NXP Semiconductors - SE555CN

SE555CN by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SE555CN
Description SQUARE; Temperature Grade: MILITARY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Datasheet SE555CN Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Width (mm): 7.62 mm
Maximum Seated Height: 4.2 mm
Minimum Supply Voltage (Vsup): 4.5 V
Sub-Category: Analog Waveform Generation Functions
Surface Mount: NO
No. of Terminals: 8
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Technology: BIPOLAR
JESD-30 Code: R-PDIP-T8
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 125 Cel
Package Code: DIP
Nominal Supply Voltage (Vsup): 5 V
Minimum Operating Temperature: -55 Cel
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: DIP8,.3
Other IC type: SQUARE
Length: 9.5 mm
Terminal Pitch: 2.54 mm
Temperature Grade: MILITARY
Maximum Supply Voltage (Vsup): 16 V
Power Supplies (V): 5/15
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