NXP Semiconductors - SE556F

SE556F by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SE556F
Description PULSE; Temperature Grade: MILITARY; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Datasheet SE556F Datasheet
NAME DESCRIPTION
Package Body Material: CERAMIC, GLASS-SEALED
Width (mm): 7.62 mm
Maximum Seated Height: 5.08 mm
Minimum Supply Voltage (Vsup): 4.5 V
Maximum Supply Current (Isup): 24 mA
Surface Mount: NO
Minimum Operating Temperature: -55 Cel
No. of Functions: 2
No. of Terminals: 14
Qualification: Not Qualified
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Other IC type: PULSE
Length: 19.535 mm
Technology: BIPOLAR
JESD-30 Code: R-GDIP-T14
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 125 Cel
Package Code: DIP
Nominal Supply Voltage (Vsup): 5 V
Terminal Pitch: 2.54 mm
Temperature Grade: MILITARY
Maximum Supply Voltage (Vsup): 18 V
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