NXP Semiconductors - SE555FE883B

SE555FE883B by NXP Semiconductors

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Manufacturer NXP Semiconductors
Manufacturer's Part Number SE555FE883B
Description SQUARE; Temperature Grade: MILITARY; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
Datasheet SE555FE883B Datasheet
NAME DESCRIPTION
Package Body Material: CERAMIC, GLASS-SEALED
Width (mm): 7.62 mm
Maximum Seated Height: 5.08 mm
Minimum Supply Voltage (Vsup): 4.5 V
Surface Mount: NO
Minimum Operating Temperature: -55 Cel
No. of Functions: 1
No. of Terminals: 8
Qualification: Not Qualified
Terminal Position: DUAL
Package Style (Meter): IN-LINE
Other IC type: SQUARE
Screening Level: MIL-STD-883 Class B
Length: 9.955 mm
JESD-30 Code: R-GDIP-T8
Package Shape: RECTANGULAR
Terminal Form: THROUGH-HOLE
Maximum Operating Temperature: 125 Cel
Package Code: DIP
Terminal Pitch: 2.54 mm
Temperature Grade: MILITARY
Maximum Supply Voltage (Vsup): 18 V
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