCIMX537CVV8C |
| Description | MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE; |
| Datasheet | MCIMX537CVV8C Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .9 V |
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | .95 V |
| Integrated Cache: | YES |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Maximum Seated Height: | 1.85 mm |
| Surface Mount: | YES |
| Maximum Supply Current: | 1450 mA |
| Terminal Finish: | TIN SILVER |
| No. of Terminals: | 529 |
| No. of Serial I/Os: | 2 |
| Terminal Position: | BOTTOM |
| Format: | FLOATING POINT |
| Package Style (Meter): | GRID ARRAY, FINE PITCH |
| No. of I/O Lines: | 19 |
| Address Bus Width: | 26 |
| Technology: | CMOS |
| RAM Words: | 73728 |
| JESD-30 Code: | S-PBGA-B529 |
| Maximum Clock Frequency: | 27 MHz |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | FBGA |
| Width: | 19 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Speed: | 800 rpm |
| Peripheral IC Type: | MICROPROCESSOR, RISC |
| Maximum Supply Voltage: | 1.15 V |
| Low Power Mode: | YES |
| Boundary Scan: | YES |
| External Data Bus Width: | 32 |
| Bit Size: | 32 |
| JESD-609 Code: | e2 |
| Minimum Operating Temperature: | -40 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA529,23X23,32 |
| Length: | 19 mm |
| Additional Features: | 1.1V NOMIVAL AVAILABLE WITH 800MHZ |
| Peak Reflow Temperature (C): | 260 |
| Bus Compatibility: | CAN; ETHERNET; I2C; I2S; IRDA; RS-232; SPI; UART; USB |
| Terminal Pitch: | .8 mm |
| Temperature Grade: | AUTOMOTIVE |
